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1. 发明公开

KR20180070545A 주조용 몰드재 및 Cu-Cr-Zr-Al 합금 소재 审中-公开
公开(公告)号：KR20180070545A
公开(公告)日：2018-06-26
申请号：KR20187004038
申请日：2016-10-05
申请人： MITSUBISHI MATERIALS CORP
发明人： YANO SHOICHIRO , SATOU SHINOBU , SAKAMOTO TOSHIO
IPC分类号： C22C9/00 , B22D11/059 , C22C9/01 , C22F1/08
CPC分类号： B22C9/06 , B22D11/059 , C22C9/00 , C22C9/01 , C22F1/00 , C22F1/08
摘要： 금속재료를주조할때에사용되는주조용몰드재로서, Cr 을 0.3 mass% 이상 0.5 mass% 미만, Zr 을 0.01 mass% 이상 0.15 mass% 이하, Al 을 0.1 mass% 이상 2.0 mass% 미만포함하고, 잔부가 Cu 및불가피불순물로이루어지는조성을가지며, 침상석출물혹은판상석출물을갖는것을특징으로한다.

2. 发明专利

AU2017282513A1 Copper alloy, copper alloy ingot, copper alloy solution forming material, copper alloy trolley wire and method for producing copper alloy trolley wire 未知
公开(公告)号：AU2017282513A1
公开(公告)日：2018-11-29
申请号：AU2017282513
申请日：2017-06-23
申请人： MITSUBISHI MATERIALS CORP
发明人： ENAMI YUUSUKE , SAKAMOTO TOSHIO , NAKAMOTO HITOSHI , OISHI KEIICHIRO , SUGAHARA ATSUSHI , YAMASHITA CHIKARA , OHARA TAKUYA
IPC分类号： C22C9/06 , B22D11/00 , B22D11/06 , B22D11/108 , B22D11/12 , B22D35/00 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22F1/00 , C22F1/08 , H01B1/02
摘要： This copper alloy is characterized by having a composition that contains from 0.05 mass% to 0.70 mass% (inclusive) of Co, from 0.02 mass% to 0.20 mass% (inclusive) of P, from 0.005 mass% to 0.70 mass% (inclusive) of Sn, and one or more elements selected from among B, Cr and Zr, with the balance made up of Cu and unavoidable impurities; and this copper alloy is also characterized in that if X (mass ppm) is the content of B, Y (mass ppm) is the content of Cr and Z (mass ppm) is the content of Zr, X, Y and Z satisfy formula (1) 1 ≤ (X/5) + (Y/50) + (Z/100) and formula (2) X + Y + Z ≤ 1,000.

3. 发明专利

AU2017282513B2 Copper alloy, copper alloy ingot, copper alloy solution forming material, copper alloy trolley wire and method for producing copper alloy trolley wire 未知
公开(公告)号：AU2017282513B2
公开(公告)日：2022-04-07
申请号：AU2017282513
申请日：2017-06-23
申请人： MITSUBISHI MATERIALS CORP
发明人： SAKAMOTO TOSHIO , ENAMI YUUSUKE , NAKAMOTO HITOSHI , OISHI KEIICHIRO , SUGAHARA ATSUSHI , YAMASHITA CHIKARA , OHARA TAKUYA
IPC分类号： C22C9/06 , B22D11/00 , B22D11/06 , B22D11/108 , B22D11/12 , B22D35/00 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/05 , C22F1/00 , C22F1/08 , H01B1/02
摘要： This copper alloy is characterized by having a composition that contains from 0.05 mass% to 0.70 mass% (inclusive) of Co, from 0.02 mass% to 0.20 mass% (inclusive) of P, from 0.005 mass% to 0.70 mass% (inclusive) of Sn, and one or more elements selected from among B, Cr and Zr, with the balance made up of Cu and unavoidable impurities; and this copper alloy is also characterized in that if X (mass ppm) is the content of B, Y (mass ppm) is the content of Cr and Z (mass ppm) is the content of Zr, X, Y and Z satisfy formula (1) 1 ≤ (X/5) + (Y/50) + (Z/100) and formula (2) X + Y + Z ≤ 1,000.

