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1. 发明授权

US08785585B2 Temporary adhesive composition, and method of producing thin wafer 有权
标题翻译：临时粘合剂组合物和薄晶片的制造方法
公开(公告)号：US08785585B2
公开(公告)日：2014-07-22
申请号：US13343930
申请日：2012-01-05
申请人： Masahiro Furuya , Shohei Tagami , Hideto Kato , Hideyuki Ito , Masahiro Yoshizawa
发明人： Masahiro Furuya , Shohei Tagami , Hideto Kato , Hideyuki Ito , Masahiro Yoshizawa
IPC分类号： C08G77/08
CPC分类号： C09J183/04 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/80 , C08L83/00 , C09J183/14 , H01L21/02013 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386
摘要： A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.
摘要翻译：一种临时粘合剂，其临时粘合和随后的分离是简单的。临时粘合剂组合物包括：（A）通过下述（A1）和（A2）之间的氢化硅烷化反应获得的重均分子量为至少15,000的有机聚硅氧烷和（B）具有沸点不超过220℃，其中（A1）是重均分子量超过2,000的含烯基的有机聚硅氧烷，包含35-99摩尔％的T硅氧烷单元和1至25摩尔％的M硅氧烷单元并且其中与硅原子键合的烯基表示与硅原子键合的所有有机基团的至少2摩尔％，（A2）是具有至少两个硅原子键合的氢原子的特定有机氢聚硅氧烷或特定的氢化硅烷基 - 含有化合物。

2. 发明申请

US20120175045A1 TEMPORARY ADHESIVE COMPOSITION, AND METHOD OF PRODUCING THIN WAFER 有权
标题翻译：临时粘合剂组合物和生产薄膜的方法
公开(公告)号：US20120175045A1
公开(公告)日：2012-07-12
申请号：US13343930
申请日：2012-01-05
申请人： Masahiro Furuya , Shohei Tagami , Hideto Kato , Hideyuki Ito , Masahiro Yoshizawa
发明人： Masahiro Furuya , Shohei Tagami , Hideto Kato , Hideyuki Ito , Masahiro Yoshizawa
IPC分类号： B32B38/10 , B32B37/14 , C09J183/07
CPC分类号： C09J183/04 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/80 , C08L83/00 , C09J183/14 , H01L21/02013 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386
摘要： A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.
摘要翻译：一种临时粘合剂，其临时粘合和随后的分离是简单的。临时粘合剂组合物包括：（A）通过下述（A1）和（A2）之间的氢化硅烷化反应获得的重均分子量为至少15,000的有机聚硅氧烷和（B）具有沸点不超过220℃，其中（A1）是重均分子量超过2,000的含烯基的有机聚硅氧烷，包含35-99摩尔％的T硅氧烷单元和1至25摩尔％的M硅氧烷单元并且其中与硅原子键合的烯基表示与硅原子键合的所有有机基团的至少2摩尔％，（A2）是具有至少两个硅原子键合的氢原子的特定有机氢聚硅氧烷或特定的氢化硅烷基 - 含有化合物。

3. 发明授权

US08673537B2 Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition 有权
标题翻译：光固化树脂组合物，图案形成方法和基材保护膜，以及使用所述组合物的膜状粘合剂和粘合片
公开(公告)号：US08673537B2
公开(公告)日：2014-03-18
申请号：US12963727
申请日：2010-12-09
申请人： Masahiro Furuya , Michihiro Sugo , Hideto Kato , Kazunori Kondo , Shohei Tagami , Tomoyuki Goto
发明人： Masahiro Furuya , Michihiro Sugo , Hideto Kato , Kazunori Kondo , Shohei Tagami , Tomoyuki Goto
IPC分类号： G03F7/004 , G03F7/038
CPC分类号： G03F7/0387 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/1053 , C08G73/106 , C08K5/3445 , C08K5/34922 , C08K5/41 , C08K5/49 , C08L63/00 , C08L79/08 , C09D179/08 , C09J179/08 , G03F7/0382 , G03F7/0757 , H05K3/287 , H05K2201/0154 , H05K2201/0162 , Y10S430/107 , Y10T428/24802 , Y10T428/269 , C08L2666/22
摘要： The invention relates to a photo-curable resin composition, which contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); and a photo-acid generator as a component (C). When used as an adhesive, the photo-curable resin composition further contains a multifunctional epoxy compound as a component (D).
摘要翻译：本发明涉及含有主要醇羟基的聚酰亚胺硅氧烷作为组分（A）的光固化树脂组合物; 作为组分（B）的至少一种选自由福尔马林或福尔马林醇修饰的氨基缩合产物和在其一分子中具有两个或更多个平均羟甲基或烷氧基羟甲基的酚化合物的化合物; 和作为（C）成分的光酸发生剂。作为粘合剂使用时，光固化性树脂组合物还含有作为（D）成分的多官能环氧化合物。

