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1. 发明申请

US20160155732A1 PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE IN WHICH A FIRST PORTION OF A SURFACE OF THE SEMICONDUCTOR SUBSTRATE IS RECESSED RELATIVE TO A SECOND PORTION OF THE SURFACE OF THE SEMICONDUCTOR SUBSTRATE TO FORM A RECESSED REGION IN THE SEMICONDUCTOR SUBSTRATE 审中-公开
标题翻译：封装组件包括半导体衬底，其中半导体衬底的表面的第一部分相对于半导体衬底的表面的第二部分被覆盖以形成半导体衬底中的凹陷区域
公开(公告)号：US20160155732A1
公开(公告)日：2016-06-02
申请号：US15017397
申请日：2016-02-05
申请人： Marvell World Trade Ltd.
发明人： Albert Wu , Roawen Chen , Chung Chyung (Justin) Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
IPC分类号： H01L25/00 , H01L21/48 , H01L21/56 , H01L25/065 , H01L23/498 , H01L21/768 , H01L23/00
CPC分类号： H01L25/04 , H01L21/486 , H01L21/565 , H01L21/76877 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/3677 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/09 , H01L24/16 , H01L24/17 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13024 , H01L2224/14181 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81193 , H01L2224/83904 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供了一种装置，包括具有第一表面的半导体衬底，与第一表面相对设置的第二表面，其中第一表面的至少一部分被凹入以形成半导体衬底的凹陷区域，以及形成在半导体衬底的凹陷区域中以在半导体衬底的第一表面和第二表面之间提供电或热路径的一个或多个通孔，以及耦合到半导体衬底的管芯，该管芯电耦合到形成在半导体衬底的凹陷区域中的一个或多个通孔。可以描述和/或要求保护其他实施例。

2. 发明授权

US08935464B2 Solid-state disk with wireless functionality 有权
标题翻译：具有无线功能的固态磁盘
公开(公告)号：US08935464B2
公开(公告)日：2015-01-13
申请号：US14266083
申请日：2014-04-30
申请人： Marvell World Trade Ltd.
发明人： Sehat Sutardja , Po-Chien Chang , Roawen Chen
IPC分类号： G06F13/00 , G06F13/38 , G06F3/06
CPC分类号： G06F13/385 , G06F3/0604 , G06F3/0626 , G06F3/0658 , G06F3/0679 , G06F2003/0692 , G06F2213/3814 , Y02D10/14 , Y02D10/151
摘要： A system including an interface module to interface a solid-state disk controller to a computing device. A memory control module exchanges data with the computing device via the interface module and caches the data in a solid-state memory controlled by the solid-state disk controller. A network interface module communicates with the computing device via the interface module and interfaces the computing device to a wireless network. A crossbar module has a master bus (Mbus) interface bridged to an advanced high-performance bus (AHB). A memory communicates with one or more of the network interface module and the crossbar module via one or more of the Mbus interface and the AHB. In response to data being cached from the computing device to the solid-state memory or data cached in the solid-state memory being output to the computing device, the network interface module buffers data received from the wireless network in the memory.
摘要翻译：一种包括用于将固态磁盘控制器连接到计算设备的接口模块的系统。存储器控制模块经由接口模块与计算设备交换数据，并将数据缓存在由固态磁盘控制器控制的固态存储器中。网络接口模块经由接口模块与计算设备进行通信，并将计算设备连接到无线网络。交叉开关模块具有桥接到高级高性能总线（AHB）的主总线（Mbus）接口。存储器通过Mbus接口和AHB中的一个或多个与一个或多个网络接口模块和交叉开关模块进行通信。响应于从计算设备缓存到固态存储器的数据或被固定在固态存储器中的数据被输出到计算设备，网络接口模块缓冲从存储器中的无线网络接收的数据。

