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1. 发明授权

US4608494A Component alignment apparatus 失效
标题翻译：元件对准装置
公开(公告)号：US4608494A
公开(公告)日：1986-08-26
申请号：US669437
申请日：1984-11-08
申请人： Mamoru Kobayashi , Hideaki Sasaki , Yasuhiko Hara
发明人： Mamoru Kobayashi , Hideaki Sasaki , Yasuhiko Hara
IPC分类号： G05D3/12 , H01L21/68 , H05K13/04 , G01M11/00 , G01N21/64
CPC分类号： H01L21/681 , H05K13/08 , Y10T29/53091 , Y10T29/53178 , Y10T29/53191
摘要： An apparatus for the alignment of electronic components to be mounted on a printed board. The alignment is accomplished by illuminating the surface of the printed board to cause emission of a fluorescent light from the substrate of the printed board, detecting the fluorescent light by optical means to detect an image of the conductor pattern of the printed board as a negative picture, taking an image of the electronic component leads through a different optical route and calculating the amount of deviation in position of the leads of an electronic component in accordance with the picture data obtained by both images, in order to correct the deviation.
摘要翻译：一种用于对准要安装在印刷电路板上的电子部件的装置。通过照射印刷电路板的表面来引起来自印刷电路板的基板的荧光的发光，通过光学装置检测荧光以检测作为负像的印刷电路板的导体图案的图像来实现对准通过不同的光学路线拍摄电子元件的图像，并根据由两个图像获得的图像数据计算电子元件的引线的位置偏移量，以便校正偏差。

2. 发明授权

US5023407A Printed circuit board with a uniform conductive layer formed by equalization of metals therein 失效
标题翻译：具有通过均匀金属形成的均匀导电层的印刷电路板
公开(公告)号：US5023407A
公开(公告)日：1991-06-11
申请号：US390616
申请日：1989-08-07
申请人： Mitugu Shirai , Kaoru Katayama , Hideaki Sasaki , Shinichi Kazui , Ryohei Satoh , Tateoki Miyauchi , Mamoru Kobayashi
发明人： Mitugu Shirai , Kaoru Katayama , Hideaki Sasaki , Shinichi Kazui , Ryohei Satoh , Tateoki Miyauchi , Mamoru Kobayashi
IPC分类号： B23K1/20 , H01L21/48 , H01L21/52 , H01L21/60 , H01L23/50 , H05K1/03 , H05K1/09 , H05K3/24 , H05K3/34
CPC分类号： H05K3/246 , H01L21/4846 , H01L24/85 , H01L2224/45144 , H01L2224/48463 , H01L2224/85 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/15787 , H05K1/0306 , H05K1/092 , H05K2203/0723 , H05K2203/107 , H05K3/244 , H05K3/3457
摘要： A metal layer other than gold is formed on a ceramic substrate, a gold layer is further formed on said metal layer, and then a high density beam is applied to the treated substrate member. Thereby, the metal of the underlayer diffused through the grain boundaries of gold up to the surface of the gold layer by heat treatment or the like is uniformly mixed with gold to form an alloyed layer excellent in wettability to a solder. At the same time, nonmetallic impurities such as carbon adhering onto the surface of the gold layer are melted and removed.
摘要翻译：在陶瓷基板上形成金以外的金属层，在所述金属层上进一步形成金层，然后将高密度光束施加到处理过的基板部件。由此，通过热处理等将金的晶界扩散到金层的表面的底层的金属与金均匀混合，形成对焊料的润湿性优异的合金化层。同时，将金属杂质如粘附在金层表面上的碳熔化并除去。

