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    • 1. 发明申请
    • ENCAPSULATION FOR AN ELECTRONIC THIN FILM DEVICE
    • 电子薄膜装置的封装
    • US20100155709A1
    • 2010-06-24
    • US12600707
    • 2008-05-21
    • Martinus Jacobus Johannes HackThomas Nicolaas Maria BernardsPeter Van De Weijer
    • Martinus Jacobus Johannes HackThomas Nicolaas Maria BernardsPeter Van De Weijer
    • H01L51/52H01L51/56
    • H01L51/5256
    • The present invention relates to an encapsulation for an electronic thin film device, comprising a first barrier layer (108), a second barrier layer (112), and a first planarization layer (110′) for reducing the formation of pinholes in a subsequent barrier layer, said first planarization layer (110′) arranged between the first barrier layer (108) and the second barrier layer (112), wherein the first planarization layer (110′) is composed of a first plurality of planarization segment (114) having areas formed between each other, and the encapsulation further comprises a second planarization layer (116) arranged between the second barrier layer (112) and a third barrier layer (120), wherein the second planarization layer (116) is composed of a second plurality of planarization segments (118) arranged to extend over the areas between the first plurality of planarization segments (114), thereby further reducing the number of pinholes providing passageways through the encapsulation. According to the invention, by arranging the barrier layers and the planarization layers in a horizontal multi-layer encapsulation stack, where planarization segments in each of the layers are essentially decoupled from each other and in practice non-interconnecting with each other, it is possible to limit the lateral transportation of water and oxygen through the planarization layer. Instead, if water/oxygen enters the top barrier layer, and eventually a planarization segment, it is contained in the “sphere” of a planarization segment, having a minimized possibility of entering a pinhole in a subsequent barrier layer. The present invention also relates to corresponding method for the formation of an encapsulation for an electronic thin film device.
    • 本发明涉及一种用于电子薄膜器件的封装,其包括第一阻挡层(108),第二阻挡层(112)和用于减少随后屏障中针孔形成的第一平坦化层(110') 层,所述第一平坦化层(110')布置在所述第一阻挡层(108)和所述第二阻挡层(112)之间,其中所述第一平坦化层(110')由第一多个平坦化段(114) 所述封装还包括布置在所述第二阻挡层(112)和第三阻挡层(120)之间的第二平坦化层(116),其中所述第二平坦化层(116)由第二多层 布置成在第一多个平坦化段(114)之间的区域上延伸的平坦化段(118),从而进一步减少提供通过封装的通路的针孔的数量。 根据本发明,通过在水平多层封装堆叠中布置势垒层和平坦化层,其中每个层中的平坦化部分基本上彼此分离并且实际上彼此不互连,这是可能的 以限制通过平坦化层的水和氧的横向运输。 相反,如果水/氧进入顶部阻挡层,并且最终进入平坦化段,则其被包含在平坦化段的“球体”中,具有在随后的阻挡层中进入针孔的最小可能性。 本发明还涉及用于形成电子薄膜器件封装的相应方法。