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1. 发明授权

US6029199A Computing system having a system supervisor and a collection of computing subunits each of which has a subunit supervisor 失效
标题翻译：具有系统主管和计算子单元集合的计算系统，每个子单元具有子单元监督器
公开(公告)号：US6029199A
公开(公告)日：2000-02-22
申请号：US681153
申请日：1996-08-16
申请人： Mark John Allen , Richard Ian Kaufman , Jeffrey Joseph Kleikamp , Lawrence Shungwei Mok , Ismail Cevdet Noyan , Roger Alan Pollak , Ricky Allen Rand , Arthur Robert Williams
发明人： Mark John Allen , Richard Ian Kaufman , Jeffrey Joseph Kleikamp , Lawrence Shungwei Mok , Ismail Cevdet Noyan , Roger Alan Pollak , Ricky Allen Rand , Arthur Robert Williams
IPC分类号： G06F15/173 , G06F15/16
CPC分类号： G06F15/17343
摘要： The present invention is directed to a computing system which contains a plurality of subunits. Each subunit contains a computing subcomponent and a subunit supervisor subcomponent. The subunit supervisor component monitors functions of the subunit and output signals corresponding to the monitored functions. The plurality of subunits are contained within a housing. The housing contains a housing supervisor subunit which receives the output signals of each of the plurality of subunits. The supervisor subunit outputs the accumulated signals to an input/output device for monitoring the plurality of subunits and for sending commands to each subunit.
摘要翻译：本发明涉及一种包含多个子单元的计算系统。每个子单元包含一个计算子组件和一个子单元主管子组件。子单元监视器组件监视子单元的功能和与监视功能相对应的输出信号。多个子单元包含在壳体内。壳体包含接收多个子单元中的每一个的输出信号的壳体监视器子单元。主管子单元将累积的信号输出到用于监视多个子单元的输入/输出设备，并向每个子单元发送命令。

2. 发明授权

US6017401A Conductivity improvement in thin films of refractory metal 失效
$Conductivity improvement in thin films of refractory metal$
标题翻译：难熔金属薄膜电导率提高
公开(公告)号：US6017401A
公开(公告)日：2000-01-25
申请号：US170622
申请日：1998-10-13
申请人： Fenton Read McFeely , Ismail Cevdet Noyan , John Jacob Yurkas
发明人： Fenton Read McFeely , Ismail Cevdet Noyan , John Jacob Yurkas
IPC分类号： H01L21/22 , C23C10/06 , C23C14/58 , C23C8/06
CPC分类号： C23C14/5846 , C23C10/06 , C23C14/58 , Y10T428/1284
摘要： A method of increasing conductivity of a refractory metal film disposed upon a substrate includes exposing the refractory metal film to an atmosphere comprising a silane of the form Si.sub.n H.sub.(2n+2), where n is a positive integer, while subjecting the refractory metal film to a temperature in excess of 700 degrees Celsius and to a base pressure not exceeding 10.sup.-8 torr for a time period which is chosen to be sufficiently long to increase the conductivity of the refractory metal film to a correspondingly sufficient degree.
摘要翻译：提高设置在基板上的难熔金属膜的导电性的方法包括将难熔金属膜暴露于含有SiH（2n + 2）形式的硅烷的气氛中，其中n为正整数，同时使难熔金属膜超过700摄氏度的温度和不超过10-8托的基础压力，该时间段被选择为足够长以将耐火金属膜的导电性提高到相应的足够程度。

3. 发明授权

US5675884A Apparatus for multilayer conductor chip packaging 失效
标题翻译：多层导体芯片封装设备
公开(公告)号：US5675884A
公开(公告)日：1997-10-14
申请号：US487465
申请日：1995-06-07
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Ismail Cevdet Noyan , Michael Jon Palmer
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Ismail Cevdet Noyan , Michael Jon Palmer
IPC分类号： H01L23/50 , H01L21/48 , H05K3/34 , H05K13/00 , B23Q39/02 , B21F1/00
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： Apparatus for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译：用于成形导体在载体上断裂的导体的装置，其结合到衬底表面上的接触位置。导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。

