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1. 发明授权

US5041901A Lead frame and semiconductor device using the same 失效
标题翻译：引线框和半导体器件使用相同
公开(公告)号：US5041901A
公开(公告)日：1991-08-20
申请号：US518410
申请日：1990-05-02
申请人： Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Sueo Kawai , Akio Hoshi , Ichio Shimizu
发明人： Makoto Kitano , Asao Nishimura , Akihiro Yaguchi , Sueo Kawai , Akio Hoshi , Ichio Shimizu
IPC分类号： H01L23/50 , H01L23/495 , H05K3/34
CPC分类号： H01L23/49582 , H05K3/3426 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/181 , H05K2201/10689 , H05K2201/10772 , H05K2201/10909 , H05K2201/2081 , Y02P70/613
摘要： A lead frame having a plurality of inner leads and outer leads, said outer leads being subjected to surface treatment for improving solder wettability at an end portion and to sruface treatment for suppressing solder wettability at least at a portion neighboring to the end portion, or said outer leads being bent 4 times or more, is effective for improving thermal fatigue life and reliability when applied to a semi-conductor device.
摘要翻译：具有多个内引线和外引线的引线框架，所述外引线经受表面处理以改善端部处的焊料润湿性，以及至少在与端部相邻的部分处抑制焊料润湿性的表面处理，或所述外引线弯曲4倍以上，适用于半导体器件时，有效提高热疲劳寿命和可靠性。

2. 发明授权

US5150193A Resin-encapsulated semiconductor device having a particular mounting structure 失效
标题翻译：具有特定安装结构的树脂封装的半导体器件
公开(公告)号：US5150193A
公开(公告)日：1992-09-22
申请号：US653244
申请日：1991-02-11
申请人： Toshihiro Yasuhara , Masachika Masuda , Gen Murakami , Kunihiko Nishi , Masanori Sakimoto , Ichio Shimizu , Akio Hoshi , Sumio Okada , Tooru Nagamine
发明人： Toshihiro Yasuhara , Masachika Masuda , Gen Murakami , Kunihiko Nishi , Masanori Sakimoto , Ichio Shimizu , Akio Hoshi , Sumio Okada , Tooru Nagamine
IPC分类号： H01L23/495
CPC分类号： H01L24/85 , H01L23/49503 , H01L23/49513 , H01L23/49541 , H01L24/05 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/04042 , H01L2224/05073 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/29111 , H01L2224/2919 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/456 , H01L2224/45644 , H01L2224/48091 , H01L2224/48247 , H01L2224/4845 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/48799 , H01L2224/48824 , H01L2224/49113 , H01L2224/73265 , H01L2224/78268 , H01L2224/78301 , H01L2224/83385 , H01L2224/83855 , H01L2224/85045 , H01L2224/85181 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L24/45 , H01L24/73 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01205 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/15738 , H01L2924/15747 , H01L2924/1576 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/351
摘要： The present invention consists in that a through hole of large area is provided in a die pad or a tab, thereby to prevent a resin from cracking at the rear surface of a surface-packaging resin package in a high-temperature soldering atmosphere of vapor-phase reflow or the like, whereby a resin-molded surface-packaged IC of high reliability is provided.
摘要翻译：本发明的特征在于，在芯片焊盘或突片中设置大面积的贯通孔，防止树脂在气相成膜用高温焊接气氛中的表面封装树脂封装的背面开裂，相回流等，由此提供了高可靠性的树脂模制表面封装IC。

