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    • 3. 发明授权
    • Micromechanical devices with spring tips
    • 具有弹簧尖端的微机械装置
    • US5867202A
    • 1999-02-02
    • US768007
    • 1996-12-13
    • Richard L. KnipeMark H. StrumpellMichael A. Mignardi
    • Richard L. KnipeMark H. StrumpellMichael A. Mignardi
    • G02B26/08H04N5/74B41J2/47G02B26/00
    • G02B26/0825G02B26/0841
    • A micromechanical device (50) with spring tips (60) and its method of manufacture. A micromechanical device (50) is formed such that there is a deflectable element (36) suspended by at least one hinge (24a) over an air gap, at the bottom of which are landing stops (34a). The element (36) deflects on said hinge and comes into contact with the landing stops (34a) via at least one small metal protrusion (60), or spring tip. The spring tip flexes upon contact allowing more even distribution of forces and less wear and adhesion. The spring tips are formed in standard semiconductor processing steps with the addition of patterning the metal layer (64) from which the hinges are formed to create separated metal elements. When the deflectable element is formed, the metal forming that element bonds to the separated metal elements at the tips, thereby forming the spring tips.
    • 一种具有弹簧顶端(60)的微机械装置(50)及其制造方法。 微机械装置(50)形成为使得存在由空气间隙上的至少一个铰链(24a)悬挂的可偏转元件(36),其底部是着陆挡块(34a)。 元件(36)在所述铰链上偏转并经由至少一个小金属突起(60)或弹簧尖端与着陆挡块(34a)接触。 弹簧尖端在接触时弯曲,允许更均匀的力分布和更少的磨损和粘附力。 在标准的半导体加工步骤中形成弹簧尖端,其中添加了形成铰链的金属层(64)的图案化以产生分离的金属元件。 当形成可偏转元件时,形成该元件的金属在尖端处与分离的金属元件结合,从而形成弹簧顶端。