4. 发明授权

US5915462A High efficiency thermal interposer 失效
标题翻译：高效热插入器
公开(公告)号：US5915462A
公开(公告)日：1999-06-29
申请号：US851656
申请日：1997-05-06
申请人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
发明人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
IPC分类号： H01L21/60 , B23K20/02 , F28F9/20 , F28F13/00 , F28F7/00 , B23K1/12
CPC分类号： B23K20/025 , B23K20/023 , F28F13/00 , F28F9/20 , H01L2924/0002
摘要： A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
摘要翻译：一种高效热插入件，包括第一中空盘和第二中空盘，通过热隔离紧固件保持在一起。紧固件保持磁盘彼此接触。在本发明的说明性实施例中，第一盘是低温盘部分，第二盘是隔热板的高温盘部分。此外，根据本发明的优选实施例，盘之间的空间填充有与高温盘热接触的小导热颗粒（例如不锈钢球）; 但不与低温盘接触。热插入器/隔热罩包括用于将冷空气引入到容纳颗粒的空腔中的装置，用于使空气循环的装置，以及空气可以从腔排出以携带从颗粒内部吸收的热量的装置空腔。新型热插入器具有质量低，紧凑，并且可以实现温度下降，这将允许高功率HAT装置与温度敏感的电子定向装置（例如机器人臂）结合使用。

5. 发明授权

US5847926A Lightweight packaging 失效
标题翻译：轻便包装
公开(公告)号：US5847926A
公开(公告)日：1998-12-08
申请号：US772655
申请日：1996-12-23
申请人： Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer , William Edward Pence, IV
发明人： Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer , William Edward Pence, IV
IPC分类号： H01L23/06 , H01L23/14 , H01L23/367 , H01L23/373 , H05K5/00 , H05K5/02 , H05K7/20
CPC分类号： H05K7/20009 , H01L23/142 , H01L23/367 , H01L23/3733 , H05K5/0091 , H01L2924/0002 , H01L2924/3011 , Y10T29/49002
摘要： The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding. It achieves the packaging benefits by having; a laminated enclosure member structure that has an internal device supporting lamination and an external wear resistant lamination on each side of a layer of a material that has the combined physical properties of selectably interrelated coolant permeability and density, non-corrosiveness and electrical conductivity; heat generating signal processing devices mounted on the internal lamination; positioned holes through the laminations on each side of the permeable material layer that provide entrance, exit and directing openings for a coolant fluid, including air, that is brought in from the outside, and, propelling the coolant at least conventionally by the heat from the signal processing devices and additionally by a separate fan located in the enclosure so that the heated coolant is exhausted to the outside. Localized shock resistance is imparted by selective change in the density of the permeable layer.
摘要翻译：本发明通过使用容纳设备的相互连接的发热电子信号装置的外壳的组合结构特性来提供便携式电子设备的轻量级包装，以提供冷却剂运动和方向，局部可选择的物理保护和抗冲击性以及电屏蔽。它通过拥有包装的好处来实现; 层压的外壳构件结构，其具有支撑层压的内部装置和在材料层的每一侧上具有可选择地相互关联的冷却剂渗透性和密度，非腐蚀性和导电性的组合物理性质的外部耐磨层压; 安装在内层上的发热信号处理装置; 定位孔穿过可渗透材料层的每一侧上的层叠体，其为从外部引入的冷却剂流体（包括空气）提供入口，出口和引导开口，并且至少传统地通过来自信号处理装置，另外由位于外壳中的单独的风扇，使得加热的冷却剂被排出到外部。通过选择性地改变可渗透层的密度来赋予局部抗冲击性。

6. 发明授权

US5768770A Electronic packaging shaped beam lead fabrication 失效
标题翻译：电子封装成型梁引线制造
公开(公告)号：US5768770A
公开(公告)日：1998-06-23
申请号：US477074
申请日：1995-06-07
申请人： Raymond Robert Horton , Alphonso Philip Lanzetta , Ismail Cevdet Noyan , Michael Jon Palmer
发明人： Raymond Robert Horton , Alphonso Philip Lanzetta , Ismail Cevdet Noyan , Michael Jon Palmer
IPC分类号： H01L23/50 , H01L21/48 , H05K3/34 , H05K13/00 , H01R43/00
CPC分类号： H01L21/4842 , H05K13/0092 , H05K3/3426 , Y02P70/613 , Y10T29/49121 , Y10T29/49149 , Y10T29/49204 , Y10T29/515
摘要： Process for shaping conductors critically spaced on a carrier that are bonded to contact locations on a substrate surface. The conductors are cantilevered with each adjacent conductor bonded to a contact location that is a different distance from the carrier. Each conductor remains in the plane of the support of the carrier to the vicinity of its respective contact location where it is shaped to extend nearly vertically toward the substrate then horizontally across the contact location exerting pressure on the contact location.
摘要翻译：用于成形导体在载体上严格间隔的结合到衬底表面上的接触位置的工艺。导体是悬臂的，每个相邻的导体结合到距离载体不同距离的接触位置。每个导体保持在载体的支撑体的平面中至其相应的接触位置附近，在其附近，其形状几乎垂直于衬底延伸，然后横向穿过接触位置施加在接触位置上的压力。

