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1. 发明授权

US06969907B2 Cooling structure for multichip module 有权
标题翻译：多芯片模块的冷却结构
公开(公告)号：US06969907B2
公开(公告)日：2005-11-29
申请号：US10262865
申请日：2002-10-03
申请人： Makoto Imai , Naoki Ogawa , Yuji Yagi , Takashi Kojima , Yasushi Yamada
发明人： Makoto Imai , Naoki Ogawa , Yuji Yagi , Takashi Kojima , Yasushi Yamada
IPC分类号： H01L23/36 , H01L23/367 , H01L25/07 , H01L23/34 , H01L23/02 , H01L23/28 , H01L23/38 , H01L23/40
CPC分类号： H01L23/3672 , H01L25/072 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , Y10S257/93 , H01L2924/00
摘要： A first electronic device, a second electronic device which generates less heat than the first electric device, and an electrode are connected by a heat leveling plate formed of an electrically conductive material having high thermal conductivity. A heat radiation plate is provided below an insulated substrate to which the first and second electronic devices are mounted. The second electronic device is cooled by a heat radiation path which extends through the insulated substrate and the heat radiation plate and a heat radiation path which extends through the second electronic device and the electrode to the heat radiation plate. The first and the second electronic device have substantially the same temperature due to heat radiation through the heat leveling plate. As a result, cooling effect of the electronic devices can be enhanced.
摘要翻译：第一电子装置，比第一电气装置产生的热量少的第二电子装置和电极通过由具有高导热性的导电材料形成的热平衡板连接。散热板设置在安装有第一和第二电子设备的绝缘基板的下方。第二电子设备被延伸穿过绝缘基板和散热板的热辐射路径和通过第二电子设备和电极延伸到散热板的散热路径来冷却。第一和第二电子装置由于通过热平整板的热辐射而具有基本相同的温度。结果，可以提高电子设备的冷却效果。

2. 发明授权

US08471386B2 Junction body, semiconductor module, and manufacturing method for junction body 失效
标题翻译：接合体，半导体模块及接合体的制造方法
公开(公告)号：US08471386B2
公开(公告)日：2013-06-25
申请号：US13148150
申请日：2010-02-02
申请人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
发明人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
IPC分类号： H01L23/48
CPC分类号： B23K35/007 , B22F7/006 , B22F7/08 , B23K35/262 , B23K35/28 , B23K35/30 , B32B15/01 , C22C9/02 , C22C13/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1517 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H01L2924/05432 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014
摘要： A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.
摘要翻译：接合体具有第一构件和第二构件，每个构件具有主要成分为铜的接合表面。在锡基焊料中含有主要成分为铜的三维网状结构的焊料构件设置在第一构件和第二构件之间。平均厚度为2μm以上且20μm以下的铜锡合金设置在接合面和三维网状结构体之间。

3. 发明申请

US20100109016A1 POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：功率半导体模块
公开(公告)号：US20100109016A1
公开(公告)日：2010-05-06
申请号：US12596382
申请日：2008-04-17
申请人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
发明人： Yuji Yagi , Yasushi Yamada , Ikuo Nakagawa , Takashi Atsumi , Mikio Shirai , Ikuo Ohnuma , Kiyohito Ishida , Yoshikazu Takaku
IPC分类号： H01L23/488 , H01L29/12
CPC分类号： H01L23/3735 , H01L23/473 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L25/072 , H01L2224/29111 , H01L2224/29113 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/83447 , H01L2224/838 , H01L2224/83805 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/1579 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/01013 , H01L2924/01025 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2224/83205
摘要： Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.
摘要翻译：提供了一种功率半导体模块，其中两个部件通过Bi基焊料材料接合。在其表面上设置有Cu层，以通过Bi基焊料材料粘接在双组分上。两个部件，即待接合的部件，是半导体元件和绝缘部件的组合，或绝缘部件和散热器板的组合。绝缘部由Cu / SiNx / Cu层叠体构成。

4. 发明授权

US08283783B2 Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same 有权
标题翻译：焊料，其制造方法，接合体，其制造方法，功率半导体模块及其制造方法
公开(公告)号：US08283783B2
公开(公告)日：2012-10-09
申请号：US12669346
申请日：2008-11-19
申请人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
发明人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： C22C18/04 , B23K35/282 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/27013 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29118 , H01L2224/29298 , H01L2224/32014 , H01L2224/83051 , H01L2224/83101 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/1579 , H01L2924/19042 , H01L2924/351 , Y10T428/12222 , H01L2924/00 , H01L2924/01049 , H01L2924/01028 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.
摘要翻译：本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。

