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1. 发明申请

US20100062249A1 Method and Apparatus for Manufacturing Prepreg Sheet and Prepreg Sheet 失效
标题翻译：制备预浸片和预浸片的方法和装置
公开(公告)号：US20100062249A1
公开(公告)日：2010-03-11
申请号：US12525271
申请日：2008-01-31
申请人： Masaaki Harazono , Toshihiro Matsumoto
发明人： Masaaki Harazono , Toshihiro Matsumoto
IPC分类号： B32B27/12 , B65H81/00 , B29C70/34 , B32B9/04
CPC分类号： B29B15/105 , B29C53/66 , B29C53/821 , Y10T428/24994 , Y10T428/249942 , Y10T428/269 , Y10T428/31504
摘要： According to the present invention, a method for manufacturing a prepreg sheet includes steps of (A) forming a resin layer 61 on a surface of a supporter 3, (B) winding a reinforcing yarn 10 around the resin layer 61, and (C) embedding at least a part of the reinforcing yarn 10 in the resin layer 61. Preferably, in step (C), the surface of the supporter 3 is relatively moved towards the reinforcing yarn 10.
摘要翻译：根据本发明，制备预浸薄板的方法包括以下步骤：（A）在支撑体3的表面上形成树脂层61，（B）将增强纱线10卷绕在树脂层61周围，（C）将增强纱线10的至少一部分嵌入到树脂层61中。优选地，在步骤（C）中，支撑体3的表面相对于增强纱线10移动。

2. 发明授权

US08273203B2 Method and apparatus for manufacturing prepreg sheet and prepreg sheet 失效
标题翻译：预浸薄板和预浸薄板的制造方法和装置
公开(公告)号：US08273203B2
公开(公告)日：2012-09-25
申请号：US13028068
申请日：2011-02-15
申请人： Masaaki Harazono , Toshihiro Matsumoto
发明人： Masaaki Harazono , Toshihiro Matsumoto
IPC分类号： B32B37/00
CPC分类号： B29B15/105 , B29C53/66 , B29C53/821 , Y10T428/24994 , Y10T428/249942 , Y10T428/269 , Y10T428/31504
摘要： According to the present invention, a method for manufacturing a prepreg sheet includes steps of (A) forming a resin layer 61 on a surface of a supporter 3, (B) winding a reinforcing yarn 10 around the resin layer 61, and (C) embedding at least a part of the reinforcing yarn 10 in the resin layer 61. Preferably, in step (C), the surface of the supporter 3 is relatively moved towards the reinforcing yarn 10.
摘要翻译：根据本发明，制备预浸薄板的方法包括以下步骤：（A）在支撑体3的表面上形成树脂层61，（B）将增强纱线10卷绕在树脂层61周围，（C）将增强纱线10的至少一部分嵌入到树脂层61中。优选地，在步骤（C）中，支撑体3的表面相对于增强纱线10移动。

3. 发明授权

US07951447B2 Method and apparatus for manufacturing prepreg sheet and prepreg sheet 失效
标题翻译：预浸薄板和预浸薄板的制造方法和装置
公开(公告)号：US07951447B2
公开(公告)日：2011-05-31
申请号：US12525271
申请日：2008-01-31
申请人： Masaaki Harazono , Toshihiro Matsumoto
发明人： Masaaki Harazono , Toshihiro Matsumoto
IPC分类号： B32B27/04
CPC分类号： B29B15/105 , B29C53/66 , B29C53/821 , Y10T428/24994 , Y10T428/249942 , Y10T428/269 , Y10T428/31504
摘要： According to the present invention, a method for manufacturing a prepreg sheet includes steps of (A) forming a resin layer 61 on a surface of a supporter 3, (B) winding a reinforcing yarn 10 around the resin layer 61, and (C) embedding at least a part of the reinforcing yarn 10 in the resin layer 61. Preferably, in step (C), the surface of the supporter 3 is relatively moved towards the reinforcing yarn 10.
摘要翻译：根据本发明，制备预浸薄板的方法包括以下步骤：（A）在支撑体3的表面上形成树脂层61，（B）将增强纱线10卷绕在树脂层61周围，（C）将增强纱线10的至少一部分嵌入到树脂层61中。优选地，在步骤（C）中，支撑体3的表面相对于增强纱线10移动。