7. 发明授权

US06503641B2 Interconnects with Ti-containing liners 有权
标题翻译：与含Ti衬板互连
公开(公告)号：US06503641B2
公开(公告)日：2003-01-07
申请号：US09740089
申请日：2000-12-18
申请人： Cyril Cabral, Jr. , Roy Arthur Carruthers , James McKell Edwin Harper , Chao-Kun Hu , Kim Yang Lee , Ismail Cevdet Noyan , Robert Rosenberg , Thomas McCarroll Shaw
发明人： Cyril Cabral, Jr. , Roy Arthur Carruthers , James McKell Edwin Harper , Chao-Kun Hu , Kim Yang Lee , Ismail Cevdet Noyan , Robert Rosenberg , Thomas McCarroll Shaw
IPC分类号： B32B1501
CPC分类号： H01L21/76843 , B32B15/01 , C22C27/02 , H01L21/76846 , H01L23/53223 , H01L23/53238 , H01L2924/0002 , Y10S428/929 , Y10S428/935 , Y10S428/936 , Y10S428/938 , Y10T428/12639 , Y10T428/12743 , Y10T428/12806 , Y10T428/12812 , Y10T428/12819 , Y10T428/12826 , Y10T428/12833 , Y10T428/1284 , Y10T428/12903 , H01L2924/00
摘要： An electrical conductor for use in an electronic structure is disclosed which includes a conductor body that is formed of an alloy including between about 0.001 atomic % and about 2 atomic % of an element selected from the group consisting of Ti, Zr, In, Sn and Hf; and a liner abutting the conductor body which is formed of an alloy that includes Ta, W, Ti, Nb and V. The invention further discloses a liner for use in a semiconductor interconnect that is formed of a material selected from the group consisting of Ti, Hf, In, Sn, Zr and alloys thereof, TiCu3, Ta1−XTix, Ta1−X, Hfx, Ta1−X, Inxy, Ta1−XSnx, Ta1−XZrx.
摘要翻译：公开了一种用于电子结构的电导体，其包括由合金构成的导体，该合金包括选自Ti，Zr，In，Sn中的元素的约0.001原子％至约2原子％，以及 Hf; 以及与包括Ta，W，Ti，Nb和V的合金形成的导体本体的衬垫。本发明还公开了一种用于半导体互连的衬垫，其由选自Ti ，Hf，In，Sn，Zr及其合金，TiCu3，Ta1-XTix，Ta1-X，Hfx，Ta1-X，Inxy，Ta1-XSnx，Ta1-XZrx。

8. 发明授权

US5669437A High efficiency thermal interposer 失效
标题翻译：高效热插入器
公开(公告)号：US5669437A
公开(公告)日：1997-09-23
申请号：US172674
申请日：1993-12-22
申请人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
发明人： Bernardo Hernandez , Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer
IPC分类号： H01L21/60 , B23K20/02 , F28F9/20 , F28F13/00 , F28F7/00 , B23K1/12
CPC分类号： B23K20/025 , B23K20/023 , F28F13/00 , F28F9/20 , H01L2924/0002
摘要： A high efficiency thermal interposer comprising a first hollow disk and second hollow disk, held together by thermally isolating fasteners. The fasteners keep the disks from touching one another. In an illustrative embodiment of the invention, the first disk is the low temperature disk portion and the second disk is the high temperature disk portion of the heat shield. Furthermore, according to a preferred embodiment of the invention, the space between the disks is filled with small thermally conductive particles (e.g., stainless steel spheres) which are in thermal contact with the high temperature disk; but which are not in contact with the low temperature disk. The thermal interposer/heat shield includes means for introducing cold jets of air into the cavity containing the particles, means for circulating the air therebetween, and means through which the air can exit from the cavity to carry away the heat picked up from the particles inside the cavity. The novel thermal interposer has a low mass, is compact and can achieve a temperature drop that will permit high powered HAT devices to be used in conjuction with temperature sensitive electronic orientation means, such as robot arms.
摘要翻译：一种高效热插入件，包括第一中空盘和第二中空盘，通过热隔离紧固件保持在一起。紧固件保持磁盘彼此接触。在本发明的说明性实施例中，第一盘是低温盘部分，第二盘是隔热板的高温盘部分。此外，根据本发明的优选实施例，盘之间的空间填充有与高温盘热接触的小导热颗粒（例如不锈钢球）; 但不与低温盘接触。热插入器/隔热罩包括用于将冷空气引入到容纳颗粒的空腔中的装置，用于使空气循环的装置，以及空气可以从腔排出以携带从颗粒内部吸收的热量的装置空腔。新型热插入器具有质量低，紧凑，并且可以实现温度下降，这将允许高功率HAT装置与温度敏感的电子定向装置（例如机器人臂）结合使用。