4. 发明授权

US08748293B2 Organopolysiloxane, temporary adhesive composition containing organopolysiloxane, and method of producing thinned wafer using the same 有权
标题翻译：有机聚硅氧烷，含有机聚硅氧烷的临时粘合剂组合物，以及使用其制造薄片晶片的方法
公开(公告)号：US08748293B2
公开(公告)日：2014-06-10
申请号：US13406114
申请日：2012-02-27
申请人： Masahiro Furuya , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Hideto Kato
发明人： Masahiro Furuya , Hiroyuki Yasuda , Shohei Tagami , Michihiro Sugo , Hideto Kato
IPC分类号： H01L21/461 , H01L21/463 , C08G77/20
CPC分类号： C08G77/70 , C08G77/04 , C08G77/50 , C08L83/04 , C09J183/04 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68386
摘要： The present invention provides a non-aromatic saturated hydrocarbon group-containing organopolysiloxane containing the following units (I) to (III): (I) a siloxane unit (T unit) represented by R1SiO3/2: 40 to 99 mol %; (II) a siloxane unit (D unit) represented by R2R3SiO2/2: 59 mol % or less; and (III) a siloxane unit (M unit) represented by R4R5R6SiO1/2: 1 to 30 mol %. There can be an organopolysiloxane, which is soluble in a nonpolar organic solvent so that the organopolysiloxane can be peeled in a short time, and which is hardly soluble in a polar organic solvent to be exemplarily used upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom so that the organopolysiloxane is not peeled from the supporting substrate upon coating a photoresist onto a semiconductor side of a joined substrate and removing the photoresist therefrom.
摘要翻译：本发明提供含有以下单元（I）〜（III）的非芳香族饱和烃基有机聚硅氧烷：（I）由R 1 SiO 3/2：40〜99摩尔％表示的硅氧烷单元（T单元）（II）由R2R3SiO2 / 2表示的硅氧烷单元（D单元）：59摩尔％以下; 和（III）由R4R5R6SiO1 / 2表示的硅氧烷单元（M单元）：1〜30摩尔％。可以是有机聚硅氧烷，其可溶于非极性有机溶剂，使得有机聚硅氧烷在短时间内可以被剥离，并且难以溶于极性有机溶剂中，例如在将光致抗蚀剂涂覆在半导体侧上时被示例性地使用从而从其上除去光致抗蚀剂，使得在将光致抗蚀剂涂覆在接合的基板的半导体侧上并从中除去光致抗蚀剂时，有机聚硅氧烷不从支撑基板剥离。

5. 发明申请

US20110143103A1 PHOTO-CURABLE RESIN COMPOSITION, PATTERN FORMING METHOD AND SUBSTRATE PROTECTING FILM, AND FILM-SHAPED ADHESIVE AND ADHESIVE SHEET USING SAID COMPOSITION 有权
标题翻译：光固化树脂组合物，图案形成方法和基材保护膜，以及使用上述组合物的薄膜粘合剂和粘合片
公开(公告)号：US20110143103A1
公开(公告)日：2011-06-16
申请号：US12963727
申请日：2010-12-09
申请人： Masahiro Furuya , Michihiro Sugo , Hideto Kato , Kazunori Kondo , Shohei Tagami , Tomoyuki Goto
发明人： Masahiro Furuya , Michihiro Sugo , Hideto Kato , Kazunori Kondo , Shohei Tagami , Tomoyuki Goto
IPC分类号： G03F7/004 , G03F7/20 , B32B3/10 , B32B7/12
CPC分类号： G03F7/0387 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/1053 , C08G73/106 , C08K5/3445 , C08K5/34922 , C08K5/41 , C08K5/49 , C08L63/00 , C08L79/08 , C09D179/08 , C09J179/08 , G03F7/0382 , G03F7/0757 , H05K3/287 , H05K2201/0154 , H05K2201/0162 , Y10S430/107 , Y10T428/24802 , Y10T428/269 , C08L2666/22
摘要： The invention relates to a photo-curable resin composition, which contains a polyimide silicone having a primary alcoholic hydroxyl group, as a component (A); at least one compound selected from the group consisting of an amino condensation product modified with formalin or a formalin-alcohol and a phenol compound having two or more in average of methylol group or alkoxymethylol group in one molecule thereof, as a component (B); and a photo-acid generator as a component (C). When used as an adhesive, the photo-curable resin composition further contains a multifunctional epoxy compound as a component (D).
摘要翻译：本发明涉及含有主要醇羟基的聚酰亚胺硅氧烷作为组分（A）的光固化树脂组合物; 作为组分（B）的至少一种选自由福尔马林或福尔马林醇修饰的氨基缩合产物和在其一分子中具有两个或更多个平均羟甲基或烷氧基羟甲基的酚化合物的化合物; 和作为（C）成分的光酸发生剂。作为粘合剂使用时，光固化性树脂组合物还含有作为（D）成分的多官能环氧化合物。

