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    • 7. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20070215885A1
    • 2007-09-20
    • US11685941
    • 2007-03-14
    • Makoto MIYOSHIYoshitaka Kuraoka
    • Makoto MIYOSHIYoshitaka Kuraoka
    • H01L33/00
    • H01L29/267H01L29/2003H01L29/861H01L29/872
    • A semiconductor device having small leakage current and high breakdown voltage during reverse blocking, small on-state resistance and large output current at forward conduction, short reverse recovery time at shutoff, and high peak surge current value is provided. An n-type layer is made of a group-III nitride, and a p-type layer is made of a group-IV semiconductor material having a smaller band gap than the group-III nitride. The energy level at the top of the valence band of the n-type layer is lower than the energy level at the top of the valence band of the p-type layer, so that a P—N junction semiconductor device satisfying the above requirements is obtained. Further, a combined structure of P—N junction and Schottky junction by additionally providing an anode electrode to be in Schottky contact with the n-type layer also achieves the effect of decreasing voltage at the rising edge of current resulting from the Schottky junction.
    • 提供了在反向阻断时具有小的漏电流和高击穿电压的半导体器件,小导通状态电阻和正向导通时的大输出电流,关断时的反向恢复时间短以及高峰值浪涌电流值。 n型层由III族氮化物制成,p型层由具有比III族氮化物更小的带隙的IV族半导体材料制成。 n型层的价带顶部的能级低于p型层的价带顶部的能级,从而获得满足上述要求的P-N结半导体器件。 此外,通过额外提供与n型层肖特基接触的阳极电极,P-N结和肖特基结的组合结构也实现了在肖特基结的电流上升沿降低电压的效果。