9. 发明授权

US06734363B1 Lightweight electronic equipment conductor with coolant permeable support 失效
标题翻译：轻型电子设备导体，带冷却剂可渗透支撑
公开(公告)号：US06734363B1
公开(公告)日：2004-05-11
申请号：US09205782
申请日：1998-12-04
申请人： Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer , William Edward Pence, IV
发明人： Raymond Robert Horton , Ismail Cevdet Noyan , Michael Jon Palmer , William Edward Pence, IV
IPC分类号： H01B700
CPC分类号： H05K7/20009 , H01L23/142 , H01L23/367 , H01L23/3733 , H01L2924/0002 , H01L2924/3011 , H05K5/0091 , H01L2924/00
摘要： The invention provides a wiring conductor for densely packed electronic apparatus, on which there is a supporting body of a material with randomly intertwined and fused filaments with spacing for being permeated by a coolant. The filamentary body material in addition may have imparted thereto the physical properties of interdependent density and permeability, noncorrosiveness and electrical conductivity.
摘要翻译：本发明提供了一种用于密集封装的电子设备的布线导体，其上有一个材料的支撑体，具有随机缠绕的和熔合的长丝，间隔被冷却剂渗透。此外，丝状体材料可以赋予其相互依赖的密度和渗透性，非腐蚀性和导电性的物理性质。

10. 发明授权

US06211042B1 Growth of epitaxial semiconductor films in presence of reactive metal 失效
标题翻译：外延半导体膜在活性金属存在下的生长
公开(公告)号：US06211042B1
公开(公告)日：2001-04-03
申请号：US09170621
申请日：1998-10-13
申请人： Fenton Read McFeely , Ismail Cevdet Noyan , John Jacob Yurkas
发明人： Fenton Read McFeely , Ismail Cevdet Noyan , John Jacob Yurkas
IPC分类号： H01L2120
CPC分类号： H01L21/28518 , C30B25/02 , C30B29/52 , H01L21/02381 , H01L21/02532 , H01L21/0262
摘要： A method is disclosed for forming an epitaxial layer of a semiconductor material over a metal structure disposed upon a surface of a semiconductor substrate, the metal being characterized by a negative Gibbs free energy for the formation of a compound of the metal and the semiconductor material. The method comprises the steps of: a) placing the substrate in a reactor vessel having a base pressure in the ultra high vacuum range, b) bringing the substrate to an elevated temperature, and c) flowing, over said substrate, a halogen-free precursor gas of molecules comprising the semiconductor material. Typically, the metal structure characterized by feature dimensions of less than 2.0 microns. Preferably, the metal is tungsten, the semiconductor material is silicon and the gas comprises a silane of the form SinH(2n+2), where n is a positive integer.
摘要翻译：公开了一种用于在半导体衬底的表面上形成半导体材料外延层的方法，该金属结构设置在金属结构的表面上，该金属的特征在于用于形成金属和半导体材料的化合物的负的吉布斯自由能。该方法包括以下步骤：a）将基板放置在基本压力在超高真空范围内的反应器容器中，b）使基板升高温度，和c）在所述基板上流过无卤素包含半导体材料的分子的前体气体。通常，特征尺寸小于2.0微米的金属结构。优选地，金属是钨，半导体材料是硅，气体包括形式为SinH（2n + 2）的硅烷，其中n是正整数。

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