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1. 发明申请

US20090014649A1 ELECTRON BEAM APPARATUS 审中-公开
标题翻译：电子束设备
公开(公告)号：US20090014649A1
公开(公告)日：2009-01-15
申请号：US11909409
申请日：2006-03-22
申请人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Toru Kaga , Hirosi Sobukawa , Takeshi Murakami , Tsutomu Karimata
发明人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Toru Kaga , Hirosi Sobukawa , Takeshi Murakami , Tsutomu Karimata
IPC分类号： G01N23/00
CPC分类号： H01J37/153 , H01J37/26 , H01J2237/1534 , H01J2237/2446 , H01J2237/28
摘要： Secondary electrons emitted from a sample (W) by an electron beam irradiation is deflected by a beam separator (77), and is deflected again in a perpendicular direction by an aberration correction electrostatic deflector (711) to form a magnified image on the principal plane of an auxiliary lens (712). The secondary electron beam diverged from the auxiliary lens (712) passes through axial chromatic aberration correction lenses (714-717) and images on a principal plane of an auxiliary lens (718) for a magnifying lens (719). The magnified image is formed in a position spaced apart from the optical axis. Therefore, when the secondary electron beam diverged from the auxiliary lens (712) is incident on the axial chromatic aberration correction lenses without any change, large abaxial aberration occurs. To avoid it, the auxiliary lens (712) is used to form the image of an NA aperture (724) in substantially a middle (723) in the light axis direction of the axial chromatic aberration correction lenses (714-717).
摘要翻译：通过电子束照射从样品（W）发射的二次电子被光束分离器（77）偏转，并通过像差校正静电偏转器（711）在垂直方向上再次偏转，以在主平面上形成放大图像的辅助透镜（712）。从辅助透镜（712）发散的二次电子束通过轴向色差校正透镜（714-717）和用于放大透镜（719）的辅助透镜（718）的主平面上的图像。放大图像形成在与光轴间隔开的位置。因此，当从辅助透镜（712）发散的二次电子束没有任何变化地入射到轴向色像差校正透镜时，发生大的背轴像差。为了避免这种情况，辅助透镜（712）用于在轴向色像差校正透镜（714-717）的光轴方向上形成基本上中间（723）中的NA孔径（724）的图像。

2. 发明授权

US07241993B2 Inspection system by charged particle beam and method of manufacturing devices using the system 失效
标题翻译：带电粒子束的检测系统及使用该系统的制造装置的方法
公开(公告)号：US07241993B2
公开(公告)日：2007-07-10
申请号：US09891511
申请日：2001-06-27
申请人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
发明人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
IPC分类号： H01J37/28
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.
摘要翻译：电子束检查装置包括：电子光学装置70，具有用于从电子束源向一个电子束照射物体的电子 - 光学系统;以及用于检测由电子束投射的二次电子图像的检测器，光学系统; 用于相对于电子 - 光学系统保持和移动物体的平台系统50; 微型环境室20，用于向物体供应清洁气体，以防止灰尘与物体接触; 用于容纳平台装置的工作室31，工作室可控制为具有真空气氛; 设置在微环境室和工作室之间的至少两个装载室41,42适于独立控制以具有真空气氛; 以及用于通过装载室将物体传送到舞台系统的装载器60。

3. 发明申请

US20060118719A1 Electron beam inspection system and inspection method and method of manufacturing devices using the system 有权
公开(公告)号：US20060118719A1
公开(公告)日：2006-06-08
申请号：US11290688
申请日：2005-12-01
申请人： Kenji Watanabe , Hirosi Sobukawa , Nobuharu Noji , Tohru Satake , Shoji Yoshikawa , Tsutomu Karimata , Mamoru Nakasuji , Masahiro Hatakeyama , Takeshi Murakami , Yuichiro Yamazaki , Ichirota Nagahama , Takamitsu Nagai , Kazuyoshi Sugihara
发明人： Kenji Watanabe , Hirosi Sobukawa , Nobuharu Noji , Tohru Satake , Shoji Yoshikawa , Tsutomu Karimata , Mamoru Nakasuji , Masahiro Hatakeyama , Takeshi Murakami , Yuichiro Yamazaki , Ichirota Nagahama , Takamitsu Nagai , Kazuyoshi Sugihara
IPC分类号： G21K7/00
CPC分类号： H01J37/28 , H01J37/224 , H01J37/244 , H01J2237/006 , H01J2237/20221 , H01J2237/2445 , H01J2237/2817
摘要： An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary electron optical system converges secondary electrons emitted from the sample. A detector converts the converged secondary electrons into an optical image through a fluorescent screen and focuses the image to a line sensor. A controller controls the charge transfer time of the line sensor at which the picked-up line image is transferred between each pair of adjacent pixel rows provided in the line sensor in association with the moving speed of a stage for moving the sample.

