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1. 发明授权

US07256070B2 Substrate-based housing component with a semiconductor chip 有权
标题翻译：具有半导体芯片的基板外壳部件
公开(公告)号：US07256070B2
公开(公告)日：2007-08-14
申请号：US11155317
申请日：2005-06-17
申请人： Martin Reiss , Anton Legen , Manuel Carmona , Kerstin Nocke
发明人： Martin Reiss , Anton Legen , Manuel Carmona , Kerstin Nocke
IPC分类号： H01L21/00
CPC分类号： H01L23/3114 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/564 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.
摘要翻译：本发明涉及具有半导体芯片的电子部件，其连接到载体基板并被壳体包围，其基于呈现基于基板的容纳的电子部件，其能够连续释放内部蒸汽压力当电子部件被加热时产生，同时可以使用已知和经过试验的方法和材料廉价地生产。根据本发明的实施例，这是通过以下事实来实现的：载体基板包括在两侧开口的多个中空通孔，该通孔分布在载体基板的至少一个部分中，所述至少一个部分被壳体覆盖。

2. 发明申请

US20060049503A1 Substrate-based housing component with a semiconductor chip 有权
标题翻译：具有半导体芯片的基板外壳部件
公开(公告)号：US20060049503A1
公开(公告)日：2006-03-09
申请号：US11155317
申请日：2005-06-17
申请人： Martin Reiss , Anton Legen , Manuel Carmona , Kerstin Nocke
发明人： Martin Reiss , Anton Legen , Manuel Carmona , Kerstin Nocke
IPC分类号： H01L21/00 , H01L23/02
CPC分类号： H01L23/3114 , H01L23/13 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/564 , H01L24/48 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/181 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00
摘要： The invention, which relates to an electronic component with a semiconductor chip, which is connected to a carrier substrate and surrounded by a housing, is based on presenting a substrate-based, housed electronic component, which enables the continuous release of the internal vapor pressure arising when the electronic component is heated, and at the same time can be produced inexpensively using the known and tried-and-tested methods and materials. According to embodiments of the invention, this is achieved by virtue of the fact that the carrier substrate comprises a plurality of hollow vias open on both sides, which vias are distributed areally in at least one section of the carrier substrate that is covered by the housing.
摘要翻译：本发明涉及具有半导体芯片的电子部件，其连接到载体基板并被壳体包围，其基于呈现基于基板的容纳的电子部件，其能够连续释放内部蒸汽压力当电子部件被加热时产生，同时可以使用已知和经过试验的方法和材料廉价地生产。根据本发明的实施例，这是通过以下事实来实现的：载体基板包括在两侧开口的多个中空通孔，该通孔分布在载体基板的至少一个部分中，所述至少一个部分被壳体覆盖。

3. 发明申请

US20050285266A1 Arrangement for increasing the reliability of substrate-based BGA packages 审中-公开
标题翻译：用于提高基于BGA封装的可靠性的布置
公开(公告)号：US20050285266A1
公开(公告)日：2005-12-29
申请号：US11155318
申请日：2005-06-17
申请人： Martin Reiss , Anton Legen , Manuel Carmona , Carsten Bender
发明人： Martin Reiss , Anton Legen , Manuel Carmona , Carsten Bender
IPC分类号： H01L21/44 , H01L23/48 , H01L23/498 , H05K3/28 , H05K3/34
CPC分类号： H05K3/281 , H01L23/49816 , H01L24/48 , H01L2224/32225 , H01L2224/4824 , H01L2924/00014 , H01L2924/15311 , H05K3/3452 , H05K2201/0154 , H05K2201/029 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An arrangement increases the reliability of substrate-based Ball-Grid-Array (BGA) packages, with a die (chip) that is mounted on a substrate and electrically connected to interconnects of the substrate and for which the substrate is provided with solder balls arranged in a predetermined grid. The arrangement is particularly simple to realize and effective for increasing the reliability of substrate-based Ball-Grid-Array packages. This is achieved by a laminate layer provided with openings for receiving the solder balls at the positions of ball pads being laminated on the side of the substrate that is provided with the interconnects.
摘要翻译：一种布置提高了基于基板的球栅阵列（BGA）封装的可靠性，其中芯片（芯片）安装在基板上并电连接到基板的互连件，并且基板设置有布置的焊球在预定的网格中。该装置对于提高基于基板的球栅阵列封装的可靠性而言，实现和有效地特别简单。这是通过层压层实现的，该层压层设置有用于在被设置有互连的衬底的侧面层压的球垫的位置处接收焊球的开口。

