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1. 发明公开

EP2662961A4 DYNAMO-ELECTRIC MACHINE 有权
公开(公告)号：EP2662961A4
公开(公告)日：2018-02-07
申请号：EP11854867
申请日：2011-01-06
申请人： MITSUBISHI ELECTRIC CORP
发明人： KATO MASAKI , FUJITA MASAHIKO , SAKAMOTO KAZUYASU
IPC分类号： H02K19/36 , H02K11/04
CPC分类号： H02K11/046 , H02K5/225 , H02K11/048
摘要： A rotary electric machine includes a rotary electric machine main body (2), and a controlling apparatus (3) that is disposed on the rotary electric machine main body. The rotary electric machine main body includes: a stator (4); a rotor (5) that includes a rotating shaft and that is rotatable relative to the stator; and a supporting body (6) that supports the stator and the rotor. The controlling apparatus (3) includes a power circuit portion that is disposed around the rotating shaft (12), and that converts electric power that is received from the rotary electric machine main body (2) or electric power that is supplied to the rotary electric machine main body (2) between alternating current and direct current. The power circuit portion includes: a power module that includes a switching element; and an electric power interconnecting part that includes a conductor that is connected to a terminal of the power module. The electric power interconnecting part is disposed so as to avoid overlapping with a region of the power module when the power circuit portion is viewed in an axial direction of the rotating shaft.

2. 发明专利

FR2959062B1 APPAREIL SEMICONDUCTEUR 未知
公开(公告)号：FR2959062B1
公开(公告)日：2020-02-14
申请号：FR1056919
申请日：2010-09-01
申请人： MITSUBISHI ELECTRIC CORP
发明人： KATO MASAKI , FUJITA NOBUHIKO , SAKAMOTO KAZUYASU
IPC分类号： H01L23/04 , H01L23/28 , H05K1/18
摘要： L'invention propose un appareil semi-conducteur configuré pour positionner un dispositif semi-conducteur (1) facilement et en toute fiabilité sans avoir de partie en saillie formée dans la surface inférieure du dispositif semi-conducteur (1) dans l'appareil semi-conducteur. Un appareil semi-conducteur est fabriqué en attachant un dispositif semi-conducteur (1) de type à boîtier de montage en surface et un élément de câblage (2) à un puits thermique (3). Une partie de fixation (22) dans laquelle le dispositif semi-conducteur (1) est fixé est prévue sur l'élément de câblage (2), de sorte que le dispositif semi-conducteur (1) soit positionné en fixant le dispositif semi-conducteur (1) dans la partie de fixation (22) prévue sur l'élément de câblage (2). Grâce à l'appareil semi-conducteur de l'invention, il devient possible de positionner le dispositif semi-conducteur (1) avec un degré élevé de précision.

3. 发明专利

FR2959062A1 APPAREIL SEMICONDUCTEUR 未知
公开(公告)号：FR2959062A1
公开(公告)日：2011-10-21
申请号：FR1056919
申请日：2010-09-01
申请人： MITSUBISHI ELECTRIC CORP
发明人： KATO MASAKI , FUJITA NOBUHIKO , SAKAMOTO KAZUYASU
IPC分类号： H01L23/04 , H01L23/28 , H05K1/18
摘要： L'invention propose un appareil semi-conducteur configuré pour positionner un dispositif semi-conducteur (1) facilement et en toute fiabilité sans avoir de partie en saillie formée dans la surface inférieure du dispositif semi-conducteur (1) dans l'appareil semi-conducteur. Un appareil semi-conducteur est fabriqué en attachant un dispositif semi-conducteur (1) de type à boîtier de montage en surface et un élément de câblage (2) à un puits thermique (3). Une partie de fixation (22) dans laquelle le dispositif semi-conducteur (1) est fixé est prévue sur l'élément de câblage (2), de sorte que le dispositif semi-conducteur (1) soit positionné en fixant le dispositif semi-conducteur (1) dans la partie de fixation (22) prévue sur l'élément de câblage (2). Grâce à l'appareil semi-conducteur de l'invention, il devient possible de positionner le dispositif semi-conducteur (1) avec un degré élevé de précision.

