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1. 发明授权

US6000597A Molten solder dispensing system 失效
标题翻译：熔融焊料分配系统
公开(公告)号：US6000597A
公开(公告)日：1999-12-14
申请号：US14878
申请日：1998-01-28
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
摘要翻译：用于分配焊料的设备包括具有形成在其中的多个流动通道的喷嘴体。每个流动通道包括用于分配焊料的入口端和分配器端。喷嘴体形成围绕每个分配器端的乳头，并且喷嘴体还形成与每个分配器端连通的屏蔽室，用于保护相应的乳头，并且可选地提供惰性气体流和/或排除来自焊接区域的环境氧气。喷嘴体包括微加工硅。提供了各种流动通道构造以改善流动特性。

2. 发明授权

US5746368A Molten solder dispensing system 失效
公开(公告)号：US5746368A
公开(公告)日：1998-05-05
申请号：US649750
申请日：1996-05-15
申请人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
发明人： Marc Alan Straub , Frank Burke DiPiazza , Vivek Amir Jairazbhoy , Lakhi Nandial Goenka , Randy Claude Stevenson
IPC分类号： B23K3/06 , H05K3/34
CPC分类号： B23K3/0607 , H05K3/3457
摘要： An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.

3. 发明授权

US06303992B1 Interposer for mounting semiconductor dice on substrates 失效
标题翻译：用于将半导体裸片安装在基板上的插入器
公开(公告)号：US06303992B1
公开(公告)日：2001-10-16
申请号：US09347542
申请日：1999-07-06
申请人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
发明人： Cuong Van Pham , Frank Burke DiPiazza , Jay DeAvis Baker , Marc Alan Straub , Vivek Amir Jairazbhoy
IPC分类号： H01L2348
CPC分类号： H01L23/473 , H01L2224/16225
摘要： An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20. The interposer 10 may also include: a sealed cooling channel 28 defined within the interposer body 12; a fluid medium 30 generally filling the cooling channel 28; and a piezoelectric element 26 attached to the interposer body such that the piezoelectric element communicates with the cooling channel 28 and the fluid medium 30, the piezoelectric element being operatively coupled to at least two of the electrically conductive conduits 22.
摘要翻译：一种用于将半导体管芯50电耦合到衬底70的插入器10，包括：由介电材料制成并具有接触表面14和相对的接合表面16的插入体本体12; 布置在接触表面14周围的多个接触垫18; 布置在接合表面16的整个区域的多个接合焊盘20; 以及大体上设置在插入体内部的多个导电管道22，使得每个导管22将相应的一个接触焊盘18与相应的一个接合焊盘20连接。插入器10还可以包括：密封的冷却通道 28; 通常填充冷却通道28的流体介质30; 以及压电元件26，其连接到中介体，使得压电元件与冷却通道28和流体介质30连通，压电元件可操作地耦合到至少两个导电导管22。

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