3. 发明授权

US4920074A Surface mount plastic package semiconductor integrated circuit, manufacturing method thereof, as well as mounting method and mounted structure thereof 失效
标题翻译：表面贴装塑料封装半导体集成电路及其制造方法，以及其安装方法和安装结构
公开(公告)号：US4920074A
公开(公告)日：1990-04-24
申请号：US160177
申请日：1988-02-25
申请人： Ichio Shimizu , Akio Hoshi , Sumio Okada , Soichiro Nakamura
发明人： Ichio Shimizu , Akio Hoshi , Sumio Okada , Soichiro Nakamura
IPC分类号： H01L21/48 , H01L23/495 , H05K3/34
CPC分类号： H01L24/85 , H01L21/4821 , H01L23/49541 , H01L23/49582 , H01L24/03 , H01L24/05 , H01L24/48 , H01L24/97 , H05K3/3426 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/29339 , H01L2224/32245 , H01L2224/45015 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48799 , H01L2224/48824 , H01L2224/49171 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2224/85205 , H01L2224/97 , H01L24/45 , H01L24/49 , H01L24/73 , H01L24/78 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01082 , H01L2924/01205 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/20753 , H01L2924/351 , H05K2201/10689 , H05K2201/1084 , H05K2201/10924 , Y02P70/613 , Y10T29/49121 , Y10T29/49172
摘要： The present invention provides a surface mount Gull-Wing type resin-encapsulating package for encapsulating a semiconductor chip, wherein the cut face (outer tip end) of each outer lead is formed to have a smaller cross-sectional area than that of each outer lead, for improving the extension of solder to the cut face of that lead. Such relatively smaller cross-sectional area of the outer tip end of each outer lead reduces the exposed area of the lead material when disconnecting the leads from the frame in separating the device from the frame.
摘要翻译：本发明提供了一种用于封装半导体芯片的表面贴装鸥翼型树脂封装封装，其中每个外部引线的切割面（外部末端）形成为具有比每个外部引线更小的横截面积，用于改善焊料对该引线的切割面的延伸。当将装置与框架分离时，每个外引线的外尖端的相对较小的横截面面积减小了引线材料的暴露面积。

4. 发明授权

US5343457A Disk drive apparatus 失效
标题翻译：磁盘驱动装置
公开(公告)号：US5343457A
公开(公告)日：1994-08-30
申请号：US924856
申请日：1992-08-04
申请人： Akio Hoshi
发明人： Akio Hoshi
IPC分类号： G11B17/04
CPC分类号： G11B17/0438
摘要： A disk drive apparatus according to this invention is arranged to record or reproduce information on or from a disk, which serves as a recording medium, by moving a head thereon in a predetermined direction while rotating the disk. The disk drive apparatus includes, in one preferred form, an operating member turnably supported on a base, and a holder for holding the disk within the disk drive apparatus in such a manner as to cause the disk to selectively move to a first location where the disk can be inserted or ejected and to a second location where information can be recorded or reproduced on or from the disk. The holder is arranged to move with the insertion of the disk in an inserting direction of the disk, while the operating member turns in a predetermined direction in association with the holder moving in the inserting direction of the disk. When the holder turns through a predetermined angle, the holder reaches the second location.
摘要翻译：根据本发明的磁盘驱动装置被设置为通过在旋转磁盘的同时在预定方向上移动磁头来在用作记录介质的磁盘上或从磁盘上记录或再现信息。磁盘驱动装置包括一个优选形式，可转动地支撑在基座上的操作构件和用于将盘保持在盘驱动装置内的保持器，以便使盘选择性地移动到第一位置，在第一位置，磁盘可以被插入或弹出，并且到第二个位置，在该位置可以在磁盘上记录或重放信息。保持器布置成随着盘的插入方向沿盘的插入方向移动，同时操作构件与保持器沿盘的插入方向移动相关联地沿预定方向转动。当保持器转过预定角度时，保持器到达第二位置。

