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    • 4. 发明授权
    • Trench capacitor and method for fabricating the trench capacitor
    • 沟槽电容器和制造沟槽电容器的方法
    • US06987295B2
    • 2006-01-17
    • US10650817
    • 2003-08-28
    • Bernhard SellAnnette SängerDirk Schumann
    • Bernhard SellAnnette SängerDirk Schumann
    • H01L27/108
    • H01L27/10861H01L27/1203
    • A trench capacitor for use in a DRAM memory cell contains a lower capacitor electrode, a storage dielectric, and an upper capacitor electrode, which are at least partially disposed in a trench. The lower capacitor electrode adjoins, in a lower trench region, a wall of the trench, while in the upper trench region there is a spacer layer that adjoins a wall of the trench and is made from an insulating material. The upper electrode contains at least three layers, a first layer disposed in the trench on the storage dielectric and containing doped polysilicon, a second layer disposed on the first layer and containing metal-silicide, and a third layer disposed on the second layer and containing doped polysilicon. The layers of the upper electrode in each case extending along the walls and the base of the trench up to at least the upper edge of the spacer layer.
    • 用于DRAM存储单元的沟槽电容器包括至少部分地设置在沟槽中的下电容器电极,存储电介质和上电容器电极。 下部电容器电极在下部沟槽区域中邻接沟槽的壁,而在上部沟槽区域中存在间隔层,该间隔层邻接沟槽的壁并由绝缘材料制成。 上电极包含至少三层,第一层设置在存储电介质上的沟槽中并含有掺杂多晶硅,第二层设置在第一层上并含有金属硅化物,第三层设置在第二层上并含有 掺杂多晶硅。 每个壳体中的上电极的层沿着沟槽的壁和基底延伸到至少间隔层的上边缘。