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    • 3. 发明授权
    • Process for forming high voltage junction termination extension oxide
    • 用于形成高压结端接延长氧化物的工艺
    • US06309952B1
    • 2001-10-30
    • US09167177
    • 1998-10-06
    • Rodney S. RidleyJason R. TrostRaymond J. Webb
    • Rodney S. RidleyJason R. TrostRaymond J. Webb
    • H01L21425
    • H01L21/02238H01L21/02255H01L21/0332H01L21/0337H01L21/2253H01L21/266H01L21/31662H01L29/0619
    • A process for forming a junction termination extension (JTE) oxide having reduced total oxide charge and SiO2—Si interface trap density parameters uses precursor densified thin oxide layers to improve the quality of subsequently formed thicker oxide layers, and multiple anneals to remove implant damage and set geometry parameters. After formation of a first dual oxide layer, and a post-oxidation anneal, the oxide is patterned and JTE regions are implanted. Implant-based near surface crystalline damage is annealed out in a non-oxidizing ambient, and JTE dopants are partially driven into adjoining material of the substrate. A thin dense bulk precursor oxide layer is grown on the exposed JTE dopant-implanted surface portions of the substrate, followed by forming the bulk of the JTE oxide in a steam or wet oxygen atmosphere. The substrate is then annealed in a non-oxidizing ambient, to cause a further drive-in of the JTE dopants. The associated reduction in Qox and Dit improves high voltage edge stability.
    • 用于形成具有降低的总氧化物电荷和SiO 2 -Si界面陷阱密度参数的连接终止延伸(JTE)氧化物的方法使用前体致密的薄氧化物层来改善随后形成的较厚氧化物层的质量,以及多次退火以去除植入物损伤和 设置几何参数。 在形成第一双氧化物层和后氧化退火之后,对氧化物进行图案化并注入JTE区域。 基于种植体的近表面结晶损伤在非氧化环境中退火,并且JTE掺杂剂被部分驱动到基底的相邻材料中。 在衬底的暴露的JTE掺杂剂注入的表面部分上生长薄的密集体前体氧化物层,然后在蒸汽或湿氧气氛中形成大部分JTE氧化物。 然后将衬底在非氧化环境中退火,以引起JTE掺杂剂的进一步驱入。 相关的Qox和Dit降低提高了高电压边缘的稳定性。