3. 发明申请

US20140124961A1 TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES 审中-公开
标题翻译：接触半导体衬底的技术和配置
公开(公告)号：US20140124961A1
公开(公告)日：2014-05-08
申请号：US14153892
申请日：2014-01-13
申请人： Marvell World Trade Ltd.
发明人： Albert WU , Roawen Chen , Chung Chyung Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
IPC分类号： H01L25/04
CPC分类号： H01L25/04 , H01L21/486 , H01L21/565 , H01L21/76877 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/3677 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/09 , H01L24/16 , H01L24/17 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13024 , H01L2224/14181 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81193 , H01L2224/83904 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide a method comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, electrically coupling one or more dies to the redistribution layer, forming a molding compound on the semiconductor substrate, recessing the second surface of the semiconductor substrate, forming one or more channels through the recessed second surface of the semiconductor substrate to expose the redistribution layer; and forming one or more package interconnect structures in the one or more channels, the one or more package interconnect structures being electrically coupled to the redistribution layer, the one or more package interconnect structures to route electrical signals of the one or more dies. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供了一种方法，包括提供具有（i）第一表面和（ii）与第一表面相对设置的第二表面的半导体衬底，在半导体衬底的第一表面上形成电介质膜，形成电介质膜上的再分配层，将一个或多个管芯电耦合到再分布层，在半导体衬底上形成模制化合物，使半导体衬底的第二表面凹陷，通过半导体的凹陷的第二表面形成一个或多个沟道衬底以暴露再分布层; 以及在所述一个或多个通道中形成一个或多个封装互连结构，所述一个或多个封装互连结构电耦合到所述再分布层，所述一个或多个封装互连结构用于布置所述一个或多个管芯的电信号。可以描述和/或要求保护其他实施例。

4. 发明授权

US09768144B2 Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate 有权
公开(公告)号：US09768144B2
公开(公告)日：2017-09-19
申请号：US15017397
申请日：2016-02-05
申请人： Marvell World Trade Ltd.
发明人： Albert Wu , Roawen Chen , Chung Chyung (Justin) Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
IPC分类号： H01L25/04 , H01L21/48 , H01L23/13 , H01L23/14 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/00 , H01L21/56 , H01L21/768 , H01L23/367 , H01L23/00
CPC分类号： H01L25/04 , H01L21/486 , H01L21/565 , H01L21/76877 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/3677 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/09 , H01L24/16 , H01L24/17 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13024 , H01L2224/14181 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81193 , H01L2224/83904 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide an apparatus comprising a semiconductor substrate having a first surface, a second surface that is disposed opposite to the first surface, wherein at least a portion of the first surface is recessed to form a recessed region of the semiconductor substrate, and one or more vias formed in the recessed region of the semiconductor substrate to provide an electrical or thermal pathway between the first surface and the second surface of the semiconductor substrate, and a die coupled to the semiconductor substrate, the die being electrically coupled to the one or more vias formed in the recessed region of the semiconductor substrate. Other embodiments may be described and/or claimed.

5. 发明授权

US09391045B2 Recessed semiconductor substrates and associated techniques 有权
公开(公告)号：US09391045B2
公开(公告)日：2016-07-12
申请号：US14715170
申请日：2015-05-18
申请人： Marvell World Trade Ltd.
发明人： Albert Wu , Roawen Chen , Chung Chyung (Justin) Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
IPC分类号： H01L21/00 , H01L25/04 , H01L21/48 , H01L23/13 , H01L23/14 , H01L23/498 , H01L25/065 , H01L25/10 , H01L25/00 , H01L23/367 , H01L23/00
CPC分类号： H01L25/04 , H01L21/486 , H01L21/565 , H01L21/76877 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/3677 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/09 , H01L24/16 , H01L24/17 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13024 , H01L2224/14181 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81193 , H01L2224/83904 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide a method, comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming one or more vias in the first surface of the semiconductor substrate, the one or more vias initially passing through only a portion of the semiconductor substrate without reaching the second surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, the redistribution layer being electrically coupled to the one or more vias, coupling one or more dies to the redistribution layer, forming a molding compound to encapsulate at least a portion of the one or more dies, and recessing the second surface of the semiconductor substrate to expose the one or more vias. Other embodiments may be described and/or claimed.