4. 发明授权

US08053726B2 Inspection system by charged particle beam and method of manufacturing devices using the system 有权
标题翻译：带电粒子束的检测系统及使用该系统的制造装置的方法
公开(公告)号：US08053726B2
公开(公告)日：2011-11-08
申请号：US12216233
申请日：2008-07-01
申请人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
发明人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
IPC分类号： H01J37/28
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.
摘要翻译：电子束检查装置包括：电子光学装置70，具有用于从电子束源向一个电子束照射物体的电子 - 光学系统;以及用于检测由电子束投射的二次电子图像的检测器，光学系统; 用于相对于电子 - 光学系统保持和移动物体的平台系统50; 微型环境室20，用于向物体供应清洁气体，以防止灰尘与物体接触; 用于容纳平台装置的工作室31，工作室可控制为具有真空气氛; 设置在迷你环境室和工作室之间的至少两个装载室41,42适于独立控制以具有真空气氛; 以及用于通过装载室将物体传送到舞台系统的装载器60。

5. 发明申请

US20090050822A1 Electron beam apparatus and method of manufacturing semiconductor device using the apparatus 有权
公开(公告)号：US20090050822A1
公开(公告)日：2009-02-26
申请号：US11819026
申请日：2007-06-25
申请人： Mamoru Nakasuji , Tohru Satake , Kenji Watanabe , Takeshi Murakami , Nobuharu Noji , Hirosi Sobukawa , Tsutomu Karimata , Shoji Yoshikawa , Toshifumi Kimba , Shin Oowada , Mutsumi Saito , Muneki Hamashima , Toru Takagi , Naoto Kihara , Hiroshi Nishimura
发明人： Mamoru Nakasuji , Tohru Satake , Kenji Watanabe , Takeshi Murakami , Nobuharu Noji , Hirosi Sobukawa , Tsutomu Karimata , Shoji Yoshikawa , Toshifumi Kimba , Shin Oowada , Mutsumi Saito , Muneki Hamashima , Toru Takagi , Naoto Kihara , Hiroshi Nishimura
IPC分类号： A61N5/00
CPC分类号： H01J37/185 , G01N23/225 , G01N23/2251 , H01J37/06 , H01J37/073 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817
摘要： The present invention provides an electron beam apparatus for evaluating a sample surface, which has a primary electro-optical system for irradiating a sample with a primary electron beam, a detecting system, and a secondary electro-optical system for directing secondary electron beams emitted from the sample surface by the irradiation of the primary electron beam to the detecting system.

6. 发明申请

US20090032708A1 Inspection system by charged particle beam and method of manufacturing devices using the system 有权
公开(公告)号：US20090032708A1
公开(公告)日：2009-02-05
申请号：US12216233
申请日：2008-07-01
申请人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
发明人： Mamoru Nakasuji , Nobuharu Noji , Tohru Satake , Masahiro Hatakeyama , Toshifumi Kimba , Hirosi Sobukawa , Shoji Yoshikawa , Takeshi Murakami , Kenji Watanabe , Tsutomu Karimata , Shin Oowada , Mutsumi Saito , Yuichiro Yamazaki , Takamitsu Nagai , Ichirota Nagahama
IPC分类号： G01N23/00 , H01J3/14
CPC分类号： H01J29/70 , G01N23/225 , G01N23/2251 , G01N23/227 , H01J37/06 , H01J37/073 , H01J37/141 , H01J37/185 , H01J37/20 , H01J37/222 , H01J37/244 , H01J37/266 , H01J37/28 , H01J2237/082 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2816 , H01J2237/2817 , H01L21/6719 , H01L21/67213
摘要： An inspection apparatus by an electron beam comprises: an electron-optical device 70 having an electron-optical system for irradiating the object with a primary electron beam from an electron beam source, and a detector for detecting the secondary electron image projected by the electron-optical system; a stage system 50 for holding and moving the object relative to the electron-optical system; a mini-environment chamber 20 for supplying a clean gas to the object to prevent dust from contacting to the object; a working chamber 31 for accommodating the stage device, the working chamber being controllable so as to have a vacuum atmosphere; at least two loading chambers 41, 42 disposed between the mini-environment chamber and the working chamber, adapted to be independently controllable so as to have a vacuum atmosphere; and a loader 60 for transferring the object to the stage system through the loading chambers.

