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1. 发明申请

US20100245030A1 Processes for Producing Thin-Film Sensors, Thin-Film Sensors and Thin-Film Sensor Modules 审中-公开
标题翻译：生产薄膜传感器，薄膜传感器和薄膜传感器模块的工艺
公开(公告)号：US20100245030A1
公开(公告)日：2010-09-30
申请号：US12294849
申请日：2007-03-28
申请人： Makoto Ikeda , Mitsuhiro Wada , Shinichi Inoue , Minoru Isshiki , Jae-Won Lim , Joon Woon Bae
发明人： Makoto Ikeda , Mitsuhiro Wada , Shinichi Inoue , Minoru Isshiki , Jae-Won Lim , Joon Woon Bae
IPC分类号： H01C1/012 , H01C17/12
CPC分类号： H01C17/12 , G01J5/02 , G01J5/024 , G01J5/04 , G01J5/046 , H01C7/006 , H01L37/00 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , Y10T29/49085 , Y10T29/49099 , H01L2924/00014 , H01L2924/00
摘要： It is an object to provide processes for the production of thin-film sensors whereby crystals are strongly oriented without cost-adding steps such as heating and variations in electrical properties are small among the obtainable products. A process of producing a thin-film sensor is a process of producing a thin-film sensor that include an insulating substrate and an electrical resistor which is made of a metal and is provided on the insulating substrate, the process including a step of forming the electrical resistor by sputtering the metal while applying a negative direct-current voltage to the insulating substrate.
摘要翻译：本发明的目的是提供用于生产薄膜传感器的方法，其中晶体被强取向，而不需要诸如加热的成本增加步骤，并且可获得的产品中电性能的变化很小。制造薄膜传感器的方法是制造薄膜传感器的过程，该薄膜传感器包括绝缘基板和由金属制成并设置在绝缘基板上的电阻器，该方法包括以下步骤：通过溅射金属，同时向绝缘基板施加负的直流电压。

2. 发明申请

US20090247681A1 Curable Silicone Composition And Cured Product Therefrom 失效
标题翻译：可固化硅胶组合物及其固化产品
公开(公告)号：US20090247681A1
公开(公告)日：2009-10-01
申请号：US11912631
申请日：2006-04-27
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
IPC分类号： C08K3/08 , C08L83/04
CPC分类号： C08L83/06 , C08K3/08 , C08L83/04 , C09D183/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3 SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0≦a≦0.8, 0≦b≦0.8, 0.2≦c≦0.9, 0≦d
摘要翻译：一种可固化有机硅组合物，其包含：（A）由平均单元式表示的有机聚硅氧烷：（R 13 SiO 1/2）a（R 22 SiO 2/2）b（R 3 SiO 3/2）c（SiO 4/2）d（其中R 1，R 2 和R 3各自独立地选自取代或未取代的单价烃基和环氧官能的一价有机基团，条件是至少20摩尔％的R 3是芳基，a，b，c和d是满足 0 <= a <= 0.8,0 <= b <= 0.8,0.2 <= c <= 0.9,0 <= d <0.8，a + b + c + d = 1），并且具有至少两个上述环氧官能单价有机基团; （B）具有能够与环氧基反应的基团的化合物; （C）固化促进剂; 和（D）导热填料，具有优异的处理特性，并快速固化，得到高导热性，非常柔性，高粘合性和非常阻燃的固化产物。

3. 发明申请

US20070282058A1 Curing Silicone Composition and Cured Product Thereof 有权
标题翻译：固化硅酮组合物及其固化产物
公开(公告)号：US20070282058A1
公开(公告)日：2007-12-06
申请号：US10584655
申请日：2004-12-20
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki , Hiroji Enami
IPC分类号： C08L83/00 , C08G77/04
CPC分类号： C08L63/00 , C08G59/306 , C08G59/3254 , C08L83/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that has a branched molecular structure and contains in one molecule at least two univalent hydrocarbon groups with phenolic hydroxyl groups therein; (B) a linear-chain organopolysiloxane having at least two univalent hydroxyl groups with epoxy groups that are free of aromatic rings; and (C) a curing accelerator.
摘要翻译：一种可固化有机硅组合物，其包含：（A）具有支链分子结构并在一个分子中含有至少两个具有酚羟基的一价烃基的有机聚硅氧烷; （B）具有至少两个不含芳环的环氧基的单价羟基的直链有机聚硅氧烷; 和（C）固化促进剂。

