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1. 发明授权

US5166086A Thin film transistor array and method of manufacturing same 失效
标题翻译：薄膜晶体管阵列及其制造方法
公开(公告)号：US5166086A
公开(公告)日：1992-11-24
申请号：US833921
申请日：1992-02-12
申请人： Mamoru Takeda , Ichiro Yamashita , Isamu Kitahiro
发明人： Mamoru Takeda , Ichiro Yamashita , Isamu Kitahiro
IPC分类号： G02F1/1368 , H01L29/45 , H01L29/786
CPC分类号： H01L29/458 , G02F1/1368 , H01L29/78669
摘要： A self-aligned TFT array for liquid crystal display devices and a method of manufacturing the array are disclosed. A protective insulating layer on a semiconductor layer is exactly aligned with a gate electrode. A self-alignment method is used for patterning the protective insulating layer and an impurity-doped semiconductor layer on the semiconductor layer. No lift-off process is necessary.
摘要翻译：公开了用于液晶显示装置的自对准TFT阵列和阵列的制造方法。半导体层上的保护绝缘层与栅电极精确对准。使用自对准方法对半导体层上的保护绝缘层和杂质掺杂半导体层进行图案化。不需要脱离过程。

2. 发明授权

US5137841A Method of manufacturing a thin film transistor using positive and negative photoresists 失效
标题翻译：使用正负光致抗蚀剂制造薄膜晶体管的方法
公开(公告)号：US5137841A
公开(公告)日：1992-08-11
申请号：US454990
申请日：1989-12-22
申请人： Mamoru Takeda , Ichiro Yamashita , Isamu Kitahiro
发明人： Mamoru Takeda , Ichiro Yamashita , Isamu Kitahiro
IPC分类号： G02F1/1368 , H01L29/45 , H01L29/786
CPC分类号： H01L29/458 , G02F1/1368 , H01L29/78669 , Y10S438/949
摘要： A self-aligned TFT array for liquid crystal display devices and a method of manufacturing the array are disclosed. A protective insulating layer on a semiconductor layer is exactly aligned with a gate electrode. A self-alignment method is used for patterning the protective insulating layer and an impurity-doped semiconductor layer on the semiconductor layer. No lift-off process is necessary.
摘要翻译：公开了用于液晶显示装置的自对准TFT阵列和阵列的制造方法。半导体层上的保护绝缘层与栅电极精确对准。使用自对准方法对半导体层上的保护绝缘层和杂质掺杂半导体层进行图案化。不需要脱离过程。

3. 发明授权

US4958205A Thin film transistor array and method of manufacturing the same 失效
标题翻译：薄膜晶体管阵列及其制造方法
公开(公告)号：US4958205A
公开(公告)日：1990-09-18
申请号：US188623
申请日：1988-04-29
申请人： Mamoru Takeda , Ichiro Yamashita , Isamu Kitahiro
发明人： Mamoru Takeda , Ichiro Yamashita , Isamu Kitahiro
IPC分类号： G02F1/1368 , H01L29/45 , H01L29/786
CPC分类号： H01L29/458 , G02F1/1368 , H01L29/78669 , Y10S438/949
摘要： A self-aligned TFT array for liquid-crystal display devices and a method of manufacturing the array are disclosed. A protective insulating layer on a semiconductor layer is exactly aligned with a gate electrode. A self-alignment method is used for patterning the protective insulating layer and an impurity-doped semiconductor layer on the semiconductor layer. No lift-off process is necessary.
摘要翻译：公开了用于液晶显示装置的自对准TFT阵列和制造该阵列的方法。半导体层上的保护绝缘层与栅电极精确对准。使用自对准方法对半导体层上的保护绝缘层和杂质掺杂半导体层进行图案化。不需要脱离过程。