5. 发明授权

US4736358A Recording medium clamping apparatus 失效
标题翻译：记录介质夹紧装置
公开(公告)号：US4736358A
公开(公告)日：1988-04-05
申请号：US887612
申请日：1986-07-21
申请人： Akio Hoshi , Yuji Yokota , Haruhiko Okumura
发明人： Akio Hoshi , Yuji Yokota , Haruhiko Okumura
IPC分类号： G11B17/028 , G11B17/04 , G11B3/62
CPC分类号： G11B17/0284
摘要： A clamp operating member which is bendable cooperates with a spindle to support a clamping member which cooperates to clamp a disc-shaped recording medium and to position the clamping member in a clamped position and an unclamped position. The arrangement has a restraining member engaging with the clamp operating member to bend the clamp operating member when the clamp operating member is in a position to position the clamping member in an unclamped position. The clamp operating member is bent by the restraining member when in the unclamped condition to reduce an operating space occupied by the clamp operating member.
摘要翻译：夹紧操作构件，其可弯曲地与主轴配合以支撑夹紧构件，所述夹紧构件协作夹紧盘形记录介质并将夹紧构件定位在夹紧位置和未夹紧位置。当夹具操作构件处于将夹紧构件定位在未夹紧位置的位置时，该装置具有与夹紧操作构件接合的限制构件以弯曲夹紧操作构件。夹紧操作构件在处于松开状态时被限制构件弯曲以减小夹紧操作构件所占据的操作空间。

6. 发明授权

US4702371A Container for electrical components 失效
标题翻译：电器组件容器
公开(公告)号：US4702371A
公开(公告)日：1987-10-27
申请号：US879012
申请日：1986-06-26
申请人： Akio Hoshi , Toshiyuki Oura
发明人： Akio Hoshi , Toshiyuki Oura
IPC分类号： B65D85/86 , B65D85/30 , H05K13/00 , H05F3/02 , H05F3/00
CPC分类号： H05K13/0084
摘要： A container for electrical components is formed of an elongated tube of a plastic material. A top wall of the tube consists of a lengthwise-extending transparent window, and electrically conductive portions sandwiching the transparent window. In order to prevent the electrostatic breakdown of the electrical components, which occurs when the electrical components contact the transparent window, the window is made thinner than the electrically conductive portions of the top wall of the tube so that the plane including the lower surface of the window and the plane including the lower surfaces of the conductive portions are spaced at a predetermined distance.
摘要翻译：用于电气部件的容器由塑料材料的细长管形成。管的顶壁由纵向延伸的透明窗和夹在透明窗的导电部分组成。为了防止当电气部件接触透明窗时发生的电气部件的静电破坏，使得窗口比管的顶壁的导电部分薄，使得包括下表面的平面并且包括导电部分的下表面的平面间隔开预定距离。

7. 发明授权

US07235329B2 Electrode material for non-aqueous solvent-secondary cell, electrode and secondary cell 有权
标题翻译：用于非水溶剂二次电池，电极和二次电池的电极材料
公开(公告)号：US07235329B2
公开(公告)日：2007-06-26
申请号：US11378300
申请日：2006-03-20
申请人： Minoru Ishikawa , Kazuhiko Shimizu , Takashi Wakahoi , Shuji Morinishi , Naohiro Sonobe , Akio Hoshi
发明人： Minoru Ishikawa , Kazuhiko Shimizu , Takashi Wakahoi , Shuji Morinishi , Naohiro Sonobe , Akio Hoshi
IPC分类号： H01M4/58
CPC分类号： H01M4/583 , H01M4/02 , H01M4/364 , H01M4/38 , H01M4/46 , H01M10/052 , H01M2004/027
摘要： An electrode material comprising a powdery mixture of a metal material (particularly, an intermetallic compound) and a capacitive carbon material each capable of doping and dedoping lithium, and an optionally added fine electroconductive additive, and containing the metal material and the capacitive carbon material in amounts of 5-60 wt. % and 40-95 wt. %, respectively, is used as an active substance for an electrode, particularly a negative electrode, of a non-aqueous solvent secondary cell. As a result, there is provided a non-aqueous solvent secondary cell which has large charge-discharge capacities, a small irreversible capacity determined as a difference between the doping capacity and the de-doping capacity, and also excellent cycle characteristics.
摘要翻译：一种电极材料，其包含金属材料（特别是金属间化合物）和能够掺杂和去掺杂锂的电容性碳材料的粉末混合物，以及任选加入的细导电添加剂，并且含有金属材料和电容性碳材料用量5-60wt。％和40-95wt。％分别用作非水溶剂二次电池的电极，特别是负极的活性物质。结果，提供了一种非水溶剂二次电池，其具有大的充电放电容量，小的不可逆容量被确定为掺杂容量和去掺杂能力之间的差异，并且还具有优异的循环特性。

