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    • 2. 发明授权
    • Slurry distribution system for a CMP process in semiconductor device
fabrication
    • 用于半导体器件制造中的CMP工艺的浆料分配系统
    • US6021806A
    • 2000-02-08
    • US62719
    • 1998-04-20
    • Seung-bae Lee
    • Seung-bae Lee
    • B65D90/00B24B57/02F17D1/14H01L21/302F03B11/00
    • B24B57/02B24B37/04Y10T137/731Y10T137/7313Y10T137/86372
    • A slurry distribution system for supplying slurry used in the planarization process of a wafer surface by chemical reaction is provided with a movable supply line having an open end which is maintained at a constant depth below the surface of the slurry in the slurry tank. The movable supply line penetrates the top of the tank and is supported for vertical movement in an opening in the top of the tank. The other end of the movable supply line is located outside the tank and is connected to a main supply line which leads to CMP equipment. A pleated flexible tubing allows the movable supply line to move vertically relative to the main supply line and the top of the tank. A position-controlling mechanism keeps the open end of the movable supply line at a predetermined distance below the top surface of the slurry in the tank as the top surface rises and falls, by moving the movable supply line vertically in accordance with the changing amount of slurry inside the tank. Keeping the open end of the movable supply line at a predetermined depth below the top surface of the slurry prevents distorted and lumped slurry residue which may be present at the bottom of the tank from entering the movable supply line.
    • 用于通过化学反应在晶片表面的平坦化处理中供应的浆料的浆料分配系统设置有可移动的供给管线,其具有开口端,其保持在浆料罐中的浆料表面下方的恒定深度。 可移动供应线穿过罐的顶部并被支撑以在罐的顶部的开口中垂直运动。 可移动供给管线的另一端位于罐外部,并连接到通向CMP设备的主供应管线。 打褶的柔性管道允许可动供应管线相对于主供应管线和罐顶部垂直移动。 位置控制机构通过使可移动供给线垂直移动,使活动供给线的开口端在顶部表面上升和下降的同时使罐内的浆料的上表面下方一定距离, 罐内淤泥。 将可动供应管线的开放端保持在低于浆料顶表面的预定深度处,防止可能存在于罐底部的变形和集中的浆料残渣进入可动供应管线。