4. 发明申请

US20120132462A1 CIRCUIT BOARD AND MOUNTING STRUCTURE USING THE SAME 有权
标题翻译：电路板和安装结构
公开(公告)号：US20120132462A1
公开(公告)日：2012-05-31
申请号：US13301152
申请日：2011-11-21
申请人： Masaaki Harazono , Yoshihiro Hosoi
发明人： Masaaki Harazono , Yoshihiro Hosoi
IPC分类号： H05K1/16 , H05K1/11
CPC分类号： H05K1/0366 , H01L2224/16225 , H05K1/0373 , H05K1/113 , H05K3/42 , H05K2201/0209 , H05K2201/0959
摘要： A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer.
摘要翻译：电路板包括基板; 贯穿基板的通孔及其厚度方向; 以及覆盖通孔的内壁的通孔导体。基板包括第一纤维层，第二纤维层和布置在第一纤维层和第二纤维层之间的树脂层。第一纤维层和第二纤维层中的每一个具有布置在多个纤维中的多个纤维和树脂。树脂层含有树脂，不含纤维。贯穿孔的内壁与基板的厚度方向一起在横截面图中包括树脂层中的弯曲凹陷。

5. 发明申请

US20110314666A1 METHOD FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRUCTURE USING THE SAME 有权
标题翻译：制造电路板的方法及使用其制造结构的方法
公开(公告)号：US20110314666A1
公开(公告)日：2011-12-29
申请号：US13094991
申请日：2011-04-27
申请人： Masaaki Harazono , Takayuki Umemoto
发明人： Masaaki Harazono , Takayuki Umemoto
IPC分类号： H05K3/30 , H05K3/00
CPC分类号： H05K3/4644 , H05K2201/0195 , H05K2201/09536 , H05K2201/0959 , H05K2203/0307 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers.
摘要翻译：根据本发明的一个实施例，一种用于制造电路板的方法包括用金属层覆盖包括聚酰亚胺树脂的第一树脂层的表面; 在平面图中形成布置在所述金属层上的导电层彼此分开的多个导电层; 用碱性水溶液使导电层粗糙化表面; 并且在平面图中蚀刻导电层之间的金属层的一部分，以在使导电层的表面粗糙化之后露出第一树脂层的表面。

6. 发明授权

US08863377B2 Method for manufacturing circuit board and method for manufacturing structure using the same 有权
标题翻译：电路板的制造方法及其制造方法
公开(公告)号：US08863377B2
公开(公告)日：2014-10-21
申请号：US13094991
申请日：2011-04-27
申请人： Masaaki Harazono , Takayuki Umemoto
发明人： Masaaki Harazono , Takayuki Umemoto
IPC分类号： H05K3/02 , H05K3/10 , H05K3/46
CPC分类号： H05K3/4644 , H05K2201/0195 , H05K2201/09536 , H05K2201/0959 , H05K2203/0307 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers.
摘要翻译：根据本发明的一个实施例，一种用于制造电路板的方法包括用金属层覆盖包括聚酰亚胺树脂的第一树脂层的表面; 在平面图中形成布置在所述金属层上的导电层彼此分开的多个导电层; 用碱性水溶液使导电层粗糙化表面; 并且在平面图中蚀刻导电层之间的金属层的一部分，以在使导电层的表面粗糙化之后露出第一树脂层的表面。

7. 发明授权

US5744848A Package for housing a photosemiconductor device 失效
标题翻译：用于容纳光半导体器件的封装
公开(公告)号：US5744848A
公开(公告)日：1998-04-28
申请号：US691624
申请日：1996-08-02
申请人： Masaaki Harazono
发明人： Masaaki Harazono
IPC分类号： G02B6/42 , H01L23/02 , H01L31/0203 , H01L23/06
CPC分类号： H01L31/0203 , H01L2224/4823 , H01L2224/73265
摘要： A photosemiconductor device-housing package comprising a metal substrate; an insulating support member on the top surface of which a photosemiconductor device is mounted; a metal frame member attached onto the metal substrate so as to surround the insulating support member and having a fixing region through its side face which fixes an optical fiber therein; outer lead terminals fixed in the metal substrate or the metal frame member via insulants; and a metal lid member attached to the top surface of the metal frame member to hermetically seal the photosemiconductor device, wherein the insulating support member is composed of an aluminum nitride-based sinter, the top surface of the insulating support member is coated with a thin-film brazing material, and the photosemiconductor device is fixed onto the insulating support member via the brazing material.
摘要翻译：一种光半导体器件外壳封装，包括金属基板; 在其顶表面上安装有光半导体装置的绝缘支撑构件; 金属框架构件，其附接到所述金属基板上以围绕所述绝缘支撑构件并且具有通过其固定光纤的侧面的固定区域; 外引线端子通过绝缘体固定在金属基板或金属框架构件中; 以及金属盖构件，其附接到所述金属框架构件的顶表面以气密地密封所述光半导体装置，其中所述绝缘支撑构件由氮化铝基烧结体构成，所述绝缘支撑构件的顶表面涂覆有薄的薄膜钎焊材料，并且光半导体装置经由钎焊材料固定在绝缘支撑构件上。

