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    • 7. 发明授权
    • Rotor rotating angle limiter
    • 转子旋转角度限制器
    • US4751986A
    • 1988-06-21
    • US878847
    • 1986-06-26
    • Ryo Takahashi
    • Ryo Takahashi
    • G01N23/04A61B6/03A61B6/10B23Q16/00B23Q16/02G01T1/161G05G1/00G05G5/04F16D63/00
    • B23Q16/021A61B6/105B23Q16/004G05G5/04
    • A rotor rotating angle limiter in this invention which can set the rotating angle of a rotor to more than one revolution but to less than two revolutions, and is simple in construction and highly reliable, a feature of which is that it consists of rotor (1) whose circumference is circular, stator (3) having a concentric circular arc circumference facing said rotor with a gap between them, a projection having a shorter length than the gap and also installed on the circumference of the rotor facing the stator, two projections installed on the circumference of the stator facing the rotor, having a shorter length than the gap and arranged apart along the circumference of the stator circular arc outside of the orbit of the projection on the rotor, and a rolling element which is inserted between the two projections on the stator and into the gap so that it can cross the orbit of the projection on the rotor and is also movable along the gap.
    • PCT No.PCT / JP85 / 00583 Sec。 371日期1986年6月26日第 102(e)日期1986年6月26日PCT提交1985年10月17日PCT公布。 公开号WO86 / 02251 日本1986年4月24日。本发明中的转子旋转角度限制器,其可将转子的旋转角度设定为大于1转,但小于2转,结构简单,可靠性高,其特征在于 它由周长为圆形的转子(1)组成,定子(3)具有面向所述转子的同心圆弧圆周,在它们之间具有间隙,具有比间隙更短的突起并且还安装在转子的圆周上 面向定子的两个突起安装在定子面向转子的圆周上,具有比间隙更短的长度,并且沿着转子上的突起的轨道外部的定子圆弧的圆周分开布置,以及滚动元件 其插入在定子上的两个突起之间并进入间隙中,使得其可以跨过转子上的突起的轨道,并且还可沿着间隙移动。
    • 10. 发明授权
    • Manufacturing method of semiconductor device
    • 半导体器件的制造方法
    • US08361876B2
    • 2013-01-29
    • US12703252
    • 2010-02-10
    • Toshiyuki IshimaruKenji TakeoRyo Takahashi
    • Toshiyuki IshimaruKenji TakeoRyo Takahashi
    • H01L21/76G01B11/00
    • H01L27/14687G03F9/708G03F9/7084H01L27/14689
    • A manufacturing method of a semiconductor device includes the steps of: forming first and second alignment marks by forming first and second alignment mark grooves on a first surface of a semiconductor substrate and filling the grooves with a material different from the semiconductor substrate; forming a first element on the first surface in alignment using the first alignment mark; bonding a support substrate to the first surface; reversing a bonded structure of the support substrate and the semiconductor substrate around a predetermined axis and thinning the semiconductor substrate from a second surface side of the semiconductor substrate at least until a thickness with which a position of the second alignment mark is detected by reflected light obtained by application of alignment light from the second surface side of the semiconductor substrate is obtained; and forming a second element on the second surface in alignment using the second alignment mark.
    • 半导体器件的制造方法包括以下步骤:通过在半导体衬底的第一表面上形成第一和第二对准标记槽并用不同于半导体衬底的材料填充槽来形成第一和第二对准标记; 使用第一对准标记在对准中在第一表面上形成第一元件; 将支撑基板接合到第一表面; 使支撑衬底和半导体衬底的键合结构绕预定轴线反转,并从半导体衬底的第二表面侧使半导体衬底变薄至少直到通过反射光检测到第二对准标记的位置的厚度 通过施加来自半导体基板的第二表面侧的对准光获得; 以及使用第二对准标记在对准中在第二表面上形成第二元件。