专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

CA2013803A1 OXYGEN ABSORBENT 未知
公开(公告)号：CA2013803A1
公开(公告)日：1990-10-25
申请号：CA2013803
申请日：1990-04-04
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： SUGIHARA YASUO , KOMATSU TOSHIO , KASHIBA TAKASHI , HATAKEYAMA HIDETOSHI , TAKEUCHI TERUO
IPC分类号： A23L3/3436
摘要： The present invention relates to novel oxygen absorbent comprising as a main ingredient a 1,2-glycol, glycerine or sugar alcohol.

2. 发明专利

DE69320112T2 未知
公开(公告)号：DE69320112T2
公开(公告)日：1999-03-11
申请号：DE69320112
申请日：1993-05-26
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： YOSHIKAWA YOSHIO , INOUE YOSHIAKI , TAKEUCHI TERUO , FUJINAMI KAZUO
IPC分类号： B23K1/20 , B23K35/36 , H05K3/34 , B23K35/363 , B65D81/26
摘要： The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

3. 发明专利

DE69010550T2 未知
公开(公告)号：DE69010550T2
公开(公告)日：1994-11-10
申请号：DE69010550
申请日：1990-04-18
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： SUGIHARA YASUO , KOMATSU TOSHIO , KASHIBA TAKASHI , HATAKEYAMA HIDETOSHI , TAKEUCHI TERUO
IPC分类号： A23L3/3436 , B01J20/04 , B01J20/22
摘要： The present invention relates to novel oxygen absorbent comprising as a main ingredient a 1,2-glycol, glycerine or sugar alcohol.

4. 发明专利

ES2056288T3 未知
公开(公告)号：ES2056288T3
公开(公告)日：1994-10-01
申请号：ES90107340
申请日：1990-04-18
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： SUGIHARA YASUO , KOMATSU TOSHIO , KASHIBA TAKASHI , HATAKEYAMA HIDETOSHI , TAKEUCHI TERUO
IPC分类号： A23L3/3436 , B01J20/04 , B01J20/22
摘要： The present invention relates to novel oxygen absorbent comprising as a main ingredient a 1,2-glycol, glycerine or sugar alcohol.

5. 发明专利

DE69428752D1 未知
公开(公告)号：DE69428752D1
公开(公告)日：2001-11-29
申请号：DE69428752
申请日：1994-08-26
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： YOSHIKAWA YOSHIO , INOUE YOSHIAKI , YOSHINO ISAMU , TAKEUCHI TERUO
IPC分类号： B23K1/20 , B23K35/36 , B23K35/38 , B65D81/26
摘要： A member having metal is placed in a gas-impermeable container in a hermetically sealed condition together with a rust-proof agent packet, and is bonded to another metal by using a filler material and without using a flux. It is desirable that a member having metal is placed and preserved in a gas-impermeable container in a hermetically sealed condition together with a rust-proof agent packet and an organic compound having carboxyl groups or aldehyde groups and having 4 to 10 carbons, and that the member having metal is bonded to another metal by using a filler material. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas coexists with the member having metal. Moreover, the method of the present invention enables easy and good bonding of the member having metal to another metal by using a filler material. Accordingly, it is unnecessary to give a flux cleaning treatment using organic halogen-based solvents after the solder bonding, the cleaning steps may be simplified, and cost reduction may be promoted.

6. 发明专利

SG47706A1 A method of bonding a metal by solder 未知
公开(公告)号：SG47706A1
公开(公告)日：1998-04-17
申请号：SG1996003936
申请日：1993-05-26
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： FUJINAMI KAZOU , TAKEUCHI TERUO , INOUE YOSHIAKI , YOSHIKAWA YOSHIO
IPC分类号： B23K1/20 , B23K35/36 , H05K3/34 , B23K35/363 , B65D81/26
摘要： The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

7. 发明专利

DE69320112D1 未知
公开(公告)号：DE69320112D1
公开(公告)日：1998-09-10
申请号：DE69320112
申请日：1993-05-26
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： YOSHIKAWA YOSHIO , INOUE YOSHIAKI , TAKEUCHI TERUO , FUJINAMI KAZUO
IPC分类号： B23K1/20 , B23K35/36 , H05K3/34 , B23K35/363 , B65D81/26
摘要： The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

8. 发明专利

SG44413A1 A method for bonding a member having metal 未知
公开(公告)号：SG44413A1
公开(公告)日：1997-12-19
申请号：SG1996000236
申请日：1994-08-26
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： YOSHIKAWA YOSHIO , INOUE YOSHIAKI , YOSHINO ISAMU , TAKEUCHI TERUO
IPC分类号： B23K1/20 , B23K35/36 , B23K35/38 , B65D81/26
摘要： A member having metal is placed in a gas-impermeable container in a hermetically sealed condition together with a rust-proof agent packet, and is bonded to another metal by using a filler material and without using a flux. It is desirable that a member having metal is placed and preserved in a gas-impermeable container in a hermetically sealed condition together with a rust-proof agent packet and an organic compound having carboxyl groups or aldehyde groups and having 4 to 10 carbons, and that the member having metal is bonded to another metal by using a filler material. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas coexists with the member having metal. Moreover, the method of the present invention enables easy and good bonding of the member having metal to another metal by using a filler material. Accordingly, it is unnecessary to give a flux cleaning treatment using organic halogen-based solvents after the solder bonding, the cleaning steps may be simplified, and cost reduction may be promoted.

9. 发明专利

DE69010550D1 未知
公开(公告)号：DE69010550D1
公开(公告)日：1994-08-18
申请号：DE69010550
申请日：1990-04-18
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： SUGIHARA YASUO , KOMATSU TOSHIO , KASHIBA TAKASHI , HATAKEYAMA HIDETOSHI , TAKEUCHI TERUO
IPC分类号： A23L3/3436 , B01J20/04 , B01J20/22
摘要： The present invention relates to novel oxygen absorbent comprising as a main ingredient a 1,2-glycol, glycerine or sugar alcohol.

10. 发明公开

EP2559340A4 METHOD FOR POTATO SPROUT CONTROL 有权
标题翻译：土豆控制程序萌发
公开(公告)号：EP2559340A4
公开(公告)日：2014-01-15
申请号：EP11768923
申请日：2011-04-14
申请人： MITSUBISHI GAS CHEMICAL CO
发明人： OSHIDA YUTAKA , TAKEUCHI TERUO , YUYAMA MEGUMU
IPC分类号： A23B7/144 , A23B7/152 , A23L19/12 , B65D81/26
CPC分类号： A23B7/144 , A23B7/152 , A23L19/14

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式