8. 发明授权

US08012561B2 Fiber-reinforced resin and method for manufacturing the same 失效
标题翻译：纤维增强树脂及其制造方法
公开(公告)号：US08012561B2
公开(公告)日：2011-09-06
申请号：US12594165
申请日：2008-03-26
申请人： Masaaki Harazono , Masaharu Shirai , Katsura Hayashi
发明人： Masaaki Harazono , Masaharu Shirai , Katsura Hayashi
IPC分类号： B32B3/12
CPC分类号： C08J5/04 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , H05K2201/0296 , Y10T428/24099 , Y10T428/24149 , Y10T428/24994
摘要： A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.
摘要翻译：提供了一种纤维增强树脂，其包括层叠多个单丝层20,21和22的纤维束2，每个单丝层包括沿一个方向布置的多根单丝23和粘合剂3 纤维束2的单丝23一起，纤维束2具有蜂窝状的截面。

9. 发明授权

US08735741B2 Circuit board and mounting structure using the same 有权
标题翻译：电路板和安装结构使用相同
公开(公告)号：US08735741B2
公开(公告)日：2014-05-27
申请号：US13301152
申请日：2011-11-21
申请人： Masaaki Harazono , Yoshihiro Hosoi
发明人： Masaaki Harazono , Yoshihiro Hosoi
IPC分类号： H05H1/11 , H05K1/03
CPC分类号： H05K1/0366 , H01L2224/16225 , H05K1/0373 , H05K1/113 , H05K3/42 , H05K2201/0209 , H05K2201/0959
摘要： A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer.
摘要翻译：电路板包括基板; 贯穿基板的通孔及其厚度方向; 以及覆盖通孔的内壁的通孔导体。基板包括第一纤维层，第二纤维层和布置在第一纤维层和第二纤维层之间的树脂层。第一纤维层和第二纤维层中的每一个具有布置在多个纤维中的多个纤维和树脂。树脂层含有树脂，不含纤维。贯穿孔的内壁与基板的厚度方向一起在横截面图中包括树脂层中的弯曲凹陷。

10. 发明申请

US20100136284A1 Fiber-Reinforced Resin and Method for Manufacturing the Same 失效
标题翻译：纤维增强树脂及其制造方法
公开(公告)号：US20100136284A1
公开(公告)日：2010-06-03
申请号：US12594165
申请日：2008-03-26
申请人： Masaaki Harazono , Masaharu Shirai , Katsura Hayashi
发明人： Masaaki Harazono , Masaharu Shirai , Katsura Hayashi
IPC分类号： B32B3/12 , B32B5/12
CPC分类号： C08J5/04 , H05K1/0366 , H05K2201/0287 , H05K2201/029 , H05K2201/0296 , Y10T428/24099 , Y10T428/24149 , Y10T428/24994
摘要： A fiber-reinforced resin is provided which includes a fiber bundle 2 comprising a plurality of monofilament layers 20, 21, and 22 being laminated, each of the monofilament layers comprising a plurality of monofilaments 23 arranged in one direction and an adhesive 3 for adhering the monofilaments 23 of the fiber bundle 2 together, and the fiber bundle 2 has a honeycomb-shaped cross section.
摘要翻译：提供了一种纤维增强树脂，其包括层叠多个单丝层20,21和22的纤维束2，每个单丝层包括沿一个方向布置的多根单丝23和粘合剂3 纤维束2的单丝23一起，纤维束2具有蜂窝状的截面。

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