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1. 发明专利

DE69534461D1 未知
公开(公告)号：DE69534461D1
公开(公告)日：2006-02-02
申请号：DE69534461
申请日：1995-03-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKATANI SHIRO , MITANI TETSUO , BABA FUMIAKI , OHTA TSUTOMU , NAKAMURA KAZUO
IPC分类号： C08K7/02 , C08K7/16 , C08L67/00 , C08L81/02 , G02B1/04 , G02B6/38
摘要： A resin compound for molding precision parts containing 20 to 40 % by weight of at least one of polyphenylene sulfide and aromatic polyester thermotropic liquid crystalline polymer, 15 to 25 % by weight of whisker and 40 to 60 % by weight of spherical fine particles, wherein the total content of the whisker and the spherical fine particles is 60 to 80 % by weight, and a resin compound for molding precision parts containing 20 to 40 % by weight of at least one of polyphenylene sulfide and aromatic polyester thermotropic liquid crystalline polymer, 5 to 25 % by weight of whisker, 40 to 75 % by weight of spherical fine particles and 0.5 to 3 % by weight of silane coupling agent, wherein the total content of the whisker and the spherical fine particles is 60 to 80 % by weight are disclosed. Mechanical strength of the resin compounds can be increased without the impairment of dimensional precision, surface smoothness and low coefficient of thermal expansion. The resin compounds can be suitably used for molding precision parts, for instance, sleeve, ferrule and the like.

2. 发明公开

EP0704486A4 RESIN COMPOSITION FOR MOLDING PRECISION PARTS, AND SLEEVE AND FERRULE PRODUCED THEREFROM 失效
标题翻译：树脂组合物精密组件套从本作成形和PLUG
公开(公告)号：EP0704486A4
公开(公告)日：2001-03-28
申请号：EP95912436
申请日：1995-03-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKATANI SHIRO , MITANI TETSUO , BABA FUMIAKI , OHTA TSUTOMU , NAKAMURA KAZUO
IPC分类号： C08K7/02 , C08K7/16 , G02B6/38 , C08L67/00 , C08L81/02 , G02B1/04
CPC分类号： G02B6/3865 , C08K7/02 , C08K7/16 , G02B6/3854 , G02B6/3874 , C08L67/00 , C08L81/02
摘要： A resin composition for molding precision parts, which comprises 20-40 wt.% of at least either polyphenylene sulfide or a thermotropic liquid-crystal aromatic polyester resin, 15-25 wt.% of whiskers and 40-60 wt.% of fine spherical particles, and wherein the total content of the whiskers and the particles is 60-80 wt.%; and another resin composition for molding precision parts, which comprises 20-40 wt.% of at least either polyphenylene sulfide or a thermotropic liquid-crystal aromatic polyester resin, 5-25 wt.% of whiskers, 40-75 wt.% of fine spherical particles and 0.5-3 wt.% of a silane coupling agent, and wherein the total content of the whiskers and the particles is 60-80 wt.%. As the above compositions serve to enhance mechanical strengths without detriment to dimensional accuracy, surface smoothness and small coefficient of thermal expansion, they can be suitably applied to the molding of precision parts such as sleeves or ferrules.
摘要翻译：为重量的球形微粒，worin成型精密份含有20％至40％（重量）聚苯硫醚和芳族聚酯的热塑性向性液晶聚合物，15〜25％的至少一个的以重量计晶须和40至60％的树脂化合物晶须和球状微粒的总含量为60通过向80重量％，以及用于模制精度重量份聚苯硫醚和芳族聚酯的热塑性向性液晶聚合物中的至少一种，5的含有20〜40％的树脂化合物至25％（重量）的晶须，40％至75％重量的球形细颗粒和0.5至3％（重量）硅烷偶联剂，worin晶须和球状微粒的总含量为60〜80％（重量）的游离缺失盘。树脂化合物的机械强度，而不的尺寸精度，表面平滑性和低的热膨胀系数的损害增大。所述树脂化合物可以适当地使用用于模制精密零件，例如，套筒，套管等。

3. 发明专利

DE69534461T2 未知
公开(公告)号：DE69534461T2
公开(公告)日：2006-06-29
申请号：DE69534461
申请日：1995-03-16
申请人： MITSUBISHI ELECTRIC CORP
发明人： TAKATANI SHIRO , MITANI TETSUO , BABA FUMIAKI , OHTA TSUTOMU , NAKAMURA KAZUO
IPC分类号： C08L67/00 , C08K7/02 , C08K7/16 , C08L81/02 , G02B1/04 , G02B6/38
摘要： A resin compound for molding precision parts containing 20 to 40 % by weight of at least one of polyphenylene sulfide and aromatic polyester thermotropic liquid crystalline polymer, 15 to 25 % by weight of whisker and 40 to 60 % by weight of spherical fine particles, wherein the total content of the whisker and the spherical fine particles is 60 to 80 % by weight, and a resin compound for molding precision parts containing 20 to 40 % by weight of at least one of polyphenylene sulfide and aromatic polyester thermotropic liquid crystalline polymer, 5 to 25 % by weight of whisker, 40 to 75 % by weight of spherical fine particles and 0.5 to 3 % by weight of silane coupling agent, wherein the total content of the whisker and the spherical fine particles is 60 to 80 % by weight are disclosed. Mechanical strength of the resin compounds can be increased without the impairment of dimensional precision, surface smoothness and low coefficient of thermal expansion. The resin compounds can be suitably used for molding precision parts, for instance, sleeve, ferrule and the like.

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