4. 发明授权

US06551676B1 Silicone-based adhesive sheet method for manufacturing same and semiconductor device 有权
标题翻译：用于制造其硅酮基粘合片的方法和半导体器件
公开(公告)号：US06551676B1
公开(公告)日：2003-04-22
申请号：US09384152
申请日：1999-08-27
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： B32B904
CPC分类号： H01L24/83 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10S428/914 , Y10T428/14 , Y10T428/1452 , Y10T428/1457 , Y10T428/1462 , Y10T428/1471 , Y10T428/1476 , Y10T428/31663 , Y10T428/31786 , H01L2924/0715 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.
摘要翻译：一种通过包括（i）固化硅氧烷组合物以形成基本固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

5. 发明授权

US6040395A Electrical components and method for the fabrication thereof 失效
标题翻译：电气部件及其制造方法
公开(公告)号：US6040395A
公开(公告)日：2000-03-21
申请号：US316217
申请日：1999-05-21
申请人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
发明人： Minoru Isshiki , Katsutoshi Mine , Kimio Yamakawa
IPC分类号： C09D5/00 , C09D163/00 , C09D183/04 , C09D183/06 , H01G13/00 , H01L23/29 , H01L23/31 , C08F283/12
CPC分类号： H01L23/3142 , C09D183/04 , C09D183/06 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L24/73 , H01L2924/14 , H01L2924/19041
摘要： This invention relates to a primer that improves adherence of a cured resin sealant to a cured silicone coating on an electrical element, wherein said primer is selected from the group consisting of:(i) a mixture of components (a) and (b),(ii) a reaction mixture of components (a) and (b),(iii) component (c),(iv) component (c) and a mixture of components (a) and (b), and(v) component (c) and a reaction mixture of components (a) and (b),where component (a) is silanol-functional organopolysiloxane; component (b) is epoxy-functional organoalkoxysilane; and component (c) is organopolysiloxane with the average unit formula: (R.sup.1 SiO.sub.3/2).sub.a (R.sup.2.sub.2 SiO.sub.2/2).sub.b (R.sup.2.sub.3 SiO.sub.1/2).sub.c (R.sup.3 O.sub.1/2).sub.dwhere R.sup.1 is an epoxy-functional monovalent organic group; each R.sup.2 is independently a monovalent hydrocarbon group, R.sup.3 is selected from the group consisting of hydrogen and alkyl groups of 1 to 4 carbon atoms; a, b, and d are each a positive number; and c is 0 or a positive number.
摘要翻译：本发明涉及改善固化树脂密封剂对电气元件上固化的硅氧烷涂层的粘附性的底漆，其中所述底漆选自：（i）组分（a）和（b）的混合物，（ⅱ）组分（a）和（b），（ⅲ）组分（c），（ⅳ）组分（c）和组分（a）和（b）的混合物和（ⅴ） c）和组分（a）和（b）的反应混合物，其中组分（a）是硅烷醇官能的有机聚硅氧烷; 组分（b）是环氧官能的有机烷氧基硅烷; 组分（c）是平均单元式为（R1SiO3 / 2）a（R22SiO2 / 2）b（R23SiO1 / 2）c（R3O1 / 2）d的有机聚硅氧烷，其中R1为环氧官能单价有机基团; 每个R 2独立地为一价烃基，R 3选自氢和1至4个碳原子的烷基; a，b和d分别为正数; c为0或正数。