4. 发明申请

US20050285247A1 Substrate-based die package with BGA or BGA-like components 审中-公开
标题翻译：基于基板的模具封装，带有BGA或BGA组件
公开(公告)号：US20050285247A1
公开(公告)日：2005-12-29
申请号：US11158282
申请日：2005-06-21
申请人： Martin Reiss , Anton Legen , Manuel Carmona , Steffen Kroehnert , Carsten Bender
发明人： Martin Reiss , Anton Legen , Manuel Carmona , Steffen Kroehnert , Carsten Bender
IPC分类号： H01L23/02 , H01L23/13 , H01L23/498
CPC分类号： H01L23/49816 , H01L23/13 , H01L23/49822 , H01L23/49894 , H01L24/48 , H01L2224/32225 , H01L2224/4824 , H01L2224/73215 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged electronic component includes a substrate with an upper layer, a lower layer and a middle layer between the upper layer and the lower layer. The middle layer is formed from a first material that is more flexible than the material of the upper layer and the material of the lower layer. An electronic component, such as a semiconductor chip, can be adhered over the upper layer of the substrate. Solder balls can be adhered over the lower layer of the substrate.
摘要翻译：封装的电子部件包括在上层和下层之间具有上层，下层和中间层的基板。中间层由比上层的材料和下层的材料更柔性的第一材料形成。诸如半导体芯片的电子部件可以粘附在基板的上层上。焊球可以粘附在衬底的下层上。

5. 发明授权

US07368322B2 Method for mounting a chip on a base and arrangement produced by this method 有权
标题翻译：将芯片安装在基座上的方法和通过该方法制造的布置
公开(公告)号：US07368322B2
公开(公告)日：2008-05-06
申请号：US11184532
申请日：2005-07-19
申请人： Martin Reiss , Juergen Grafe , Anton Legen , Manuel Carmona
发明人： Martin Reiss , Juergen Grafe , Anton Legen , Manuel Carmona
IPC分类号： H01L21/00
CPC分类号： H01L25/50 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/8385 , H01L2225/0651 , H01L2225/06575 , H01L2225/06586 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.
摘要翻译：电子部件包括通过彼此间隔开并且布置在芯片和基部之间的中间空间中的多个粘合剂焊盘附接到基部的基部和芯片。芯片与基座的互连电连接。粘合垫在芯片的整个表面区域上以规则分布分隔。模塑料围绕芯片并且设置在芯片和基座之间的中间空间中。

6. 发明申请

US20060017156A1 Method for mounting a chip on a base and arrangement produced by this method 有权
标题翻译：将芯片安装在基座上的方法和通过该方法制造的布置
公开(公告)号：US20060017156A1
公开(公告)日：2006-01-26
申请号：US11184532
申请日：2005-07-19
申请人： Martin Reiss , Juergen Grafe , Anton Legen , Manuel Carmona
发明人： Martin Reiss , Juergen Grafe , Anton Legen , Manuel Carmona
IPC分类号： H01L23/34
CPC分类号： H01L25/50 , H01L24/32 , H01L24/73 , H01L24/83 , H01L25/0657 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32014 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/8385 , H01L2225/0651 , H01L2225/06575 , H01L2225/06586 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.
摘要翻译：电子部件包括通过彼此间隔开并且布置在芯片和基部之间的中间空间中的多个粘合剂焊盘附接到基部的基部和芯片。芯片与基座的互连电连接。粘合垫在芯片的整个表面区域上以规则分布分隔。模塑料围绕芯片并且设置在芯片和基座之间的中间空间中。

7. 发明授权

US07781900B2 Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same 有权
标题翻译：包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片的半导体器件及其制造方法
公开(公告)号：US07781900B2
公开(公告)日：2010-08-24
申请号：US11630930
申请日：2005-06-09
申请人： Manuel Carmona , Anton Legen , Ingo Wennemuth
发明人： Manuel Carmona , Anton Legen , Ingo Wennemuth
IPC分类号： H01L23/29 , H01L23/28
CPC分类号： H01L23/427 , H01L2224/4824 , H01L2224/73215 , H01L2924/01322 , H01L2924/15311 , H01L2924/00
摘要： One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.
摘要翻译：本发明的一个方面涉及一种半导体器件，其包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片。另一方面涉及其制造方法。塑料外壳组合物具有至少一种具有软化温度的主体组分和具有相变温度的掺入组分。在这种情况下，主体成分的软化温度大于引入成分的相变温度。