3. 发明授权

US06340109B2 Solder bump measuring method and apparatus 失效
标题翻译：焊点测量方法和装置
公开(公告)号：US06340109B2
公开(公告)日：2002-01-22
申请号：US09755106
申请日：2001-01-08
申请人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
发明人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
IPC分类号： B23K3112
CPC分类号： H05K13/08 , G01B11/0608 , H01L22/12
摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.
摘要翻译：在基板上具有多个焊料凸块的工件安装在工件定位机构上，并由光学微头扫描，以测量工件的安装姿势的误差。控制每个阶段以校正误差，然后扫描和测量凸块的顶点位置。测量结果由个人计算机收集，测量结果连同每个轴的控制数据发送到主个人计算机并显示在其屏幕上。计算出每个凸起从回归平面的顶点位置的误差，如果误差小于参考值，则判断为良好。

4. 发明授权

US5231585A Computer-integrated manufacturing system and method 失效
标题翻译：计算机集成制造系统及方法
公开(公告)号：US5231585A
公开(公告)日：1993-07-27
申请号：US541262
申请日：1990-06-20
申请人： Mamoru Kobayashi , Hideaki Sasaki , Kazuo Kato , Akio Kojima , Sigeru Ninomiya , Yoshihisa Tsuji
发明人： Mamoru Kobayashi , Hideaki Sasaki , Kazuo Kato , Akio Kojima , Sigeru Ninomiya , Yoshihisa Tsuji
IPC分类号： B23Q41/08 , B65G61/00 , G05B15/02 , G05B19/418 , G06Q50/00 , G06Q50/04
CPC分类号： G06Q10/06 , G05B19/41865 , Y02P90/04 , Y02P90/10 , Y02P90/18 , Y02P90/20 , Y02P90/24
摘要： A production management system for managing production by using a plurality of working devices arranged in the production processes includes a host management device for managing control data necessary for producing a product, working device managing terminals provided in correspondence with working devices used for the production for processing information necessary in managing the working devices, and a terminal information management device for integrally managing information items which are processed at individual working device management terminals. Each working device management terminal is connected with the terminal information management device through a network to enable transfer of information between each working device terminal and the terminal information management device and between individual working device terminals. Further, working device terminals which require transfer of control data held by the terminal information management device and the host management device are connected to the host management device to enable exchanges of information between the connected devices.
摘要翻译：通过使用在生产过程中布置的多个工作装置来管理生产的生产管理系统包括用于管理生产产品所需的控制数据的主机管理装置，对应于用于处理生产的工作装置提供的工作装置管理终端管理工作装置所需的信息，以及整体管理在各个工作装置管理终端处理的信息的终端信息管理装置。每个工作设备管理终端通过网络与终端信息管理设备连接，以便能够在每个工作设备终端和终端信息管理设备之间以及各个工作设备终端之间传送信息。此外，需要将由终端信息管理装置和主机管理装置保持的控制数据传送的工作装置终端连接到主机管理装置，以实现所连接装置之间的信息交换。

5. 发明授权

US5906309A Solder bump measuring method and apparatus 失效
公开(公告)号：US5906309A
公开(公告)日：1999-05-25
申请号：US759949
申请日：1996-12-03
申请人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
发明人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
IPC分类号： G01B11/02 , G01B11/06 , H01L21/60 , H01L21/66 , H05K13/08 , B23K3/08 , G01B11/24
CPC分类号： H05K13/08 , G01B11/0608 , H01L22/12
摘要： A work having a number of solder bumps on a substrate is mounted on a work positioning mechanism, and scanned by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be good.