6. 发明申请

US20150279806A1 RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES 审中-公开
标题翻译：残留的半导体衬底和相关技术
公开(公告)号：US20150279806A1
公开(公告)日：2015-10-01
申请号：US14715170
申请日：2015-05-18
申请人： Marvell World Trade Ltd.
发明人： Albert Wu , Roawen Chen , Chung Chyung (Justin) Han , Shiann-Ming Liou , Chien-Chuan Wei , Runzi Chang , Scott Wu , Chuan-Cheng Cheng
IPC分类号： H01L23/00
CPC分类号： H01L25/04 , H01L21/486 , H01L21/565 , H01L21/76877 , H01L21/76898 , H01L23/13 , H01L23/147 , H01L23/3677 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L24/09 , H01L24/16 , H01L24/17 , H01L24/33 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/02372 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/13024 , H01L2224/14181 , H01L2224/16225 , H01L2224/16235 , H01L2224/16238 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81193 , H01L2224/83904 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15156 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the present disclosure provide a method, comprising providing a semiconductor substrate having (i) a first surface and (ii) a second surface that is disposed opposite to the first surface, forming one or more vias in the first surface of the semiconductor substrate, the one or more vias initially passing through only a portion of the semiconductor substrate without reaching the second surface, forming a dielectric film on the first surface of the semiconductor substrate, forming a redistribution layer on the dielectric film, the redistribution layer being electrically coupled to the one or more vias, coupling one or more dies to the redistribution layer, forming a molding compound to encapsulate at least a portion of the one or more dies, and recessing the second surface of the semiconductor substrate to expose the one or more vias. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供一种方法，包括提供半导体衬底，其具有（i）第一表面和（ii）与第一表面相对设置的第二表面，在半导体衬底的第一表面中形成一个或多个通孔一个或多个通孔最初仅通过半导体衬底的一部分而不到达第二表面，在半导体衬底的第一表面上形成电介质膜，在电介质膜上形成再分布层，再分配层电耦合连接到所述一个或多个通孔，将一个或多个管芯耦合到所述再分布层，形成模制化合物以封装所述一个或多个管芯的至少一部分，以及使所述半导体衬底的所述第二表面凹陷以暴露所述一个或多个通孔。可以描述和/或要求保护其他实施例。

7. 发明申请

US20140237171A1 SOLID-STATE DISK WITH WIRELESS FUNCTIONALITY 有权
标题翻译：具有无线功能的固态磁盘
公开(公告)号：US20140237171A1
公开(公告)日：2014-08-21
申请号：US14266083
申请日：2014-04-30
申请人： Marvell World Trade LTD.
发明人： Sehat Sutardja , Po-Chien Chang , Roawen Chen
IPC分类号： G06F13/38 , G06F3/06
CPC分类号： G06F13/385 , G06F3/0604 , G06F3/0626 , G06F3/0658 , G06F3/0679 , G06F2003/0692 , G06F2213/3814 , Y02D10/14 , Y02D10/151
摘要： A system including an interface module to interface a solid-state disk controller to a computing device. A memory control module exchanges data with the computing device via the interface module and caches the data in a solid-state memory controlled by the solid-state disk controller. A network interface module communicates with the computing device via the interface module and interfaces the computing device to a wireless network. A crossbar module has a master bus (Mbus) interface bridged to an advanced high-performance bus (AHB). A memory communicates with one or more of the network interface module and the crossbar module via one or more of the Mbus interface and the AHB. In response to data being cached from the computing device to the solid-sate memory or data cached in the solid-state memory being output to the computing device, the network interface module buffers data received from the wireless network in the memory.
摘要翻译：一种包括用于将固态磁盘控制器连接到计算设备的接口模块的系统。存储器控制模块经由接口模块与计算设备交换数据，并将数据缓存在由固态磁盘控制器控制的固态存储器中。网络接口模块经由接口模块与计算设备进行通信，并将计算设备连接到无线网络。交叉开关模块具有桥接到高级高性能总线（AHB）的主总线（Mbus）接口。存储器通过Mbus接口和AHB中的一个或多个与一个或多个网络接口模块和交叉开关模块进行通信。响应于从计算设备缓存到固态存储器的数据或被固定在固态存储器中的数据被输出到计算设备，网络接口模块缓冲从存储器中的无线网络接收到的数据。

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