4. 发明授权

US4388128A Solid-state color-image sensor and process for fabricating the same 失效
标题翻译：固态彩色图像传感器及其制造方法
公开(公告)号：US4388128A
公开(公告)日：1983-06-14
申请号：US242578
申请日：1981-03-11
申请人： Kazufumi Ogawa , Shigeru Kondo , Yoshiko Yasuda , Taketoshi Yonezawa , Isamu Kitahiro
发明人： Kazufumi Ogawa , Shigeru Kondo , Yoshiko Yasuda , Taketoshi Yonezawa , Isamu Kitahiro
IPC分类号： G03F7/00 , H01L31/0216 , B29C27/10 , B32B31/20 , H01L31/18
CPC分类号： G03F7/0007 , H01L31/02162 , Y10T156/1074
摘要： In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the clip may be prevented from being cured and subsequently removed in a simple manner. According to a further embodiment of the present invention, prior to the bonding step, the color filter and chip are covered with protective layers or films so that surface flaws may be avoided. Thus, the color filters can be bonded to the chips with a higher degree of accuracy and a higher degree of adhesive strength and the mass production of solid-state color-image sensors can be much facilitated.
摘要翻译：在将滤色器与固态彩色图像传感器芯片接合的步骤中，不仅可以通过光线或更具体的紫外线照射而固化，而且通过加热固化，固化或部分固化可以通过照射在滤色器之后的光线和芯片已经在接合装置中彼此压靠并且彼此正确地对准，然后将具有部分粘合的滤色器的芯片从接合装置移除并完成粘合剂的完全固化通过加热。根据本发明的一个实施方案，粘合步骤在含有氧的气氛中进行，从而可以防止从滤色器和夹子之间的空间挤出的粘合剂被固化并随后在简单的方式。根据本发明的另一实施例，在接合步骤之前，滤色器和芯片被保护层或膜覆盖，从而可以避免表面缺陷。因此，可以以更高的准确度和更高的粘合强度将滤色器结合到芯片，并且可以大大方便固态彩色图像传感器的批量生产。

5. 发明授权

US4523102A Solid-state color-image sensor and process for fabricating the same 失效
标题翻译：固态彩色图像传感器及其制造方法
公开(公告)号：US4523102A
公开(公告)日：1985-06-11
申请号：US462396
申请日：1983-01-31
申请人： Ogawa Kazufumi , Shigeru Kondo , Yoshiko Yasuda , Taketoshi Yonezawa , Isamu Kitahiro
发明人： Ogawa Kazufumi , Shigeru Kondo , Yoshiko Yasuda , Taketoshi Yonezawa , Isamu Kitahiro
IPC分类号： G03F7/00 , H01L31/0216 , H01L31/18 , H01J40/14
CPC分类号： G03F7/0007 , H01L31/02162 , H01L31/18 , Y10S522/91 , Y10T428/31533
摘要： In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the chip may be prevented from being cured and subsequently removed in a simple manner. According to a further embodiment of the present invention, prior to the bonding step, the color filter and chip are covered with protective layers or films so that surface flaws may be avoided. Thus, the color filters can be bonded to the chips with a higher degree of accuracy and a higher degree of adhesive strength and the mass production of solid-state color-image sensors can be much facilitated.
摘要翻译：在将滤色器与固态彩色图像传感器芯片接合的步骤中，不仅可以通过光线或更具体的紫外线照射而固化，而且通过加热固化，固化或部分固化可以通过照射在滤色器之后的光线和芯片已经在接合装置中彼此压靠并且彼此正确地对准，然后将具有部分粘合的滤色器的芯片从接合装置移除并完成粘合剂的完全固化通过加热。根据本发明的一个实施方案，粘结步骤在含有氧的气氛中进行，从而可以防止从滤色器和芯片之间的空间挤出的粘合剂被固化并随后在简单的方式。根据本发明的另一实施例，在接合步骤之前，滤色器和芯片被保护层或膜覆盖，从而可以避免表面缺陷。因此，可以以更高的准确度和更高的粘合强度将滤色器结合到芯片，并且可以大大方便固态彩色图像传感器的批量生产。

6. 发明授权

US4419425A Method for manufacturing color filter 失效
标题翻译：彩色滤光片制造方法
公开(公告)号：US4419425A
公开(公告)日：1983-12-06
申请号：US380344
申请日：1982-05-20
申请人： Kazufumi Ogawa , Isamu Kitahiro
发明人： Kazufumi Ogawa , Isamu Kitahiro
IPC分类号： H04N9/07 , G02B5/20 , G03C1/73 , G03F7/00 , G03F7/12 , H01L31/0216 , G03C5/00
CPC分类号： H01L31/02162 , G03F7/0007 , G03F7/12
摘要： Proposed is a method for manufacturing a color filter having the steps of: forming a stripe- or lattice-shaped light-shield pattern on one major surface of a transparent glass substrate; forming a photosensitive base film on the same major surface of the glass substrate on which the light-shield pattern is formed; exposing the photosensitive base film by light radiated from the other major surface of the glass substrate, using the light-shield pattern as a mask, developing the base film to remove a nonexposed portion of the photosensitive base film immediately above the light-shield pattern and to divide the photosensitive base film along the light-shield pattern; and selectively dyeing divided base film portions to form color layers.
摘要翻译：提出一种制造滤色器的方法，该方法具有以下步骤：在透明玻璃基板的一个主表面上形成条纹或格子状的遮光图案; 在其上形成有遮光图案的玻璃基板的相同主表面上形成感光基膜; 通过使用遮光图案作为掩模从玻璃基板的另一个主表面辐射的光曝光感光基底膜，将基膜显影以去除光屏蔽图案正上方的感光基膜的未曝光部分，以及沿着遮光图案分割感光基底膜; 并选择性地染色分割的底膜部分以形成彩色层。

