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1. 发明申请

US20090315057A1 LIGHT-EMITTING APPARATUS, SURFACE LIGHT SOURCE, AND METHOD FOR MANUFACTURING PACKAGE FOR LIGHT-EMITTING APPARATUS 有权
标题翻译：发光装置，表面光源和制造用于发光装置的包装的方法
公开(公告)号：US20090315057A1
公开(公告)日：2009-12-24
申请号：US12490192
申请日：2009-06-23
申请人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00 , H01L21/60
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译：本发明的发光装置具有：（i）朝向比基板高的位置发光的半导体装置，（ii）多个外部连接端子，具有：设置在基板上的光反射层，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。

2. 发明授权

US08680546B2 Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus 有权
标题翻译：发光装置，面光源，以及制造发光装置用封装的方法
公开(公告)号：US08680546B2
公开(公告)日：2014-03-25
申请号：US12490192
申请日：2009-06-23
申请人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
发明人： Masahiro Konishi , Masaki Kondo , Takaaki Horio , Takanobu Matsuo , Toshio Hata , Kiyohisa Ohta
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , F21K9/23 , F21Y2101/00 , F21Y2115/10 , H01L24/97 , H01L25/0753 , H01L33/46 , H01L33/50 , H01L33/56 , H01L33/60 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus of the present invention has (i) a semiconductor device which emits light toward a higher position than a substrate and (ii) a plurality of external connection terminals, and includes: a light-reflecting layer, provided on the substrate, which reflects the light emitted by the semiconductor device; and a covering layer which covers at least the light-reflecting layer and which transmits the light reflected by the light-reflecting layer. Further, the semiconductor device is provided on the covering layer, and is electrically connected to the external connection terminals via connecting portions, and the semiconductor device and the connecting portions are sealed with a sealing resin so as to be covered. Therefore, the light-emitting apparatus has increased efficiency with which light is taken out, and can prevent a reflecting layer from being altered, deteriorating, and decreasing in reflectance.
摘要翻译：本发明的发光装置具有：（i）朝向比基板高的位置发光的半导体装置，（ii）多个外部连接端子，具有：设置在基板上的光反射层，其反映由半导体器件发射的光; 以及至少覆盖所述光反射层并透射由所述光反射层反射的光的覆盖层。此外，半导体器件设置在覆盖层上，并且经由连接部分电连接到外部连接端子，半导体器件和连接部分用密封树脂密封以被覆盖。因此，发光装置具有提高光线的效率，能够防止反射层的变化，劣化，反射率的降低。

3. 发明申请

US20140339594A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：US20140339594A1
公开(公告)日：2014-11-20
申请号：US14245974
申请日：2014-04-04
申请人： Masahiro Konishi , Makoto Agatani , Toshio Hata
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H01L33/62 , H01L33/36
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
摘要翻译：通过使用包括绝缘基板和形成在绝缘基板上的发光单元的发光装置，发光单元包括：彼此平行地布置在绝缘基板上的多个线性布线图案，多个发光元件安装在布线图案之间，同时电连接到布线图案，以及用于密封发光元件的密封构件及其制造方法，可以提供实现足够的电绝缘的发光器件并且具有简单的制造工艺，从而可以以低成本制造它们及其制造方法。

4. 发明授权

US07843131B2 Light emitting device and method for manufacturing the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US07843131B2
公开(公告)日：2010-11-30
申请号：US12049690
申请日：2008-03-17
申请人： Masahiro Konishi , Makoto Agatani , Toshio Hata
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： H01J1/62
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
摘要翻译：通过使用包括绝缘基板和形成在绝缘基板上的发光单元的发光装置，发光单元包括：彼此平行地布置在绝缘基板上的多个线性布线图案，多个发光元件安装在布线图案之间，同时电连接到布线图案，以及用于密封发光元件的密封构件及其制造方法，可以提供实现足够的电绝缘的发光器件并且具有简单的制造工艺，从而可以以低成本制造它们及其制造方法。