6. 发明授权

US5329690A Printed circuit board assembling system 失效
标题翻译：印刷电路板组装系统
公开(公告)号：US5329690A
公开(公告)日：1994-07-19
申请号：US987085
申请日：1992-12-07
申请人： Yoshihisa Tsuji , Sigeru Ninomiya , Kazuo Kato , Mamoru Kobayashi , Akio Kojima , Hideaki Sasaki , Tetsuhiro Yokoyama
发明人： Yoshihisa Tsuji , Sigeru Ninomiya , Kazuo Kato , Mamoru Kobayashi , Akio Kojima , Hideaki Sasaki , Tetsuhiro Yokoyama
IPC分类号： B23P19/00 , B23P21/00 , H05K13/02 , H05K13/04 , H05K13/08
CPC分类号： B23P21/00 , H05K13/0452 , H05K13/08 , Y10T29/49829 , Y10T29/53004 , Y10T29/53048 , Y10T29/53087 , Y10T29/53187 , Y10T29/53265 , Y10T29/53365 , Y10T29/5337 , Y10T29/53409 , Y10T29/53435
摘要： A method of supplying parts in a system for assembling a printed circuit board by mounting the parts on a substrate at corresponding predetermined positions thereof. One or more kinds of substrates and at least one group of parts, to be mounted on the corresponding substrates, are introduced into the system lot by lot. The introduced parts on one or more previously prepared parts containers are placed so as to correspond to the substrates on which the individual parts are to be mounted, thereby providing one or more sets of the parts, each set corresponding to a respective one of the substrates. The sets of parts are supplied to a parts mounting station of the system.
摘要翻译：一种在用于组装印刷电路板的系统中通过将部件安装在基板上的相应预定位置的方法。要安装在相应基板上的一种或多种基板和至少一组部件被批次引入系统。将一个或多个预先准备的部件容器上的引入部件放置成对应于要安装各个部件的基板，从而提供一组或多组部件，每组对应于相应的一个基板。这些零件组被提供给系统的零件安装工位。

7. 发明授权

US06196441B1 Solder bump measuring method and apparatus 失效
标题翻译：焊点测量方法和装置
公开(公告)号：US06196441B1
公开(公告)日：2001-03-06
申请号：US09289386
申请日：1999-04-12
申请人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
发明人： Yutaka Hashimoto , Hideaki Sasaki , Mamoru Kobayashi , Shinichi Kazui
IPC分类号： B23K3102
CPC分类号： H05K13/08 , G01B11/0608 , H01L22/12
摘要： A method of measuring solder bumps formed on a substrate mounting a semiconductor element thereon includes mounting a work to be measured on a work position mechanism, and scanning the work by an optical micro head to measure errors of a mount posture of the work. Each stage is controlled to correct the errors, and thereafter, the apex positions of the bumps are scanned and measured. The measurement results are collected by a personal computer, and the measurement results together with control data of each axis are sent to a main personal computer and displayed on its screen. An error of an apex position of each bump from a regression plane is calculated, and if the error is smaller than a reference value, the work is judged to be satisfactory.
摘要翻译：测量在其上安装半导体元件的衬底上形成的焊料凸块的方法包括：将待测量的工件安装在工件位置机构上，并通过光学微头扫描工件以测量工件的安装姿势的误差。控制每个阶段以校正误差，然后扫描和测量凸块的顶点位置。测量结果由个人计算机收集，测量结果连同每个轴的控制数据发送到主个人计算机并显示在其屏幕上。从回归平面计算每个凸起的顶点位置的误差，如果误差小于参考值，则判断为满意。

8. 发明授权

US4437603A Automatic wiring machine for printed circuit boards 失效
标题翻译：印刷电路板自动接线机
公开(公告)号：US4437603A
公开(公告)日：1984-03-20
申请号：US221458
申请日：1980-12-30
申请人： Mamoru Kobayashi , Kanji Ishige , Hideaki Sasaki , Mitsukiyo Tani , Yashuhiko Kawakami
发明人： Mamoru Kobayashi , Kanji Ishige , Hideaki Sasaki , Mitsukiyo Tani , Yashuhiko Kawakami
IPC分类号： G05B19/40 , G05B19/414 , H05K3/10 , H05K13/06
CPC分类号： H05K13/06 , G05B19/40 , G05B19/4142 , G05B2219/34239 , Y10T29/49162
摘要： A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.
摘要翻译：在布线图案的印刷电路板上自动布线作为布线图案的印刷电路板上的毛发的绝缘细线的机器被设置在相邻的要布线的导体印刷电路板之间，该XY台可在X和Y方向上移动，并且XY台根据配线位置移动。安装在XY工作台上方的线引导单元，接合单元和线切割器单元围绕垂直于XY工作台表面的轴可旋转地支撑的头部被旋转，以便在各个方向上被定向成光学支撑装置用于沿着键合头的旋转轴从上方对操作进行光学监视。导线单元顺序地将绝缘细线支撑到由XY工作台承载的印刷电路板上，接合单元暴露所付出的绝缘电线的芯并将导线熔接到印刷电路板的导体焊盘上通过加热和压下付出的电线，线切割器单元在接线完成之后切断电线。

