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    • 8. 发明授权
    • Method for reducing damage to sliders during lapping
    • 在研磨过程中减少滑块损坏的方法
    • US07360296B2
    • 2008-04-22
    • US10957098
    • 2004-09-30
    • Marie-Claire CyrillePrakash KasirajHuey-Ming Tzeng
    • Marie-Claire CyrillePrakash KasirajHuey-Ming Tzeng
    • G11B5/187B24B1/00
    • G11B5/3169G11B5/332G11B5/3932Y10T29/49041Y10T29/49046Y10T29/49048Y10T29/49052
    • A process is described for fabricating sliders with reduced lapping damage to the hard-bias materials. The stack of layers for the magnetic sensor is deposited on a wafer and patterned into an initial shape. The hard-bias structures are fabricated at the side of the magnetic sensor as in the prior art. In each of the two described embodiments of the invention, the hard-bias material below the ABS is reduced or removed and replaced with a fill material such as alumina. A first embodiment reduces the hard-bias material below the ABS by forming an extended lapping gap along the ABS in both the sensor and hard-bias material. A second embodiment forms a photoresist mask over the sensor and the portion of the hard-bias/lead structures above the ABS and the exposed hard-bias/lead material below the ABS is thinned or completely removed by milling.
    • 描述了一种用于制造滑块的方法,减少了对硬偏置材料的研磨损伤。 用于磁传感器的层堆叠沉积在晶片上并图案化成初始形状。 如现有技术那样,在磁性传感器侧制造硬偏压结构。 在本发明的两个所描述的实施例的每一个中,ABS下面的硬偏压材料被减少或移除,并用诸如氧化铝的填充材料代替。 第一实施例通过在传感器和硬偏压材料中沿着ABS形成延伸的研磨间隙来减少ABS之下的硬偏置材料。 第二实施例在传感器上形成光致抗蚀剂掩模,并且在ABS之上的硬偏置/引线结构的部分以及ABS下方的暴露的硬偏置/引线材料通过研磨被薄化或完全去除。