5. 发明专利

JP2012249371A Rotary electric machine 有权
标题翻译：旋转电机
公开(公告)号：JP2012249371A
公开(公告)日：2012-12-13
申请号：JP2011117608
申请日：2011-05-26
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KATO MASAKI , SAKAMOTO KAZUYASU
IPC分类号： H02K19/36 , H02K11/00
摘要： PROBLEM TO BE SOLVED: To provide a rotary electric machine equipped with a power circuit section, capable of reducing the number of manufacturing processes, shortening the time required to fix the power module and an electric power interconnection component to a heat sink, and improving manufacturing yield, and excellent in productivity.SOLUTION: In a rotary electric machine equipped with a power circuit section mounted and formed on a first mounting face of a heat sink by an adhesive, an electric power interconnection component is mounted on a second mounting face of the heat sink by the adhesive, in a face on the opposite side of a face with projecting inner wall and outer wall parts of an insulator forming the electric power interconnection component, and a power module is disposed in an opening of the electric power interconnection component.
摘要翻译：解决的问题：为了提供一种配备有电源电路部分的旋转电机，能够减少制造工艺的数量，缩短将电力模块和电力互连部件固定到散热器所需的时间，提高制造成品率，生产率优异。解决方案：在具有通过粘合剂安装和形成在散热器的第一安装面上的电源电路部分的旋转电机中，电力互连部件通过该散热器的第二安装面安装在散热器的第二安装面上粘合剂，在具有突出的内壁的面的相对侧上的表面和形成电力互连部件的绝缘体的外壁部分，并且功率模块设置在电力互连部件的开口中。版权所有（C）2013，JPO＆INPIT

6. 发明专利

JP2011228335A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2011228335A
公开(公告)日：2011-11-10
申请号：JP2010093925
申请日：2010-04-15
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： KATO MASAKI , FUJITA NOBUHIKO , SAKAMOTO KAZUYASU
IPC分类号： H01L23/40 , H05K1/18
CPC分类号： H05K1/021 , H01L23/13 , H01L23/36 , H01L23/4093 , H01L2924/0002 , H05K1/184 , H05K2201/0397 , H05K2201/09118 , H05K2201/09827 , H05K2201/10166 , H05K2201/10689 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device that allows a semiconductor element to be reliably and easily positioned, without forming protrusions on the bottom of the semiconductor element.SOLUTION: In a semiconductor device, a surface-mounting package semiconductor element 1 and a wiring member 2 are mounted on a heat sink 3. A fitting portion 22 for fitting the semiconductor element 1 thereinto is formed in the wiring member 2. The semiconductor element 1 is fitted into the fitting portion 22 to be positioned.
摘要翻译：要解决的问题：提供一种允许半导体元件可靠且容易地定位而不在半导体元件的底部形成突起的半导体器件。解决方案：在半导体器件中，表面安装封装半导体元件1和布线构件2安装在散热器3上。在布线构件2中形成有用于将半导体元件1嵌合的嵌合部22。将半导体元件1嵌合到嵌合部22中，使其定位。版权所有（C）2012，JPO＆INPIT

7. 发明专利

JP2011147319A Rotary electric machine with built-in controller 有权
标题翻译：旋转电机带内置式控制器
公开(公告)号：JP2011147319A
公开(公告)日：2011-07-28
申请号：JP2010008325
申请日：2010-01-18
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAKATA YUJI , NAKAJIMA YASUSHI , FUJITA NOBUHIKO , KATO MASAKI , SAKAMOTO KAZUYASU , OGA TAKUYA
IPC分类号： H02K11/00 , H02K19/22
CPC分类号： H02P9/48 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/181 , H01L2924/1815 , H02K11/048 , H02K19/365 , H02P2101/45 , H01L2924/00012 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To obtain a rotary electric machine with built-in controller, capable of mouning power circuit modules and field circuit modules, which are manufactured by a common molding process, without forming a large gap against the heat receiving surface of a heat sink produced by die casting. SOLUTION: The rotary electric machine has a rotary electric machine body 2, the power circuit modules 50A, the field circuit modules, and the heat sink 30 produced by the die casting. The machine includes a controller integrally mounted on the rotary electric machine body 2. The heat sink 30 is protruded and installed on the surface of a base plate 31A, and includes a plurality of protruded heat receiving parts 32A each having the heat receiving surface 32a. The power circuit modules 50A and the field circuit modules each include a sealing body part 59 made of an insulating resin to expose the bottom surface of an element heat radiation part 53 to a surface-shaped reference surface corresponding to a shape of the heat receiving surface 32a, and seal switching elements 52. An insulating support layer 81a is interposed between the heat receiving surface 32a and the bottom surface of the element heat radiating part 53. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了获得具有内置控制器的旋转电机，能够通过普通模制工艺制造的电源电路模块和励磁电路模块，而不形成与接收表面的大间隙的压铸产生的散热片。解决方案：旋转电机具有旋转电机主体2，电源电路模块50A，励磁电路模块和通过压铸制造的散热器30。该机器包括一体地安装在旋转电机体2上的控制器。散热器30突出并安装在基板31A的表面上，并且包括多个具有受热面32a的突出的热接收部32A。电源电路模块50A和励磁电路模块各自包括由绝缘树脂制成的密封体部分59，以将元件散热部分53的底面暴露于对应于受热表面形状的表面形状的基准表面 32a和密封开关元件52.绝缘支撑层81a插入在热接收表面32a和元件散热部分53的底表面之间。版权所有（C）2011，JPO＆INPIT

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