4. 发明专利

MX2015015998A CABLE DE ALEACION DE COBRE. 未知
公开(公告)号：MX2015015998A
公开(公告)日：2016-04-13
申请号：MX2015015998
申请日：2014-05-22
申请人： MITSUBISHI MATERIALS CORP
发明人： TSUGAWA YASUHIRO , SAKAMOTO TOSHIO
IPC分类号： C22C9/06 , B22D11/00 , B22D11/06 , B22D11/12 , C22C9/00 , C22C9/02 , C22C9/04 , C22F1/00 , C22F1/08 , H01B5/02
摘要： Un cable de aleación de cobre está compuesto de una aleación de cobre endurecida por precipitación que contiene Co, P, y Sn, y puede ser producida por el trabajo en frío de un cable colado continuamente producido por un método de laminación por colado continuo o un método de colado continuo. El cable de aleación de cobre tiene una composición química que comprende 0.20 a 0.35% en masa inclusive de Co, más de 0.095% en masa y 0.15% en masa o menos de P y 0.01 a 0.5% en masa inclusive de Sn, con el resto constituido por Cu e impurezas inevitables.

5. 发明公开

EP3006582A4 COPPER ALLOY WIRE 有权
标题翻译： KUPFERLEGIERUNGSDRAHT
公开(公告)号：EP3006582A4
公开(公告)日：2017-03-15
申请号：EP14800860
申请日：2014-05-22
申请人： MITSUBISHI MATERIALS CORP
发明人： TSUGAWA YASUHIRO , SAKAMOTO TOSHIO
IPC分类号： C22C9/06 , B21B1/46 , B22D11/00 , B22D11/06 , B22D11/12 , B22D21/00 , C22C9/02 , C22F1/08 , H01B1/02 , H01B5/02
CPC分类号： C22C9/06 , B21B1/46 , B21B3/003 , B22D11/005 , B22D11/0602 , B22D11/12 , B22D21/005 , C22C9/00 , C22C9/02 , C22F1/08 , H01B1/026
摘要： This copper alloy wire is a copper alloy wire which is made of a precipitation hardening-type copper alloy containing Co, P, and Sn and is manufactured using a continuous cast-rolling method or cold working of a continuous cast wire rod manufactured using a continuous casting method, in which the copper alloy wire has a composition including Co: more than or equal to 0.20 mass% and less than or equal to 0.35 mass%, P: more than 0.095 mass% and less than or equal to 0.15 mass%, and Sn: more than or equal to 0.01 mass% and less than or equal to 0.5 mass% with a balance being Cu and inevitable impurities.
摘要翻译：该铜合金线是由含有Co，P，Sn的析出硬化型铜合金构成的铜合金线，使用连续铸造法或使用连续铸造法制造的连续铸造线的冷加工其中铜合金线具有Co：0.20质量％以上且0.35质量％以下的组成，P：大于0.095质量％以下且0.15质量％以下，和Sn：大于等于0.01质量％且小于等于0.5质量％，余量为Cu和不可避免的杂质。

