专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20060062979A1 Circuit board and a power module employing the same 失效
标题翻译：电路板和采用该电路板的电源模块
公开(公告)号：US20060062979A1
公开(公告)日：2006-03-23
申请号：US11270202
申请日：2005-11-09
申请人： Masahiro Hara , Hideyo Osanai
发明人： Masahiro Hara , Hideyo Osanai
IPC分类号： B32B3/00 , B44C1/22
CPC分类号： H05K3/043 , H05K1/0306 , H05K3/061 , H05K2201/09845 , H05K2203/0369 , H05K2203/1476 , Y10T29/49156 , Y10T428/24917
摘要： A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a lower part of adjacent elements of the pattern on the metal layer which is in contact with the insulator is not greater than the thickness of the metal layer. Also a power module containing such circuit board.
摘要翻译：一种包含绝缘体基板和具有图案的金属层的金属 - 绝缘体复合构件的电路板，所述复合构件具有区域，所述金属 - 绝缘体复合构件的金属层上与图案接触的图案的相邻元件的下部之间的间隔绝缘体不大于金属层的厚度。还有一个包含这种电路板的电源模块。

2. 发明授权

US07368665B2 Circuit board and a power module employing the same 失效
标题翻译：电路板和采用该电路板的电源模块
公开(公告)号：US07368665B2
公开(公告)日：2008-05-06
申请号：US11270202
申请日：2005-11-09
申请人： Masahiro Hara , Hideyo Osanai
发明人： Masahiro Hara , Hideyo Osanai
IPC分类号： H05K1/03
CPC分类号： H05K3/043 , H05K1/0306 , H05K3/061 , H05K2201/09845 , H05K2203/0369 , H05K2203/1476 , Y10T29/49156 , Y10T428/24917
摘要： A circuit board containing a metal-insulator composite member including an insulator substrate and a metal layer having a pattern, the composite member having an area where the spacing between a lower part of adjacent elements of the pattern on the metal layer which is in contact with the insulator is not greater than the thickness of the metal layer. Also a power module containing such circuit board.
摘要翻译：一种包含绝缘体基板和具有图案的金属层的金属 - 绝缘体复合构件的电路板，所述复合构件具有区域，所述金属 - 绝缘体复合构件的金属层上与图案接触的图案的相邻元件的下部之间的间隔绝缘体不大于金属层的厚度。还有一个包含这种电路板的电源模块。

3. 发明授权

US07008549B2 Circuit board, process for producing the same and a power module employing the same 有权
标题翻译：电路板，其制造方法和使用该电路板的功率模块
公开(公告)号：US07008549B2
公开(公告)日：2006-03-07
申请号：US10768857
申请日：2004-01-29
申请人： Masahiro Hara , Hideyo Osanai
发明人： Masahiro Hara , Hideyo Osanai
IPC分类号： H01B13/00 , H05K3/02
CPC分类号： H05K3/043 , H05K1/0306 , H05K3/061 , H05K2201/09845 , H05K2203/0369 , H05K2203/1476 , Y10T29/49156 , Y10T428/24917
摘要： Composite member 2 consisting of ceramic insulator substrate 3 and two metal layers 4A and 4B such as aluminum sheets is subjected to milling in order to remove the unwanted areas of metal layer 4A (where inter-element spacings are to be formed). In order to suppress cracking due to substrate warpage, a small bottom portion of 4A is left intact as residual metal layer 4Aa which is preferably removed by etching. Milling is performed after thin-film layer of etching resist 5 is applied to the surface of metal layer 4A. By milling in two stages, a step is formed at the bottom of lateral sides of a pattern element to make a skirt which contributes to reducing external stresses.
摘要翻译：将由陶瓷绝缘体基板3和两个金属层4A和4B（例如铝板）组成的复合构件2进行研磨以去除金属层4A（其中形成元件间间隔）的不需要的区域。为了抑制由于基板翘曲引起的开裂，4A的小底部作为剩余金属层4Aa保持不变，优选通过蚀刻除去。在金属层4A的表面上施加薄膜层抗蚀剂5之后进行铣削。通过两步铣削，在图案元件的侧面的底部形成台阶以制成裙边，其有助于减少外部应力。

4. 发明授权

US08927873B2 Fin-integrated substrate and manufacturing method of fin-integrated substrate 有权
标题翻译：散热一体化基板和翅片集成基板的制造方法
公开(公告)号：US08927873B2
公开(公告)日：2015-01-06
申请号：US13521922
申请日：2011-01-12
申请人： Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
发明人： Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
IPC分类号： H05K1/00 , H01L23/373 , H01L23/473 , H01L21/48
CPC分类号： H01L23/473 , H01L21/4878 , H01L23/3735 , H01L2924/0002 , Y10T29/49144 , H01L2924/00
摘要： There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter.
摘要翻译：提供了一种翅片一体化基板的制造方法，其能够通过简单的工艺制造具有精细间距的散热翅片的翅片集成基板，其中金属基板的翘曲和波纹（波浪形）散热片受到抑制。提供了一种翅片一体化基板的制造方法，其中金属电路板与陶瓷基板的接合通过熔融金属接合方法进行，并且在作为部件的切割部分处形成多个散热片通过夹具固定以在要形成散热片的切割部分的表面上施加拉伸应力，并且通过移动多切割器来进行形成多个凹槽的切槽加工在多张切割器旋转的同时，在施加拉伸应力的表面上由多个堆叠的盘形切割器组成。