7. 发明授权

US4494688A Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore 失效
标题翻译：因此，将金属引线与半导体器件和金属引线的电极连接起来的方法
公开(公告)号：US4494688A
公开(公告)日：1985-01-22
申请号：US357319
申请日：1982-03-11
申请人： Kenzo Hatada , Isamu Kitahiro
发明人： Kenzo Hatada , Isamu Kitahiro
IPC分类号： H01L21/48 , H01L21/60 , H01L23/498
CPC分类号： H01L24/50 , H01L21/4825 , H01L23/49861 , H01L24/86 , H01L2224/11003 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701
摘要： A method suitable for connecting a plurality of metal leads at the same time with electrodes of a semiconductor device. Metal leads are provided each of which has a metal bump bonded thereto. The metal of the metal bump is softer than that of the lead. Those metal leads are located above the semiconductor device so that the bumps are contacted with the electrodes and then the bumps are bonded to the electrodes by heating, whereby the metal leads are connected with the electrodes.
摘要翻译：一种适于将多个金属引线同时与半导体器件的电极连接的方法。提供金属引线，每个金属引线具有与其结合的金属凸块。金属凸块的金属比铅的金属软。这些金属引线位于半导体器件的上方，使得凸块与电极接触，然后通过加热将凸块接合到电极，由此金属引线与电极连接。

8. 发明授权

US4418284A Solid-state color-image sensor and process for fabricating the same 失效
标题翻译：固态彩色图像传感器及其制造方法
公开(公告)号：US4418284A
公开(公告)日：1983-11-29
申请号：US242577
申请日：1981-03-11
申请人： Kazufumi Ogawa , Shigeru Kondo , Yoshiko Yasuda , Taketoshi Yonezawa , Isamu Kitahiro
发明人： Kazufumi Ogawa , Shigeru Kondo , Yoshiko Yasuda , Taketoshi Yonezawa , Isamu Kitahiro
IPC分类号： G03F7/00 , H01L31/0216 , B29C27/10 , B32B31/20 , H01L31/18
CPC分类号： G03F7/0007 , H01L31/02162 , Y10T156/1074
摘要： In a step for bonding a color filter to a solid-state image sensor so as to provide a color-sensitive image sensor (to be referred to as "a color-image sensor" in this specification), a method for bonding the color filter to the image sensor with an adhesive which is curable by ultraviolet radiation and also the constructions of color filters and image sensors which can facilitate the bonding step. Further techniques for mass producing high-precision and high-quality solid-state color-image sensors, each of which is bonded with a color filter with a higher degree of accuracy in alignment and by a higher degree of adhesive strength, by carrying out the bonding step in an atmosphere containing oxygen so as to inhibit an adhesive squeezed out of the space between the image sensor and the color filter from being cured and subsequently facilitate the removal of uncured adhesive and by forming protective layers or films over the surfaces to be bonded of the image sensor and color filter prior to the bonding step so as to prevent these surfaces from being damaged during the bonding step.
摘要翻译：在将滤色器粘合到固态图像传感器以便提供感光图像传感器（在本说明书中称为“彩色图像传感器”）的步骤中，将滤色器通过可通过紫外线辐射固化的粘合剂以及彩色滤光片和图像传感器的结构，使图像传感器能够促进粘合步骤。用于批量生产高精度和高质量固态彩色图像传感器的进一步技术，其中每个通过执行更高精度的校准和更高程度的粘合强度的滤色器粘合包含氧的气氛中的粘合步骤，以便抑制从图像传感器和滤色器之间的空间挤出的粘合剂被固化，并且随后便于去除未固化的粘合剂，并且在待粘合的表面上形成保护层或膜的粘合步骤之前的图像传感器和滤色器，以防止在接合步骤期间这些表面被损坏。

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