5. 发明申请

US20110291282A1 JUNCTION BODY, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR JUNCTION BODY 失效
标题翻译：连接体，半导体模块和结构体的制造方法
公开(公告)号：US20110291282A1
公开(公告)日：2011-12-01
申请号：US13148150
申请日：2010-02-02
申请人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
发明人： Yasushi Yamada , Hiroshi Osada , Yuji Yagi , Tadafumi Yoshida
IPC分类号： H01L23/14 , B23K1/20 , H01B5/00
CPC分类号： B23K35/007 , B22F7/006 , B22F7/08 , B23K35/262 , B23K35/28 , B23K35/30 , B32B15/01 , C22C9/02 , C22C13/00 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/83801 , H01L2224/83805 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/10253 , H01L2924/10272 , H01L2924/1033 , H01L2924/1517 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H01L2924/05432 , H01L2924/00 , H01L2924/01014 , H01L2924/01083 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014
摘要： A junction body has a first member and a second member each of which is provided with a joining surface whose main component is copper. A solder member containing, in a tin-base solder material, a three-dimensional web structure whose main component is copper is provided between the first member and the second member. A copper-tin alloy whose average thickness is 2 μm or more but 20 μm or less is provided between the joining surfaces and the three-dimensional web structure.
摘要翻译：接合体具有第一构件和第二构件，每个构件具有主要成分为铜的接合表面。在锡基焊料中含有主要成分为铜的三维网状结构的焊料构件设置在第一构件和第二构件之间。平均厚度为2μm以上且20μm以下的铜锡合金设置在接合面和三维网状结构体之间。

6. 发明申请

US20100193801A1 SOLDER MATERIAL, METHOD FOR MANUFACTURING THE SAME, JOINED BODY, METHOD FOR MANUFACTURING THE SAME, POWER SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：焊料，其制造方法，接合体，制造方法，功率半导体模块及其制造方法
公开(公告)号：US20100193801A1
公开(公告)日：2010-08-05
申请号：US12669346
申请日：2008-11-19
申请人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
发明人： Yasushi Yamada , Yuji Yagi , Yoshikazu Takaku , Ikuo Ohnuma , Kiyohito Ishida , Takashi Atsumi , Ikuo Nakagawa , Mikio Shirai
IPC分类号： H01L23/488 , H01L21/60 , H01L29/12 , H01B5/00 , B23K35/14 , B23K1/20 , B05D3/00
CPC分类号： C22C18/04 , B23K35/282 , B23K35/40 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26175 , H01L2224/27013 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29118 , H01L2224/29298 , H01L2224/32014 , H01L2224/83051 , H01L2224/83101 , H01L2224/83801 , H01L2924/00011 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0134 , H01L2924/0135 , H01L2924/014 , H01L2924/1579 , H01L2924/19042 , H01L2924/351 , Y10T428/12222 , H01L2924/00 , H01L2924/01049 , H01L2924/01028 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/83205
摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.
摘要翻译：本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。

7. 发明申请

US20130085270A1 MANUFACTURING METHOD FOR POLYPHENOL COMPOSITION 有权
公开(公告)号：US20130085270A1
公开(公告)日：2013-04-04
申请号：US13703220
申请日：2011-06-08
申请人： Yasushi Yamada , Keigo Hanaki , Toshiteru Komatsu
发明人： Yasushi Yamada , Keigo Hanaki , Toshiteru Komatsu
IPC分类号： C07H17/07
CPC分类号： C07H17/07 , A61K31/05 , A61K31/192 , A61K31/366 , A61K31/7048 , Y02P20/582
摘要： A method for producing a polyphenol composition including a step of subjecting (A) a hardly water-soluble polyphenol and (B) one or more selected from cathechins, chlorogenic acids and methylated compounds of hardly water-soluble polyphenols to a heat treatment at from 100 to 180° C. in the presence of an aqueous medium.