5. 发明申请

US20080230515A1 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof 审中-公开
标题翻译：通过湿式处理制造的电力模块部件，湿式处理方法及其湿式处理设备
公开(公告)号：US20080230515A1
公开(公告)日：2008-09-25
申请号：US12153431
申请日：2008-05-19
申请人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
发明人： Ken Iyoda , Makoto Namioka , Hideyo Osanai , Susumu Shimada
IPC分类号： C23F1/02
CPC分类号： H05K3/068 , H01L21/4846 , H01L23/3735 , H01L2924/0002 , H05K3/0085 , H01L2924/00
摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed. Further, the integrally bonded member is pressed with an appropriate pressure from a base plate side so that a boundary surface between a portion surrounding the window portion in the masking member and an exposed surface of the ceramic substrate which is exposed in a metal-ceramic bonded member has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution for wet treatment is injected from an injection pipe to be in contact with the circuit pattern forming metal plate.
摘要翻译：本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。在电路图案形成用金属板接合在陶瓷基板的一部分上，以将整体接合部件露出陶瓷基板的外周缘部之后，将整体接合部件设置在处理装置上，同时被覆盖掩模构件具有窗口部分，整体结合构件的电路图案形成金属板从该窗口部分露出。此外，整体结合部件从基板侧以适当的压力被按压，使得掩蔽部件中的窗部分周围的部分与陶瓷基板的暴露在金属 - 陶瓷结合的表面之间的边界面构件具有不允许液体通过的状态。此后，从喷射管注入用于湿处理的处理液，以与电路图形形成金属板接触。

6. 发明申请

US20070017652A1 Apparatus, mold, and method for manufacturing metal-ceramic composite member 有权
标题翻译：用于制造金属 - 陶瓷复合材料的装置，模具和方法
公开(公告)号：US20070017652A1
公开(公告)日：2007-01-25
申请号：US11528425
申请日：2006-09-28
申请人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
发明人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
IPC分类号： B22D19/00 , B22D11/00
CPC分类号： C04B37/026 , B22D19/00 , B32B2311/12 , B32B2311/24 , C04B2237/122 , C04B2237/402 , C04B2237/407 , H05K1/0306 , H05K3/101 , H05K2203/128 , Y10T428/24917
摘要： To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefore. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.
摘要翻译：提供一种能够以高生产率制造各种形状的金属 - 陶瓷复合构件的制造装置，以及模具构件和制造方法。制造金属 - 陶瓷复合构件的制造装置，该装置包括：多个处理区域，即气氛置换/加热部件11，熔融金属推出部件21和冷却部件31; 以及用于允许模具通过这些多个处理区域的引导件48，其中放置有陶瓷构件86的模具60被连续地插入到设置在该引导件48中的模具入口43中，以实质上穿过引导件48处于屏蔽状态在熔融金属推出部21中注入熔融金属53，在冷却部31中使熔融金属53冷却固化，使金属与陶瓷结合，由此制造金属 - 陶瓷复合部件。

7. 发明授权

US06997233B2 Mold and method for manufacturing metal-ceramic composite member 有权
标题翻译：金属陶瓷复合材料制造用模具及其制造方法
公开(公告)号：US06997233B2
公开(公告)日：2006-02-14
申请号：US10668342
申请日：2003-09-24
申请人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
发明人： Hideyo Osanai , Susumu Ibaragi , Makoto Namioka
IPC分类号： B22D19/00 , B22D19/02 , B22D19/04 , B22D10/08
CPC分类号： B22D19/00
摘要： To provide a mold capable of manufacturing a metal-ceramic composite member in which a predetermined number of ceramic members are joined onto a large joining metal, the large joining metal being free from swell and shrinkage cavity on the surface thereof and high in dimensional precision. A metal-ceramic composite member 3 according to this embodiment is manufactured in such a manner that a predetermined number of metal-ceramic bonded substrates 30 are placed in a mold main body 11 constituting a mold 1, with a ceramic substrate 31 side thereof facing upward, an atmosphere inside and outside the mold 1 is replaced with an inert gas such as a nitrogen gas from the atmosphere, a molten metal 42 is poured and filled in a first joining portion 14 that is formed by the molten metal main body 11 and an upper container 13 and that has a shrinkage cavity inducing portion 16 on a metal material holding portion side and a shrinkage cavity inducing portion 18 on an air vent side, and the molten metal 42 is cooled.
摘要翻译：为了提供能够制造金属陶瓷复合构件的模具，其中预定数量的陶瓷构件接合到大的接合金属上，大的接合金属在其表面上没有膨胀和收缩空腔，并且尺寸精度高。制造本实施方式的金属 - 陶瓷复合构件3，将规定数量的金属陶瓷接合基板30配置在构成模具1的模具主体11内，陶瓷基板31侧面朝上模具1内部和外部的气氛被来自大气的惰性气体如氮气置换，熔融金属42被注入并填充在由熔融金属主体11形成的第一接合部分14和上部容器13，并且在金属材料保持部侧具有收缩空腔诱导部分16，在通风口侧具有收缩空腔诱导部分18，并且熔融金属42被冷却。