6. 发明公开

EP2743978A4 SUBSTRATE FOR POWER MODULE, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE, AND METHOD FOR MANUFACTURING SUBSTRATE FOR POWER MODULE 有权
标题翻译：基板电源模块，基板，电源模块，散热片，电源模块，及其制造方法a。支持的电源模块
公开(公告)号：EP2743978A4
公开(公告)日：2015-07-29
申请号：EP12823914
申请日：2012-08-10
申请人： MITSUBISHI MATERIALS CORP
发明人： KUROMITSU YOSHIROU , NAGATOMO YOSHIYUKI , TERASAKI NOBUYUKI , SAKAMOTO TOSHIO , MAKI KAZUNARI , MORI HIROYUKI , ARAI ISAO
IPC分类号： H01L23/13 , C04B35/645 , C04B37/02 , H01L23/00 , H01L23/36 , H01L23/373 , H05K1/02 , H05K1/03 , H05K1/05 , H05K1/09 , H05K3/00 , H05K3/10 , H05K3/38
CPC分类号： H05K3/103 , B23K35/0222 , B23K35/0233 , B23K35/0238 , B23K35/262 , B23K35/3006 , C04B35/645 , C04B37/021 , C04B37/025 , C04B37/026 , C04B2237/064 , C04B2237/121 , C04B2237/124 , C04B2237/125 , C04B2237/127 , C04B2237/343 , C04B2237/366 , C04B2237/402 , C04B2237/407 , C04B2237/54 , C04B2237/60 , C04B2237/704 , C04B2237/706 , C04B2237/708 , C04B2237/86 , C22C9/00 , C22C13/00 , C22C21/00 , H01L23/3735 , H01L23/3736 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29111 , H01L2224/32225 , H01L2224/83455 , H01L2924/01322 , H05K1/0204 , H05K1/0306 , H05K1/09 , H05K3/0061 , H05K3/38 , Y10T29/49155 , H01L2924/01047 , H01L2924/01049 , H01L2924/01029 , H01L2924/00
摘要： A power module substrate (10) includes an insulating substrate (11), and a circuit layer (12) that is formed on one surface of the insulating substrate (11). The circuit layer (12) is formed by bonding a first copper plate (22) onto one surface of the insulating substrate (11). Prior to bonding, the first copper plate (22) has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.
摘要翻译：一种功率模块基板（10）包括上绝缘基板（11），和一个电路层（12）没有被形成在绝缘基板（11）的一个表面上。所述电路层（12）通过结合第一铜板（22）安装到所述绝缘基板（11）的一个表面上形成。在接合之前，第一铜板（22）具有如下组成成分的至少任碱土元素，过渡金属元素，稀土类元素之中的总共1至100摩尔ppm的一个或多个种的，或硼的100至1000 ppm的摩尔，其余为铜和不可避免的杂质。

7. 发明专利

JP2015004126A 銅合金線有权
标题翻译：铜合金线
公开(公告)号：JP2015004126A
公开(公告)日：2015-01-08
申请号：JP2014068368
申请日：2014-03-28
申请人：三菱マテリアル株式会社 , Mitsubishi Materials Corp
发明人： TSUGAWA YASUHIRO , SAKAMOTO TOSHIO
IPC分类号： C22C9/06 , B22D11/00 , B22D11/06 , C22C9/00 , C22C9/02 , C22C9/04 , H01B1/02 , H01B5/02
CPC分类号： C22C9/06 , B21B1/46 , B21B3/003 , B22D11/005 , B22D11/0602 , B22D11/12 , B22D21/005 , C22C9/00 , C22C9/02 , C22F1/08 , H01B1/026
摘要：【課題】Co,P及びSnを含有する析出強化型銅合金からなり、連続鋳造圧延法、又は、連続鋳造法によって製造された連続鋳造線材を冷間加工することによって製造しても、十分な強度を確保することができる銅合金線を提供する。【解決手段】Co,P及びSnを含有する析出強化型銅合金からなり、連続鋳造圧延法、又は、連続鋳造法によって製造された連続鋳造線材を冷間加工することによって製造された銅合金線であって、Co;0.20mass%以上0.35mass%以下、P;0.095mass%超え0.15mass%以下、Sn;0.01mass%以上0.5mass%以下、を含み、残部がCuおよび不可避的不純物からなる組成を有する。【選択図】なし
摘要翻译：要解决的问题：提供一种由含有Co，P和Sn的沉淀硬化的铜合金构成的铜合金线，并且即使铜合金线通过连续铸造线的冷加工制造也能够确保足够的强度通过连续流延法或连续铸造法生产。铜合金线由含Co，P和Sn的沉淀硬化铜合金组成，并通过连续铸造线连续生产的连续铸造线制冷铸轧法或连续铸造法。铜合金线具有含有Co的组成; 0.20质量％以上且0.35质量％以下，P：超过0.095质量％和0.15质量％以下，Sn： 0.01质量％以上且0.5质量％以下，余量由Cu和不可避免的杂质构成。