6. 发明申请

US20110311788A1 SILPHENYLENE-CONTAINING PHOTOCURABLE COMPOSITION, PATTERN FORMATION METHOD USING SAME, AND OPTICAL SEMICONDUCTOR ELEMENT OBTAINED USING THE METHOD 审中-公开
标题翻译：含有苯甲烯的光致抗蚀剂组合物，使用其的图案形成方法和使用该方法获得的光学半导体元件
公开(公告)号：US20110311788A1
公开(公告)日：2011-12-22
申请号：US13163174
申请日：2011-06-17
申请人： Shohei TAGAMI , Takato Sakurai , Hideto Kato
发明人： Shohei TAGAMI , Takato Sakurai , Hideto Kato
IPC分类号： B32B3/10 , G03F7/30 , G03F7/004
CPC分类号： G03F7/0005 , C08G59/306 , C08L63/00 , C08L2312/06 , G03F7/0755 , Y10T428/24802 , C08L83/04
摘要： Provided is a silphenylene-containing photocurable composition including: (A) a specific silphenylene having both terminals modified with alicyclic epoxy groups, and (C) a photoacid generator that generates acid upon irradiation with light having a wavelength of 240 to 500 nm. Also provided is a pattern formation method including: (i) forming a film of the photocurable composition on a substrate, (ii) exposing the film through a photomask with light having a wavelength of 240 to 500 nm, and if necessary, performing heating following the exposure, and (iii) developing the film in a developing liquid, and if necessary, performing post-curing at a temperature within a range from 120 to 300° C. following the developing. Further provided is an optical semiconductor element obtained by performing pattern formation using the method. The composition is capable of very fine pattern formation across a broad range of wavelengths, and following pattern formation, yields a film that exhibits a high degree of transparency and superior light resistance. The composition may also include: (B) a specific epoxy group-containing organosilicon compound.
摘要翻译：本发明提供一种含有亚苯基苯的光固化性组合物，其含有：（A）具有两个末端被脂环族环氧基改性的特定的硅亚苯基，（C）光照酸产生剂，其在波长240〜500nm的光照射下产生酸。还提供了一种图案形成方法，包括：（i）在基板上形成光固化性组合物的膜，（ii）用波长为240〜500nm的光使膜通过光掩模曝光，如果需要，进行加热曝光，和（iii）在显影液中显影该膜，如有必要，在显影后在120-300℃的温度下进行后固化。还提供了通过使用该方法进行图案形成而获得的光学半导体元件。组合物能够在宽波长范围内形成非常精细的图案，并且在图案形成之后，产生显示出高透明度和优异耐光性的膜。组合物还可以包括：（B）特定的含环氧基的有机硅化合物。

7. 发明申请

US20110077374A1 NOVEL POLYIMIDESILICONE HAVING ALCOHOLIC HYDROXYL GROUP AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：具有乙醇羟基的新型聚酰亚胺基及其生产方法
公开(公告)号：US20110077374A1
公开(公告)日：2011-03-31
申请号：US12893784
申请日：2010-09-29
申请人： Michihiro SUGO , Shohei Tagami , Hideto Kato
发明人： Michihiro SUGO , Shohei Tagami , Hideto Kato
IPC分类号： C08G77/04
CPC分类号： C08G73/106 , C08G73/101 , C08G73/1039 , C08G73/1042 , C08G77/455 , H05K3/285 , H05K2201/0154 , H05K2201/0162
摘要： The present invention provides a polyimidesilicone having a primary alcoholic hydroxyl group, which is represented by the following general formula (1): in which k and m are each a positive integer where k and in satisfy a relation a 0.01≦k/(+m)
摘要翻译：本发明提供具有以下通式（1）表示的具有伯醇羟基的聚酰亚胺：其中k和m各自为正整数，其中k和满足关系a 0.01＆nlE; k /（+ m）<1; X，Y和W如说明书中所定义。