9. 发明授权

US10361431B2 Lithium ion secondary battery 有权
公开(公告)号：US10361431B2
公开(公告)日：2019-07-23
申请号：US14389430
申请日：2013-03-26
申请人： Hideaki Sasaki , Takehiro Noguchi
发明人： Hideaki Sasaki , Takehiro Noguchi
IPC分类号： H01M4/50 , H01M4/04 , H01M4/1391 , H01M4/505 , H01M4/583 , H01M4/587 , H01M4/62 , H01M10/04 , H01M10/0525
摘要： The present invention relates to a positive electrode for lithium ion secondary batteries, the positive electrode comprising a positive electrode active material and a positive electrode binder, in which the positive electrode active material comprises lithium manganate having a spinel structure, and the positive electrode binder comprises at least polyvinylidene fluoride (PVDF) and a resin having sulfone linkages, and to a lithium ion secondary battery comprising the positive electrode for lithium ion secondary batteries.

10. 发明授权

US09475929B2 Fiber-reinforced thermoplastic resin composition, reinforcing fiber bundle, and process for production of fiber-reinforced thermoplastic resin composition 有权
标题翻译：纤维增强热塑性树脂组合物，增强纤维束，以及纤维增强热塑性树脂组合物的制造方法
公开(公告)号：US09475929B2
公开(公告)日：2016-10-25
申请号：US13575749
申请日：2011-01-26
申请人： Atsuki Tsuchiya , Hideaki Sasaki , Masato Honma , Yumi Ando
发明人： Atsuki Tsuchiya , Hideaki Sasaki , Masato Honma , Ichiji Kageishi , Yumi Ando
IPC分类号： C08K3/04 , C08K7/06 , C08L33/06 , C08L33/10 , C08L23/26 , C08J5/04 , C08L77/00 , C08L81/04 , C08L51/06
CPC分类号： C08L23/26 , C08J5/042 , C08J2333/10 , C08L51/06 , C08L77/00 , C08L81/04 , C08L33/26 , C08L33/066
摘要： The present invention relates to fiber-reinforced thermoplastic resin composition comprising 0.1 to 10 mass % of a (meth)acrylic-based polymer, 1 to 70 mass % of reinforcing fiber, and 20 to 98.9 mass % of thermoplastic resin, wherein the (meth)acrylic-based polymer has, in a side chain, at least one functional group selected from a hydroxyl group, a carboxyl group, an amide group, and an urea group, and has a cohesive energy density (CED) of 385 to 550 MPa. The present invention provides, particularly in the case of using a polyolefin-based resin as matrix resin, a fiber-reinforced thermoplastic resin composition and a reinforcing fiber bundle which have high adhesiveness and good mechanical characteristics.
摘要翻译：本发明涉及含有0.1〜10质量％的（甲基）丙烯酸系聚合物，1〜70质量％的增强纤维和20〜98.9质量％的热塑性树脂的纤维增强热塑性树脂组合物，其中，（甲基））丙烯酸类聚合物在侧链中具有选自羟基，羧基，酰胺基和脲基中的至少一种官能团，并且具有385〜550MPa的内聚能密度（CED）。特别是在使用聚烯烃类树脂作为基体树脂的情况下，具有高粘合性和良好的机械特性的纤维增强热塑性树脂组合物和增强纤维束。

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