6. 发明授权

US4994133A Continuous process for producing reinforced resin laminates 失效
标题翻译：生产增强树脂层压板的连续工艺
公开(公告)号：US4994133A
公开(公告)日：1991-02-19
申请号：US737134
申请日：1985-05-23
申请人： Masayuki Oizumi , Masakazu Uekira , Masana Goto , Ichiro Azumi , Shoji Uozumi , Masaharu Abe , Yasuo Fushiki , Minoru Isshiki , Kunio Kawasaki
发明人： Masayuki Oizumi , Masakazu Uekira , Masana Goto , Ichiro Azumi , Shoji Uozumi , Masaharu Abe , Yasuo Fushiki , Minoru Isshiki , Kunio Kawasaki
IPC分类号： B32B37/00 , B29C57/00 , B29C63/00 , B29C67/00 , B29C70/00 , B29C70/50 , B32B15/08 , B32B27/04 , B32B38/08 , D21H25/06 , H05K1/03 , H05K3/02
CPC分类号： B32B38/08 , B29C70/50 , B32B27/04 , D21H25/06 , H05K1/0346 , H05K1/0366 , H05K2201/0145 , H05K2201/0166 , H05K2201/0284 , H05K2201/0293 , H05K2203/1545 , H05K3/022 , Y10S428/901 , Y10T156/1085 , Y10T29/49124 , Y10T442/3431 , Y10T442/3528 , Y10T442/656 , Y10T442/67
摘要： A continuous process for producing reinforced resin laminates comprising the steps of impregnating a fibrous substrate with a liquid resin which is free of volatile solvent and is capable of curing without generating liquid and gaseous byproducts, laminating a plurality of the resin-impregnated substrates into a unitary member, sandwiching the laminate between a pair of covering sheets, and curing the laminate between said pair of covering sheets without applying appreciable pressure. The improvement comprises adjusting the final resin content in said resin impregnated substrate at 10 to 90% by weight based on the total weight of said impregnated substrate.

7. 发明授权

US08802506B2 Method of manufacturing a semiconductor device and a semiconductor device produced thereby 有权
标题翻译：制造半导体器件的方法和由此制造的半导体器件
公开(公告)号：US08802506B2
公开(公告)日：2014-08-12
申请号：US12280248
申请日：2007-02-14
申请人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
发明人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
IPC分类号： H01L21/00
CPC分类号： B29C43/18 , B29C43/50 , C08L83/06 , C08L83/14 , H01L21/565 , H01L23/293 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.
摘要翻译：一种制造半导体器件的方法，该半导体器件通过将未密封的半导体器件放置在模具中并将供入到模具和未密封的半导体器件之间的空间中的可固化的硅氧烷组合物压缩成型，将密封在固化的硅氧烷体中的方法进行压缩成型上述可固化硅氧烷组合物至少包含以下组分：（A）含环氧基的硅氧烷和（B）环氧树脂的固化剂; 可以减少半导体芯片和电路板翘曲，提高表面耐擦伤性。

8. 发明授权

US08309652B2 Curable silicone composition and cured product therefrom 失效
标题翻译：可固化硅酮组合物及其固化产物
公开(公告)号：US08309652B2
公开(公告)日：2012-11-13
申请号：US11912631
申请日：2006-04-27
申请人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
发明人： Yoshitsugu Morita , Minoru Isshiki , Hiroshi Ueki
IPC分类号： C08L83/04
CPC分类号： C08L83/06 , C08K3/08 , C08L83/04 , C09D183/06 , C08L83/00
摘要： A curable silicone composition comprising: (A) an organopolysiloxane that is represented by the average unit formula: (R13SiO1/2)a(R22SiO2/2)b(R3SiO3/2)c(SiO4/2)d (wherein R1, R2, and R3 are each independently selected from substituted or unsubstituted monovalent hydrocarbon groups and epoxy-functional monovalent organic groups, with the proviso that at least 20 mole % of R3 are aryl groups, and a, b, c, and d are numbers that satisfy 0≦a≦0.8, 0≦b≦0.8, 0.2≦c≦0.9, 0≦d
摘要翻译：一种可固化有机硅组合物，其包含：（A）由平均单元式表示的有机聚硅氧烷：（R 13 SiO 1/2）a（R 22 SiO 2/2）b（R 3 SiO 3/2）c（SiO 4/2）d（其中R 1，R 2，和R 3各自独立地选自取代或未取代的单价烃基和环氧官能的一价有机基团，条件是至少20摩尔％的R 3是芳基，a，b，c和d是满足0＆nlE的数 ; a＆nlE; 0.8,0和nlE; b＆nlE; 0.8,0.2＆nlE; c＆nlE; 0.9,0＆amp; nlE; d <0.8，a + b + c + d = 1），并且具有至少两个上述环氧官能单价有机每个分子中的基团; （B）具有能够与环氧基反应的基团的化合物; （C）固化促进剂; 和（D）导热填料，具有优异的处理特性，并快速固化，得到高导热性，非常柔性，高粘合性和非常阻燃的固化产物。