8. 发明申请

US20080111231A1 Semiconductor Device Comprising a Housing and a Semiconductor Chip Partly Embedded in a Plastic Housing Composition, and Method for Producing the Same 有权
标题翻译：包括部分地嵌入在塑料外壳组合物中的壳体和半导体芯片的半导体器件及其制造方法
公开(公告)号：US20080111231A1
公开(公告)日：2008-05-15
申请号：US11630930
申请日：2005-06-09
申请人： Manuel Carmona , Anton Legen , Ingo Wennemuth
发明人： Manuel Carmona , Anton Legen , Ingo Wennemuth
IPC分类号： H01L23/14 , H01L21/02
CPC分类号： H01L23/427 , H01L2224/4824 , H01L2224/73215 , H01L2924/01322 , H01L2924/15311 , H01L2924/00
摘要： One aspect of the invention relates to a semiconductor device including a housing and a semiconductor chip partly embedded in a plastic housing composition. Another aspect relates to a method for producing the same. The plastic housing composition has at least one host component having a softening temperature and an incorporated component having a phase change temperature. In this case, the softening temperature of the host component is greater than the phase change temperature of the incorporated component.
摘要翻译：本发明的一个方面涉及一种半导体器件，其包括壳体和部分地嵌入在塑料外壳组合物中的半导体芯片。另一方面涉及其制造方法。塑料外壳组合物具有至少一种具有软化温度的主体组分和具有相变温度的掺入组分。在这种情况下，主体成分的软化温度大于引入成分的相变温度。

9. 发明授权

US07230831B2 Heat sink for surface-mounted semiconductor devices 有权
标题翻译：表面贴装半导体器件散热片
公开(公告)号：US07230831B2
公开(公告)日：2007-06-12
申请号：US11118778
申请日：2005-05-02
申请人： Uwe Luckner , Georg Ernst , Manuel Carmona , Markus Fink
发明人： Uwe Luckner , Georg Ernst , Manuel Carmona , Markus Fink
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , H01L23/3675 , H01L23/4093 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/15311 , H01L2924/16152 , H01L2924/3025 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A heat sink is arranged on a main circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and with snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are resiliently connected to the press-on region. The snap-action hooks are latched into place, with pressure generation of the press-on region onto a rear side of a surface-mountable semiconductor device, into corresponding passage openings of the circuit board. A plastically deformable thermal composition is disposed between the rear side of the semiconductor device and the press-on region of the heat sink so as to form an intermediate layer therebetween to provide compensation for the thickness tolerances of the semiconductor device.
摘要翻译：散热器布置在电子模块的主电路板上。散热器包括三维结构的导热板，其具有压入区域和快动钩。快动钩相对于压入区域大致成直角地布置并且弹性地连接到压入区域。卡扣动作钩被锁定在适当的位置，压力产生的压入区域到可表面安装的半导体器件的后侧，到电路板的相应的通道开口中。在半导体器件的后侧和散热器的压入区域之间设置塑性变形的热成分，以便在其间形成中间层，以提供对半导体器件的厚度公差的补偿。

10. 发明授权

US07745747B2 Microswitch with a first actuated portion and a second contact portion 有权
标题翻译：微动开关具有第一致动部分和第二接触部分
公开(公告)号：US07745747B2
公开(公告)日：2010-06-29
申请号：US11725555
申请日：2007-03-19
申请人： Manuel Carmona , Jofre Pallares
发明人： Manuel Carmona , Jofre Pallares
IPC分类号： H01H57/00
CPC分类号： H01H59/0009 , H01H1/20 , H01H2001/0084
摘要： A microswitch which is electrostatically actuated, which has a first open position and a second closed position in which said switch closes at least a contact line (30); the microswitch comprising a movable part (10) which has at least a first actuated portion (11) and a second contact portion (12), which are mechanically connected by means of at least a connection element (13); said contact line/s (30) being placed between said first and second portions; wherein in the rest position of the microswitch the actuated portion is at a first distance d1 from the contact line and the contact portion is at a second distance d2 from the contact line; wherein the operation of the microswitch is the following: the first actuated portion is actuated by at least an actuating electrode (20), and in response to said actuation and via the connection element (13) the second contact portion (12) is arranged to contact said contact line (30) reducing said second distance d2 to zero.
摘要翻译：一种静电致动的微动开关，其具有第一打开位置和第二闭合位置，在所述第一闭合位置中所述开关至少闭合接触线路; 所述微型开关包括具有至少第一致动部分（11）和第二接触部分（12）的可移动部分（10），所述第一致动部分（11）和第二接触部分（12）通过至少连接元件（13）机械连接。所述接触线（30）被放置在所述第一和第二部分之间; 其中在所述微动开关的静止位置，所述致动部分与所述接触线处于第一距离d1，并且所述接触部分距离所述接触线处于第二距离d2; 其中所述微动开关的操作如下：所述第一致动部分由至少一个致动电极（20）致动，并且响应于所述致动并经由所述连接元件（13），所述第二接触部分（12）被布置成接触所述接触线（30）将所述第二距离d2减小到零。

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