7. 发明授权

US07408175B2 Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former 有权
标题翻译：用于电子束检查的装置，其操作方法以及使用前者制造半导体器件的方法
公开(公告)号：US07408175B2
公开(公告)日：2008-08-05
申请号：US11783780
申请日：2007-04-12
申请人： Toshifumi Kimba , Tohru Satake , Tsutomu Karimata , Kenji Watanabe , Nobuharu Noji , Takeshi Murakami , Masahiro Hatakeyama , Mamoru Nakasuji , Hirosi Sobukawa , Shoji Yoshikawa , Shin Oowada , Mutsumi Saito
发明人： Toshifumi Kimba , Tohru Satake , Tsutomu Karimata , Kenji Watanabe , Nobuharu Noji , Takeshi Murakami , Masahiro Hatakeyama , Mamoru Nakasuji , Hirosi Sobukawa , Shoji Yoshikawa , Shin Oowada , Mutsumi Saito
IPC分类号： H01J37/18
CPC分类号： H01J37/222 , G01N23/225 , G01N23/2251 , H01J37/06 , H01J37/073 , H01J37/185 , H01J37/20 , H01J37/244 , H01J37/28 , H01J2237/0216 , H01J2237/082 , H01J2237/2002 , H01J2237/2007 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2813 , H01J2237/2816 , H01J2237/2817 , H01L2224/48227 , H01L2924/01019 , H01L2924/01025 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/10253 , H01L2924/12032 , H01L2924/3025 , H01L2924/00
摘要： A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.
摘要翻译：本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过至少一个自由度的阶段26-1连续地移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

8. 发明授权

US08822919B2 Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former 有权
标题翻译：用于电子束检查的装置，其操作方法以及使用前者制造半导体器件的方法
公开(公告)号：US08822919B2
公开(公告)日：2014-09-02
申请号：US12985827
申请日：2011-01-06
申请人： Toshifumi Kimba , Tohru Satake , Tsutomu Karimata , Kenji Watanabe , Nobuharu Noji , Takeshi Murakami , Masahiro Hatakeyama , Mamoru Nakasuji , Hirosi Sobukawa , Shoji Yoshikawa , Shin Oowada , Mutsumi Saito
发明人： Toshifumi Kimba , Tohru Satake , Tsutomu Karimata , Kenji Watanabe , Nobuharu Noji , Takeshi Murakami , Masahiro Hatakeyama , Mamoru Nakasuji , Hirosi Sobukawa , Shoji Yoshikawa , Shin Oowada , Mutsumi Saito
IPC分类号： G01N23/00
CPC分类号： H01J37/222 , G01N23/225 , G01N23/2251 , H01J37/06 , H01J37/073 , H01J37/185 , H01J37/20 , H01J37/244 , H01J37/28 , H01J2237/0216 , H01J2237/082 , H01J2237/2002 , H01J2237/2007 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2813 , H01J2237/2816 , H01J2237/2817 , H01L2224/48227 , H01L2924/01019 , H01L2924/01025 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/10253 , H01L2924/12032 , H01L2924/3025 , H01L2924/00
摘要： A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.
摘要翻译：本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过具有至少一个自由度的平台26-1连续移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

9. 发明授权

US07569838B2 Electron beam inspection system and inspection method and method of manufacturing devices using the system 有权
公开(公告)号：US07569838B2
公开(公告)日：2009-08-04
申请号：US12068484
申请日：2008-02-07
申请人： Kenji Watanabe , Hirosi Sobukawa , Nobuharu Noji , Tohru Satake , Shoji Yoshikawa , Tsutomu Karimata , Mamoru Nakasuji , Masahiro Hatakeyama , Takeshi Murakami , Yuichiro Yamazaki , Ichirota Nagahama , Takamitsu Nagai , Kazuyoshi Sugihara
发明人： Kenji Watanabe , Hirosi Sobukawa , Nobuharu Noji , Tohru Satake , Shoji Yoshikawa , Tsutomu Karimata , Mamoru Nakasuji , Masahiro Hatakeyama , Takeshi Murakami , Yuichiro Yamazaki , Ichirota Nagahama , Takamitsu Nagai , Kazuyoshi Sugihara
IPC分类号： H01J37/00 , H01J37/30
CPC分类号： H01J37/28 , H01J37/224 , H01J37/244 , H01J2237/006 , H01J2237/20221 , H01J2237/2445 , H01J2237/2817
摘要： An electron beam inspection system of the image projection type includes a primary electron optical system for shaping an electron beam emitted from an electron gun into a rectangular configuration and applying the shaped electron beam to a sample surface to be inspected. A secondary electron optical system converges secondary electrons emitted from the sample. A detector converts the converged secondary electrons into an optical image through a fluorescent screen and focuses the image to a line sensor. A controller controls the charge transfer time of the line sensor at which the picked-up line image is transferred between each pair of adjacent pixel rows provided in the line sensor in association with the moving speed of a stage for moving the sample.