8. 发明专利

JP2006116603A Casting method and its program, and recording medium 审中-公开
标题翻译：铸造方法及其程序和记录介质
公开(公告)号：JP2006116603A
公开(公告)日：2006-05-11
申请号：JP2005279644
申请日：2005-09-27
申请人： Mitsubishi Materials Corp , 三菱マテリアル株式会社
发明人： SAKAMOTO TOSHIO , TANIGUCHI KENICHI , DOUTANI YASUO
IPC分类号： B22D46/00 , B22D27/04 , G06F17/50
摘要： PROBLEM TO BE SOLVED: To provide a casting method, in which a casting plan which can sufficiently reduce the generating range of a columnar crystal, can quickly be introduced and thus, a cast product extremely reducing the generation of the columnar crystal can be produced.
SOLUTION: Plural types of casting samples are made and also, distributions of cooling speeds and temperature gradients in the width direction on the surface of the casting sample and distribution of crystal-phase on the surface of each casting sample, are obtained. A parameter A corresponding to the maximum value in the temperature gradients generating an equiaxed crystal in the above casting sample and a parameter B corresponding to the minimum value in the cooling speeds generating chill-crystal, are introduced by comparing the above crystal-phase distribution and the distributions of the cooling speeds and the temperature gradients. Thereafter, the molten metal temperature and a mold temperature, are set by using the related parameters A, B, so that the casting surface range satisfying the relation, in which the temperature gradient G and the cooling speed L on the cast product surface at the casting time become G
摘要翻译：解决的问题：为了提供可以快速引入能够充分降低柱状晶体的生成范围的铸造方案的铸造方法，因此极大地减少柱状晶体的产生的铸造产品生产。解决方案：制备多种类型的铸件样品，并且获得铸件表面上的宽度方向上的冷却速度和温度梯度的分布以及每个铸件样品表面上的晶相的分布。通过比较上述晶相分布和上述晶相分布，引入与上述铸造试样中产生等轴晶体的温度梯度中的最大值对应的参数A和与冷却速度产生冷却晶体中的最小值对应的参数B 冷却速度和温度梯度的分布。然后，通过使用相关参数A，B设定熔融金属温度和模具温度，使得满足关系式的铸造面范围，其中温度梯度G和铸造产品表面上的冷却速度L 铸造时间成为G

9. 发明专利

JP2003145249A CASTING MOLD FOR MANUFACTURING INGOT HAVING MINUTE UNIDIRECTIONALLY SOLIDIFIED COLUMNAR CRYSTAL STRUCTURE 审中-公开
公开(公告)号：JP2003145249A
公开(公告)日：2003-05-20
申请号：JP2001346890
申请日：2001-11-13
申请人： MITSUBISHI MATERIALS CORP
发明人： TANIGUCHI KENICHI , SAKAMOTO TOSHIO
IPC分类号： B22D7/06 , B22C9/06 , B22D7/08 , B22D27/04 , C23C14/34
摘要： PROBLEM TO BE SOLVED: To provide a casting mold for manufacturing an ingot having a unidirectionally solidified columnar crystal structure in which the structure of a cross section orthogonal to the growth direction of the unidirectionally solidified columnar crystal is minute. SOLUTION: Holes 2 are provided at a bottom surface in the casting mold 1.

10. 发明专利

JP2003136190A DIE FOR VIBRATORY CASTING FOR MANUFACTURING INGOT HAVING FINE CRYSTALLINE PARTICLES 审中-公开
公开(公告)号：JP2003136190A
公开(公告)日：2003-05-14
申请号：JP2001341646
申请日：2001-11-07
申请人： MITSUBISHI MATERIALS CORP
发明人： TANIGUCHI KENICHI , SAKAMOTO TOSHIO
IPC分类号： B22D7/06 , B22C9/06 , B22D27/08
摘要： PROBLEM TO BE SOLVED: To provide a die for vibratory casting for manufacturing an ingot having fine crystalline particles. SOLUTION: A plurality of alumina nuggets 2 are embedded in an inner bottom surface and a side wall of a carbon die 1 in such a way that its exposing area of about 0.01 to 4 cm and an embedding depth of about 0.5 to 30 mm may be attained. In addition, a plurality of alumina nuggets 11 are embedded in an inner bottom surface and a side wall of an alumina die 22 in such a way that its exposing area of about 0.01 to 4 cm and an embedding depth of about 0.5 to 30 mm may be attained.

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