5. 发明授权

US08421088B2 Surface mounting type light emitting diode 有权
标题翻译：表面贴装型发光二极管
公开(公告)号：US08421088B2
公开(公告)日：2013-04-16
申请号：US12035320
申请日：2008-02-21
申请人： Masahiro Konishi , Toshio Hata , Taiji Morimoto
发明人： Masahiro Konishi , Toshio Hata , Taiji Morimoto
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/644 , H01L2224/48091 , H01L2924/00014
摘要： This invention provides a surface mounting type light emitting diode excellent in heat radiation performance, reliability and productivity. The surface mounting type light emitting diode includes an insulating base member, a semiconductor light emitting element having a bottom face fixedly bonded to a top face of the base member, and a metallic reflector joined to the top face of the base member with a heat conduction type adhesive sheet interposed therebetween, to surround the semiconductor light emitting element. Heat generated from the semiconductor light emitting element is transferred to the reflector via the base member and the heat conduction type adhesive sheet, and then is radiated to the outside. The metallic reflector can efficiently radiate the heat to the outside. The cutting margin provided for the reflector facilitates a dicing process, which improves productivity.
摘要翻译：本发明提供了散热性能，可靠性和生产率优异的表面安装型发光二极管。表面安装型发光二极管包括绝缘基底构件，具有固定地接合到基底构件的顶面的底面的半导体发光元件和与基底构件的顶面接合的金属反射体，具有热传导以夹持半导体发光元件。从半导体发光元件产生的热量经由基底部件和导热型粘合片传递到反射体，然后被照射到外部。金属反射器可以有效地将热量辐射到外部。为反射器提供的切割边缘有助于切割过程，从而提高生产率。

6. 发明申请

US20080203416A1 SURFACE MOUNTING TYPE LIGHT EMITTING DIODE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：表面安装型发光二极管及其制造方法
公开(公告)号：US20080203416A1
公开(公告)日：2008-08-28
申请号：US12035216
申请日：2008-02-21
申请人： Masahiro KONISHI , Toshio Hata , Taiji Morimoto
发明人： Masahiro KONISHI , Toshio Hata , Taiji Morimoto
IPC分类号： H01L21/00 , H01L33/00
CPC分类号： H01L33/644 , H01L33/486 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014
摘要： This invention provides a surface mounting type light emitting diode excellent in heat radiation performance, reliability and productivity. The surface mounting type light emitting diode includes a metallic base member, a semiconductor light emitting element having a bottom face fixedly bonded to a top face of the base member, and a metallic reflector joined to the top face of the base member with a heat conduction type adhesive sheet interposed therebetween, to surround the semiconductor light emitting element. Heat generated from the semiconductor light emitting element is transferred to the reflector via the base member and the heat conduction type adhesive sheet, and then is radiated to the outside. The metallic reflector can efficiently radiate the heat to the outside. The cutting margin provided for the reflector facilitates a dicing process, which improves productivity.
摘要翻译：本发明提供了散热性能，可靠性和生产率优异的表面安装型发光二极管。表面安装型发光二极管包括金属基底构件，具有固定地接合到基底构件的顶面的底面的半导体发光元件和与基底构件的顶面接合的金属反射体，其具有热传导以夹持半导体发光元件。从半导体发光元件产生的热量经由基底部件和导热型粘合片传递到反射体，然后被照射到外部。金属反射器可以有效地将热量辐射到外部。为反射器提供的切割边缘有助于切割过程，从而提高生产率。

7. 发明申请

US20110044029A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20110044029A1
公开(公告)日：2011-02-24
申请号：US12916048
申请日：2010-10-29
申请人： Masahiro Konishi , Makoto Agatani , Toshio Hata
发明人： Masahiro Konishi , Makoto Agatani , Toshio Hata
IPC分类号： G02F1/13357 , F21S4/00
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
摘要翻译：通过使用包括绝缘基板和形成在绝缘基板上的发光单元的发光装置，发光单元包括：彼此平行地布置在绝缘基板上的多个线性布线图案，多个发光元件安装在布线图案之间，同时电连接到布线图案，以及用于密封发光元件的密封构件及其制造方法，可以提供实现足够的电绝缘的发光器件并且具有简单的制造工艺，从而可以以低成本制造它们及其制造方法。