10. 发明申请

US20080308729A1 Apparatus for inspection with electron beam, method for operating same, and method for manufacturing semiconductor device using former 有权
标题翻译：用于电子束检查的装置，其操作方法以及使用前者制造半导体器件的方法
公开(公告)号：US20080308729A1
公开(公告)日：2008-12-18
申请号：US12216160
申请日：2008-06-30
申请人： Toshifumi Kimba , Tohru Satake , Tsutomu Karimata , Kenji Watanabe , Nobuharu Noji , Takeshi Murakami , Masahiro Hatakeyama , Mamoru Nakasuji , Hirosi Sobukawa , Shoji Yoshikawa , Shin Oowada , Mutsumi Saito
发明人： Toshifumi Kimba , Tohru Satake , Tsutomu Karimata , Kenji Watanabe , Nobuharu Noji , Takeshi Murakami , Masahiro Hatakeyama , Mamoru Nakasuji , Hirosi Sobukawa , Shoji Yoshikawa , Shin Oowada , Mutsumi Saito
IPC分类号： G01N23/20
CPC分类号： H01J37/222 , G01N23/225 , G01N23/2251 , H01J37/06 , H01J37/073 , H01J37/185 , H01J37/20 , H01J37/244 , H01J37/28 , H01J2237/0216 , H01J2237/082 , H01J2237/2002 , H01J2237/2007 , H01J2237/202 , H01J2237/20228 , H01J2237/204 , H01J2237/22 , H01J2237/24564 , H01J2237/2806 , H01J2237/2813 , H01J2237/2816 , H01J2237/2817 , H01L2224/48227 , H01L2924/01019 , H01L2924/01025 , H01L2924/01057 , H01L2924/01067 , H01L2924/01078 , H01L2924/10253 , H01L2924/12032 , H01L2924/3025 , H01L2924/00
摘要： A substrate inspection apparatus 1-1 (FIG. 1) of the present invention performs the following steps of: carrying a substrate “S” to be inspected into an inspection chamber 23-1; maintaining a vacuum in said inspection chamber; isolating said inspection chamber from a vibration; moving successively said substrate by means of a stage 26-1 with at least one degree of freedom; irradiating an electron beam having a specified width; helping said electron beam reach to a surface of said substrate via a primary electron optical system 10-1; trapping secondary electrons emitted from said substrate via a secondary electron optical system 20-1 and guiding it to a detecting system 35-1; forming a secondary electron image in an image processing system based on a detection signal of a secondary electron beam obtained by said detecting system; detecting a defective location in said substrate based on the secondary electron image formed by said image processing system; indicating and/or storing said defective location in said substrate by CPU 37-1; and taking said completely inspected substrate out of the inspection chamber. Thereby, the defect inspection on the substrate can be performed successively with high level of accuracy and efficiency as well as with higher throughput.
摘要翻译：本发明的基板检查装置1-1（图1）执行以下步骤：将要检查的基板“S”运送到检查室23-1中; 在所述检查室中保持真空; 将所述检查室与振动隔离; 通过具有至少一个自由度的平台26-1连续移动所述衬底; 照射具有指定宽度的电子束; 帮助所述电子束经由一次电子光学系统10-1到达所述衬底的表面; 通过二次电子光学系统20-1捕获从所述衬底发射的二次电子并将其引导到检测系统35-1; 基于由所述检测系统获得的二次电子束的检测信号，在图像处理系统中形成二次电子图像; 基于由所述图像处理系统形成的二次电子图像检测所述基板中的缺陷位置; 通过CPU37-1指示和/或存储所述衬底中的所述缺陷位置; 并将完全检查的基板从检查室中取出。因此，可以以高水平的精度和效率以及更高的生产量连续地执行基板上的缺陷检查。

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