8. 发明申请

US20070197680A1 Polyimide silicone resin and thermosetting composition comprising the same 有权
标题翻译：聚酰亚胺硅树脂和包含其的热固性组合物
公开(公告)号：US20070197680A1
公开(公告)日：2007-08-23
申请号：US11705784
申请日：2007-02-14
申请人： Michihiro Sugo , Hideto Kato , Tomoyuki Goto , Shohei Tagami
发明人： Michihiro Sugo , Hideto Kato , Tomoyuki Goto , Shohei Tagami
IPC分类号： C03C25/10
CPC分类号： C08G73/106 , C08G77/455 , C08L79/08
摘要： A polyimide silicone resin, characterized in that the polyimide silicone resin comprises repeating units represented by the following formula (1) and has a number average molecular weight of from 5,000 to 200,000 wherein X is a tetravalent organic group, at least one of the tetravalent organic groups being represented by the following formula (2) wherein R1 may be the same with or different from each other and is a monovalent hydrocarbon group having 1 to 8 carbon atoms, R2may be the same with or different from each other and is a trivalent organic group, and n ranges from 1 to 120 on average, and Y is a divalent organic group, at least one of the divalent organic groups comprising a phenolic hydroxyl group or a carboxyl group bonded to an aromatic ring.
摘要翻译：一种聚酰亚胺硅树脂，其特征在于，聚酰亚胺硅树脂含有下式（1）所示的重复单元，其数均分子量为5,000〜200,000，其中X为四价有机基团，四价有机基团中的至少一种基团由下式（2）表示，其中R 1彼此可以相同或不同，并且是具有1至8个碳原子的一价烃基，R 2， SUP>可以相同也可以不同，为三价有机基团，n为1〜120个，Y为二价有机基团，至少一个含有酚羟基的二价有机基团或与芳环结合的羧基。

9. 发明授权

US08487062B2 Polyimidesilicone having alcoholic hydroxyl group and process for producing the same 有权
标题翻译：具有醇羟基的聚酰亚胺及其制造方法
公开(公告)号：US08487062B2
公开(公告)日：2013-07-16
申请号：US12893784
申请日：2010-09-29
申请人： Michihiro Sugo , Shohei Tagami , Hideto Kato
发明人： Michihiro Sugo , Shohei Tagami , Hideto Kato
IPC分类号： C08G77/04
CPC分类号： C08G73/106 , C08G73/101 , C08G73/1039 , C08G73/1042 , C08G77/455 , H05K3/285 , H05K2201/0154 , H05K2201/0162
摘要： The present invention provides a polyimidesilicone having a primary alcoholic hydroxyl group, which is represented by the following general formula (1): in which k and m are each a positive integer where k and m satisfy a relation of 0.01≦k/(k+m)
摘要翻译：本发明提供一种具有伯醇羟基的聚酰亚胺，其由下列通式（1）表示：其中k和m各自为正整数，其中k和m满足0.01@k/（k + m）<1; X，Y和W如说明书中所定义。

10. 发明申请

US20100233619A1 NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE NOVEL POLYIMIDE SILICONE, AND METHOD FOR PATTERN FORMATION 有权
标题翻译：新型聚酰亚胺硅氧烷，含有新型聚酰亚胺硅氧烷的感光性树脂组合物，以及形成图案的方法
公开(公告)号：US20100233619A1
公开(公告)日：2010-09-16
申请号：US12722068
申请日：2010-03-11
申请人： Shohei TAGAMI , Takanobu Takeda , Michihiro Sugo , Hideto Kato
发明人： Shohei TAGAMI , Takanobu Takeda , Michihiro Sugo , Hideto Kato
IPC分类号： G03F7/004 , C08G77/04 , G03F7/20
CPC分类号： C08G77/455 , C08G73/106 , C08K5/34922 , C08L63/00 , C08L79/08 , C08L83/10 , G03F7/0382 , G03F7/0387
摘要： A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): wherein X is a tetravalent group at least a part of which is a tetravalent organic group represented by the formula (2): wherein R1 is a monovalent hydrocarbon group, R2 is a trivalent group, and n is an integer of 1 to 120 on average; and Y is a divalent organic group at least a part of which is a divalent organic group having a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group represented by the formula (3): wherein R3 and R4 are a hydrogen atom or an alkyl group, and R5 is an alkyl group, an aryl group, or an aralkyl group. R3 and R4, R3 and R5, or R4 and R5 may be bonded to each other to form a ring together with the carbon atom or the carbon atom and the oxygen atom to which they are bonded with the proviso that the R3, R4, and R5 are independently an alkylene group.
摘要翻译：提供了在分子中具有一部分或全部氢原子被酸不稳定基团取代的酚羟基的聚酰亚胺硅氧烷。聚酰亚胺硅氧烷包括由式（1）表示的单元：其中X是四价基团，其中至少一部分是由式（2）表示的四价有机基团：其中R 1是单价烃基，R 2是三价基，平均为n为1〜120的整数。 Y为二价有机基团，其中至少一部分为具有酚羟基的二价有机基团，其中部分或全部氢原子被式（3）表示的酸不稳定基团取代：其中R3和 R4是氢原子或烷基，R5是烷基，芳基或芳烷基。 R 3和R 4，R 3和R 5或R 4和R 5可以彼此键合以与碳原子或碳原子和它们所键合的氧原子一起形成环，条件是R3，R4和 R5独立地是亚烷基。

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