8. 发明授权

US07872418B2 Light emitting device and method for manufacturing the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US07872418B2
公开(公告)日：2011-01-18
申请号：US12051602
申请日：2008-03-19
申请人： Toshio Hata , Masahiro Konishi , Makoto Agatani , Taiji Morimoto
发明人： Toshio Hata , Masahiro Konishi , Makoto Agatani , Taiji Morimoto
IPC分类号： H01L33/00
CPC分类号： H01B1/10 , F21K9/232 , F21Y2115/10 , H01L24/45 , H01L24/73 , H01L25/0753 , H01L33/50 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/01015 , H01L2924/0102 , H01L2924/01047 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including a substrate and a light emitting unit, the light emitting unit including: a plurality of light emitting elements that are mounted on substrate and electrically connected to external electrodes; a first sealing member layer containing a first fluorescent material, formed to cover light emitting elements; and a second sealing member layer containing a second fluorescent material, formed on first sealing member layer, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device capable of suppressing color shifts and the like by the fluorescent materials, and of being easily manufactured, as well as a method for manufacturing the same.
摘要翻译：通过使用包括基板和发光单元的发光装置，所述发光单元包括：多个发光元件，其安装在基板上并电连接到外部电极; 包含形成为覆盖发光元件的第一荧光材料的第一密封元件层; 以及形成在第一密封部件层上的包含第二荧光材料的第二密封部件层及其制造方法，能够提供能够抑制荧光材料的色移等的发光元件，并且易于制造，以及其制造方法。

9. 发明申请

US20080224608A1 LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US20080224608A1
公开(公告)日：2008-09-18
申请号：US12049690
申请日：2008-03-17
申请人： Masahiro KONISHI , Makoto Agatani , Toshio Hata
发明人： Masahiro KONISHI , Makoto Agatani , Toshio Hata
IPC分类号： H01J1/02 , H01J9/02
CPC分类号： H01L33/502 , F21K9/00 , F21K9/20 , F21K9/232 , F21V23/002 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L24/45 , H01L25/0753 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45169 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2924/01015 , H01L2924/01047 , H01L2924/01068 , H01L2924/01087 , H01L2924/09701 , H01L2924/12041 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： By using a light emitting device including an insulating substrate and a light emitting unit formed on the insulating substrate, the light emitting unit including: a plurality of linear wiring patterns disposed on the insulating substrate in parallel with one another, a plurality of light emitting elements that are mounted between the wiring patterns while being electrically connected to the wiring patterns, and a sealing member for sealing the light emitting elements, as well as a method for manufacturing thereof, it becomes possible to provide a light emitting device that achieves sufficient electrical insulation and has simple manufacturing processes so that it can be manufactured at a low cost, and a method for manufacturing the same.
摘要翻译：通过使用包括绝缘基板和形成在绝缘基板上的发光单元的发光装置，发光单元包括：彼此平行地布置在绝缘基板上的多个线性布线图案，多个发光元件安装在布线图案之间，同时电连接到布线图案，以及用于密封发光元件的密封构件及其制造方法，可以提供实现足够的电绝缘的发光器件并且具有简单的制造工艺，从而可以以低成本制造它们及其制造方法。

10. 发明授权

US08604506B2 Surface mounting type light emitting diode and method for manufacturing the same 有权
标题翻译：表面安装型发光二极管及其制造方法
公开(公告)号：US08604506B2
公开(公告)日：2013-12-10
申请号：US12035216
申请日：2008-02-21
申请人： Masahiro Konishi , Toshio Hata , Taiji Morimoto
发明人： Masahiro Konishi , Toshio Hata , Taiji Morimoto
IPC分类号： H01L33/00
CPC分类号： H01L33/644 , H01L33/486 , H01L33/60 , H01L33/647 , H01L2224/48091 , H01L2224/8592 , H01L2924/00014
摘要： This invention provides a surface mounting type light emitting diode excellent in heat radiation performance, reliability and productivity. The surface mounting type light emitting diode includes a metallic base member, a semiconductor light emitting element having a bottom face fixedly bonded to a top face of the base member, and a metallic reflector joined to the top face of the base member with a heat conduction type adhesive sheet interposed therebetween, to surround the semiconductor light emitting element. Heat generated from the semiconductor light emitting element is transferred to the reflector via the base member and the heat conduction type adhesive sheet, and then is radiated to the outside. The metallic reflector can efficiently radiate the heat to the outside. The cutting margin provided for the reflector facilitates a dicing process, which improves productivity.
摘要翻译：本发明提供了散热性能，可靠性和生产率优异的表面安装型发光二极管。表面安装型发光二极管包括金属基底构件，具有固定地接合到基底构件的顶面的底面的半导体发光元件和与基底构件的顶面接合的金属反射体，其具有热传导以夹持半导体发光元件。从半导体发光元件产生的热量经由基底部件和导热型粘合片传递到反射体，然后被照射到外部。金属反射器可以有效地将热量辐射到外部。为反射器提供的切割边缘有助于切割过程，从而提高生产率。

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