8. 发明申请

US20110091689A1 POLYURETHANE FOAM FOR FLAME-LAMINATING 有权
标题翻译：聚氨酯泡沫用于火焰层压
公开(公告)号：US20110091689A1
公开(公告)日：2011-04-21
申请号：US12997878
申请日：2009-06-23
申请人： Fuminori Horio , Yasushi Yamada
发明人： Fuminori Horio , Yasushi Yamada
IPC分类号： B32B3/12
CPC分类号： C08G18/4837 , C08G18/165 , C08G18/18 , C08G18/2027 , C08G18/246 , C08G18/4018 , C08G18/4072 , C08G18/4261 , C08G18/48 , C08G18/632 , C08G2101/00 , C08G2101/0083 , Y10T428/24512 , Y10T428/249953
摘要： The object of the present invention is to provide a polyurethane foam for flame lamination which has an excellent balance between adhesiveness to a fabric comprising synthetic fibers or natural fibers, a leather or the like and residual compression strain and has an excellent wet-heat resistance, and a laminated body including a foamed material layer consisting of the polyurethane foam. The polyurethane foam for flame lamination is characterized by being produced using a foam raw material containing a polyol such as a polyether polyol, a polyisocyanate, a foaming agent, a foam control agent, an amine-based catalyst and a urea compound such as urea and azodicarbonamide.
摘要翻译：本发明的目的是提供一种用于火焰层压的聚氨酯泡沫，其在与包含合成纤维或天然纤维的织物的粘合性，皮革等之间和残余压缩应变之间具有优异的平衡，并且具有优异的耐湿热性，以及包含由聚氨酯泡沫构成的发泡材料层的层叠体。用于火焰层压的聚氨酯泡沫的特征在于使用含有多元醇的泡沫原料，例如聚醚多元醇，多异氰酸酯，发泡剂，泡沫控制剂，胺类催化剂和尿素化合物如尿素和偶氮二甲酰胺。

9. 发明申请

US20090138728A1 Program update method and server 有权
公开(公告)号：US20090138728A1
公开(公告)日：2009-05-28
申请号：US12081889
申请日：2008-04-23
申请人： Makoto Fujiwara , Yusuke Nemoto , Junichi Yasui , Takuji Maeda , Takayuki Ito , Yasushi Yamada , Shinji Inoue
发明人： Makoto Fujiwara , Yusuke Nemoto , Junichi Yasui , Takuji Maeda , Takayuki Ito , Yasushi Yamada , Shinji Inoue
IPC分类号： G06F12/14
CPC分类号： G06F21/123 , G06F21/572 , G06F21/72
摘要： A system including a secure LSI 1 establishes a communication path to/from a server 3 (UD1), and receives a common key-encrypted program generated by encryption with a common key and transmitted from the server 3 (UD6 and UD7). The received common key-encrypted program is decrypted to generate a raw program, and the raw program is re-encrypted with an inherent key to newly generate an inherent key-encrypted program, which is stored in an external memory.

10. 发明授权

US07325975B2 Optical module with lever that abuts case to release latch from locking state with cage which accommodates optical module 失效
标题翻译：具有杆的光学模块，其与壳体抵接以将锁定器从锁定状态释放，其具有容纳光学模块的保持架
公开(公告)号：US07325975B2
公开(公告)日：2008-02-05
申请号：US10844500
申请日：2004-05-13
申请人： Yasushi Yamada , Masayuki Nakano
发明人： Yasushi Yamada , Masayuki Nakano
IPC分类号： G02B6/40
CPC分类号： G02B6/4292 , G02B6/4201 , G02B6/4246 , G02B6/4261
摘要： An optical module has a lever for bending a spring plate possessed by a cage for accommodating a case of the optical module in a direction in which a retaining hole formed through the spring plate comes off a latch formed on the case. The lever has a shaft pivotably supported on the case, a tongue disposed on one side of the shaft, and an actuator disposed on the opposite side of the shaft with respect to the tongue. The lever pivotally moves about the shaft in response to a movement of the tongue toward the case, causing the actuator to press the spring plate to bend in the foregoing direction. A user can readily release the latch by moving the tongue toward the case, and withdraw the optical module from the cage through a simple manipulation of pulling the case out while holding the case and tongue together.
摘要翻译：光学模块具有用于弯曲由用于容纳光学组件的壳体的保持架所具有的弹簧板的杆，该弹簧板沿着通过弹簧板形成的保持孔脱离形成在壳体上的闩锁的方向。所述杠杆具有可枢转地支撑在所述壳体上的轴，设置在所述轴的一侧上的舌片以及相对于所述舌片设置在所述轴的相对侧上的致动器。响应于舌头朝向壳体的移动，杠杆绕轴转动，致使致动器按压弹簧板沿前述方向弯曲。用户可以通过将舌头朝向壳体移动而容易地释放闩锁，并且通过简单的操纵将外壳和舌头保持在一起来拉出外壳，从而将光学模块从笼子中取出。

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