8. 发明授权

US07147970B2 Electrode material for non-aqueous solvent secondary cell, electrode and secondary cell 有权
公开(公告)号：US07147970B2
公开(公告)日：2006-12-12
申请号：US10258169
申请日：2002-02-20
申请人： Minoru Ishikawa , Kazuhiko Shimizu , Takashi Wakahoi , Shuji Morinishi , Naohiro Sonobe , Akio Hoshi
发明人： Minoru Ishikawa , Kazuhiko Shimizu , Takashi Wakahoi , Shuji Morinishi , Naohiro Sonobe , Akio Hoshi
IPC分类号： H01M4/48
CPC分类号： H01M4/583 , H01M4/02 , H01M4/364 , H01M4/38 , H01M4/46 , H01M10/052 , H01M2004/027
摘要： An electrode material comprising a powdery mixture of a metal material (particularly, an intermetallic compound) and a capacitive carbon material each capable of doping and dedoping lithium, and an optionally added fine electroconductive additive, and containing the metal material and the capacitive carbon material in amounts of 5–60 wt. % and 40–95 wt. %, respectively, is used as an active substance for an electrode, particularly a negative electrode, of a non-aqueous solvent secondary cell. As a result, there is provided a non-aqueous solvent secondary cell which has large charge-discharge capacities, a small irreversible capacity determined as a difference between the doping capacity and the de-doping capacity, and also excellent cycle characteristics.

9. 发明授权

US5079656A Magnetic disc mounting arrangement having a single bearing which rotates a spindle with high rotational accuracy and planarity 失效
标题翻译：具有旋转具有高旋转精度和平面度的主轴的单轴承的磁盘安装布置
公开(公告)号：US5079656A
公开(公告)日：1992-01-07
申请号：US425927
申请日：1989-11-08
申请人： Akio Hoshi
发明人： Akio Hoshi
IPC分类号： G11B19/20
CPC分类号： G11B19/2009
摘要： A disc driving unit is arranged so that a spindle for rotating a disc member, a pulley coupled to the spindle to transmit a rotational force to the spindle, and an inner or outer ring of a bearing to support the spindle rotatably are formed integrally. This arrangement greatly reduces a number of components in the unit so that the assembly process can be greatly simplified. Moreover, the error during assembly can be kept small. Furthermore, the bearing is disposed inside the rotating plane of the spindle, so that the rotational accuracy and planarity of the spindle are improved, and the overall height of the unit can be minimized.

10. 发明授权

US4887175A Disc driving unit 失效
标题翻译：光盘驱动单元
公开(公告)号：US4887175A
公开(公告)日：1989-12-12
申请号：US229793
申请日：1988-08-04
申请人： Akio Hoshi
发明人： Akio Hoshi
IPC分类号： G11B19/20
CPC分类号： G11B19/2009
摘要： A disc driving unit is arranged so that a spindle for rotating a disc member, a pulley coupled to the spindle to transmit a rotational force to the spindle, and an inner or outer ring of a bearing to support the spindle rotatably are formed integrally. This arrangement greatly reduces a number of components in the unit so that the assembly process can be greatly simplified. Moreover, the error during assembly can be kept small. Furthermore, the bearing is disposed inside the rotating plane of the spindle, so that the rotational accuracy and planarity of the spindle are improved, and the overall height of the unit can be minimized.
摘要翻译：盘驱动单元被布置成使得用于旋转盘构件的主轴，联接到主轴以将旋转力传递到主轴的滑轮以及可旋转地支撑主轴的轴承的内圈或外圈一体地形成。这种布置大大减少了单元中的多个部件，从而可以大大简化组装过程。此外，组装期间的误差可以保持较小。此外，轴承设置在主轴的旋转平面内，使得主轴的旋转精度和平面度得到改善，并且可以使单元的整体高度最小化。

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