8. 发明申请

US20050084704A1 Metal/ceramic bonding substrate and method for producing same 有权
标题翻译：金属/陶瓷接合基材及其制造方法
公开(公告)号：US20050084704A1
公开(公告)日：2005-04-21
申请号：US10969360
申请日：2004-10-19
申请人： Hideyo Osanai , Takayuki Takahashi , Makoto Namioka
发明人： Hideyo Osanai , Takayuki Takahashi , Makoto Namioka
IPC分类号： H01L23/12 , H01L23/13 , H01L23/14 , H01L23/373 , B32B15/04
CPC分类号： H01L23/142 , H01L23/13 , H01L23/3735 , H01L2924/0002 , Y10T428/12535 , Y10T428/12576 , Y10T428/12611 , Y10T428/24926 , H01L2924/00
摘要： There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and amethod for producing the same. Inametal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.
摘要翻译：提供了具有提高的热循环可靠性的金属/陶瓷接合基板及其制造方法。将陶瓷基板12的一侧的电路形成用金属板14与散热用金属基板16接合的其他陶瓷接合基板10的另一侧，至少部分陶瓷基板12嵌入金属基板16.陶瓷基板12大致平行于金属基体16配置。

9. 发明申请

US20120152482A1 ALUMINUM BONDING MEMBER AND METHOD FOR PRODUCING SAME 有权
标题翻译：铝接合构件及其制造方法
公开(公告)号：US20120152482A1
公开(公告)日：2012-06-21
申请号：US13404233
申请日：2012-02-24
申请人： Hideyo Osanai
发明人： Hideyo Osanai
IPC分类号： B22D19/00 , B22D17/00
CPC分类号： H01L21/4882 , B22D19/0072 , H01L23/3736 , H01L23/473 , H01L2924/0002 , H05K1/0272 , H05K1/0306 , Y10T29/49126 , Y10T29/4913 , Y10T29/49885 , Y10T29/4998 , Y10T29/49982 , Y10T29/49984 , H01L2924/00
摘要： There is provided an aluminum bonding member capable of being simply and inexpensively produced and capable of being used as a cooling member having a high cooling power. The aluminum bonding member 10 has an aluminum member 12 of aluminum or an aluminum alloy exposed to the outside, and a tubular member 14 of a material which does not melt at a temperature close to the melting point of aluminum or the aluminum alloy. Both of the opening end portions of the tubular member are open to the outside of the aluminum member 12. A portion of the tubular member 14 between the opening end portions extends in the aluminum member 12, and the outer peripheral surface of the portion of the tubular member 14 extending in the aluminum member 12 is bonded directly to the aluminum member 12.
摘要翻译：提供了能够简单且廉价地制造并能够用作具有高冷却功率的冷却构件的铝接合构件。铝接合构件10具有铝或铝合金外露的铝构件12以及在接近铝或铝合金的熔点的温度下不熔化的材料的管状构件14。管状构件的两个开口端部都向铝构件12的外部开口。在开口端部之间的管状构件14的一部分在铝构件12中延伸，并且该部分的外周面在铝构件12中延伸的管状构件14直接接合到铝构件12上。

10. 发明授权

US07304378B2 Aluminum/ceramic bonding substrate 有权
标题翻译：铝/陶瓷接合基板
公开(公告)号：US07304378B2
公开(公告)日：2007-12-04
申请号：US11208246
申请日：2005-08-19
申请人： Hideyo Osanai
发明人： Hideyo Osanai
IPC分类号： H01L23/053 , H01L23/12 , H01L23/06
CPC分类号： C04B37/021 , B32B2311/24 , C04B2235/96 , C04B2237/343 , C04B2237/368 , C04B2237/402 , H01L23/3735 , H01L2924/0002 , H05K1/09 , H05K3/101 , H05K2203/128 , H01L2924/00
摘要： There is provided an aluminum/ceramic bonding substrate having a high reliability to high-temperature heat cycles. An aluminum member of an aluminum alloy having a Vickers hardness of 35 to 45 is bonded to a ceramic substrate having a flexural strength of 500 to 600 MPa in three-point bending. The ceramic substrate is made of high-strength aluminum nitride, silicon nitride, alumina containing zirconia, or high-purity alumina. The aluminum alloy is an aluminum alloy containing silicon and boron, or an aluminum alloy containing copper.
摘要翻译：提供了对高温热循环具有高可靠性的铝/陶瓷接合基板。维氏硬度为35〜45的铝合金的铝构件，在三点弯曲中与弯曲强度为500〜600MPa的陶瓷基板接合。陶瓷基板由高强度氮化铝，氮化硅，含氧化锆的氧化锆或高纯度氧化铝制成。铝合金是含有硅和硼的铝合金，或含有铜的铝合金。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式