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    • 2. 发明专利
    • GRINDING WHEEL FOR MACHINING SMALL HOLE
    • JPS63267167A
    • 1988-11-04
    • JP9793987
    • 1987-04-21
    • MITSUBISHI ELECTRIC CORPMURAMOTO KOSAKUSHO KK
    • KAWAGUCHI KENJIMATSUNAGA HIROYUKIHIJIKATA YOSHIOKITAZUME TSUGUJINAGANO HITOSHIMURAMOTO SOJIYAMASHITA HIDEYO
    • B24D3/00B24D7/18
    • PURPOSE:To materialize highly accurate machining of a small hole without a reversed taper by forming a wheel spindle with a material having high Young's modulus such as sintered hard alloy or ceramic, providing grooves on its outer periphery, and fixing abrasive grains only to the grooves. CONSTITUTION:A wheel spindle 1 is formed with sintered hard alloy or ceramic, and a number of grooves 1a are formed in the axial direction on its outer periphery in such a way that the depth of each groove is about half a grain diameter while its width is sufficient for each grain 2 to enter. Then, the parts except the grooves 1a of the outer periphery of the wheel spindle 1 are coated with an insulating varnish, etc. And, when plating is carried out in a plating liquid with the abrasive grains 2 being raised up, a plating metal is deposited only on the groove 1a parts and the abrasive grains 2 are fixed only to these parts, in the wheel spindle 1. The main components of the sintered hard alloy are WC and Mo, although titanium may be added depending on a purpose, having a Young's modulus several times as high as that of copper, enabling the machining of a hole requiring high accuracy where 1mum is the problem. Thereby, machining of a highly accurate small hole without a reversed taper can be carried out while preventing the clogging of foreign matter at the time of using a wheel in a blanking die.