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1. 发明授权

US09167696B2 Low profile memory module 有权
标题翻译：低调内存模块
公开(公告)号：US09167696B2
公开(公告)日：2015-10-20
申请号：US14094605
申请日：2013-12-02
申请人： Mark Kuanyu Cheng , Mark Burlington , Henry Hai Dang Nguyen
发明人： Mark Kuanyu Cheng , Mark Burlington , Henry Hai Dang Nguyen
IPC分类号： H01R9/00 , H05K1/18 , G06F1/16 , H05K1/14 , H01R12/71
CPC分类号： H05K1/141 , H01R12/716 , H05K2201/10159 , H05K2201/10189
摘要： An electronic component module according to an embodiment of the present invention includes a printed circuit board including a low-profile plug and at least one memory component thereon, and a connector for connecting the printed circuit board to a motherboard, the connector being mateable with the plug on the printed circuit board and having a z-height of no more than about 1.5 mm. The low-profile plug includes one hundred seventy pins and the number of pins allocated for VSS is no more than twenty-two and the number of pins allocated for VDD is no more than sixteen. Further, the low-profile plug includes an insulative portion protruding from a surface of the printed circuit board and having a “”-like or inverted “”-like profile in its center. The connector includes two sub-connectors, and an insulative portion having a “”-like or inverted “m”-like profile in the center.
摘要翻译：根据本发明实施例的电子部件模块包括：印刷电路板，包括薄型插头及其上的至少一个存储部件;以及用于将印刷电路板连接到主板的连接器，所述连接器可与插上印刷电路板，并具有不超过约1.5毫米的z高度。低端插头包括一百七十个引脚，分配给VSS的引脚数不超过二十二个，分配给VDD的引脚数不超过十六个。此外，低剖面插头包括从印刷电路板的表面突出并且在其中心具有“类似或倒置”状的绝缘部分。连接器包括两个子连接器和在中心具有“”状或倒“m”状轮廓的绝缘部分。

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