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    • 4. 发明申请
    • POLYAMIDE-IMIDE SOLUTION AND POLYAMIDE-IMIDE FILM
    • 聚酰亚胺溶液和聚酰胺薄膜
    • US20140072813A1
    • 2014-03-13
    • US14112503
    • 2012-04-19
    • Mari FujiiTomonori IwamotoMasatoshi Hasegawa
    • Mari FujiiTomonori IwamotoMasatoshi Hasegawa
    • C09D7/00
    • C09D7/20B32B17/064B32B2379/08C08G73/14C08L79/08H01L29/78603H01L51/0096Y10T428/31623
    • An object of the present invention is to obtain a polyamide-imide solution that has a low linear thermal expansion coefficient, that is, an excellent linear thermal expansion coefficient, and that also is excellent in coating applicability. A further object of the present invention is to provide, with use of the polyamide-imide solution, a product or member which has high requirements for heat resistance and a low linear thermal expansion coefficient. In particular, the present invention is intended to provide a product or member that is suitably used for applications in which the polyamide-imide film obtained from the polyamide-imide solution of the present invention is formed on a surface of an inorganic material such as metal, metal oxide, or monocrystalline silicon.The above objects can be achieved by a polyamide-imide solution including: a specific polyamide-imide; and an organic solvent, the organic solvent being a mixture solvent of an amide solvent and a non-amide solvent, the non-amide solvent being at least one solvent selected from the group consisting of ether solvents, ketone solvents, ester solvents, glycol ether solvents, and glycol ester solvents.
    • 本发明的目的是获得线性热膨胀系数低的线性热膨胀系数优异的涂布适用性优异的聚酰胺 - 酰亚胺溶液。 本发明的另一个目的是提供使用聚酰胺 - 酰亚胺溶液对耐热性要求高且线性热膨胀系数低的产品或部件。 特别地,本发明旨在提供适合用于将由本发明的聚酰胺 - 酰亚胺溶液获得的聚酰胺酰亚胺膜形成在无机材料如金属的表面上的应用的产品或部件 ,金属氧化物或单晶硅。 上述目的可以通过聚酰胺 - 酰亚胺溶液实现,包括:特定的聚酰胺 - 酰亚胺; 和有机溶剂,所述有机溶剂是酰胺溶剂和非酰胺溶剂的混合溶剂,所述非酰胺溶剂是选自醚溶剂,酮溶剂,酯溶剂,乙二醇醚中的至少一种溶剂 溶剂和乙二醇酯溶剂。