9. 发明申请

US20070273051A1 Curable Organopolysiloxane Composition, Use Of The Cured Product Of The Composition, And Semiconductor Device 有权
标题翻译：固化的有机聚硅氧烷组合物，组合物的固化产物的用途和半导体器件
公开(公告)号：US20070273051A1
公开(公告)日：2007-11-29
申请号：US11832984
申请日：2007-08-02
申请人： Tomoko Kato , Minoru Isshiki
发明人： Tomoko Kato , Minoru Isshiki
IPC分类号： H01L23/29
CPC分类号： C08K5/56 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/70 , C08L83/04 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/1301 , H01L2924/181 , C08L83/00 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.
摘要翻译：一种可固化的有机基聚硅氧烷组合物，其能够形成具有优异光透射率的固化产物，其随着时间的推移几乎不发生热引起的黄变。一种具有封装在该组合物的固化产物中的半导体元件的半导体器件。该组合物包括（A）每分子具有至少两个硅键合的烯基并且具有硅键合的芳基的有机聚硅氧烷，其相对于所有与硅键合的有机基团的含量不小于40摩尔％，（B）有机聚硅氧烷每分子具有至少两个硅键合的氢原子，和（C）铂的有机硅氧烷低聚物络合物，其中低聚物每分子具有不超过8个硅原子并具有硅键合的烯基和与硅键合的芳基。

10. 发明授权

US06761947B2 Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device 失效
标题翻译：硅酮系粘合片及其制造方法以及半导体装置
公开(公告)号：US06761947B2
公开(公告)日：2004-07-13
申请号：US10347564
申请日：2003-01-17
申请人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
发明人： Kimio Yamakawa , Minoru Isshiki , Yoshiko Otani , Katsutoshi Mine
IPC分类号： B32B3300
CPC分类号： H01L24/83 , C09J7/10 , C09J183/04 , C09J2203/326 , C09J2483/00 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L2224/05599 , H01L2224/16225 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29291 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2224/85424 , H01L2224/85444 , H01L2224/8547 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/10253 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , Y10S428/914 , Y10T428/14 , Y10T428/1452 , Y10T428/1457 , Y10T428/1462 , Y10T428/1471 , Y10T428/1476 , Y10T428/31663 , Y10T428/31786 , H01L2924/0715 , H01L2924/00 , H01L2924/05442 , H01L2924/05432 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A semiconductor device comprising a semiconductor chip, a chip attachment component, and the above-mentioned silicone-based adhesive sheet, wherein the semiconductor chip is bonded to the chip attachment component with the silicone-based adhesive sheet.
摘要翻译：一种通过包括（i）固化硅氧烷组合物以形成基本上固化的产品同时组合物位于背衬材料之间的硅氧烷基粘合片，其中至少一种背衬材料具有包含氧原子和/或硫的表面与硅氧烷组合物和背衬材料接触的原子可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种制造硅氧烷基粘合片的方法，包括（i）固化硅氧烷组合物以形成固化产物，同时组合物位于背衬材料之间，其中至少一种背衬材料具有包含氧原子和/或硫原子的表面与硅氧烷组合物接触并且背衬材料可从固化产物中释放，和（ii）将固化产物与背衬材料分离。一种半导体器件，包括半导体芯片，芯片附着部件和上述硅氧烷基粘合片，其中半导体芯片与硅氧烷基粘合片结合到芯片附接部件。

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