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    • 2. 发明专利
    • ELECTRONIC CIRCUIT DEVICE
    • JPH10257671A
    • 1998-09-25
    • JP6152497
    • 1997-03-14
    • MITSUBISHI ELECTRIC CORP
    • MAKINO HIROYUKI
    • H01L27/04G05F3/20H01L21/822H02J1/00H02M9/04H03F1/00H03K19/00
    • PROBLEM TO BE SOLVED: To reduce power consumption, while maintaining a device to be compact and inexpensive by electrically connecting at least one of a plurality of semiconductor elements in parallel with each of a plurality of electronic circuits for each connection point of a plurality of electronic circuits. SOLUTION: Electronic circuit blocks 13 and 14 are connected in series between a power supply terminal 11 and a ground terminal 12. Further, semiconductor elements 15-18 are connected in series in the forward direction between the power supply terminal 11 and the ground terminal 12. A connection point 19 between the electronic circuit blocks 13 and 14 and a connection point 20 between semiconductor elements 16 and 17 are short-circuited electrically. Thus the current flowing from power supply terminal 11 to the ground terminal 12 becomes the smaller of i1 and i2 at all times, regardless of the relationship in size of the current i1 which flows through the electronic circuit block 13 and the current i2 which flows through the electronic circuit block 14, thereby reducing power consumption.
    • 4. 发明专利
    • GAAS SEMICONDUCTOR STORAGE
    • JPH03228291A
    • 1991-10-09
    • JP2390390
    • 1990-02-01
    • MITSUBISHI ELECTRIC CORP
    • MAKINO HIROYUKIMATSUE SHUICHI
    • G11C11/412H01L27/095H01L27/10
    • PURPOSE:To improve the resistance to a soft error by providing a means which connects the anode of a Schottky diode to each storage node of a memory cell with the cathode potential set usually at the value slightly higher than a GND level and heightens the potential in a data writing period. CONSTITUTION:Each memory cell contains a 1st Schottky diode 13 which uses a 1st output node 8 and a medium node 15 as an anode and a cathode respectively, a second Schottky diode 14 which uses a 2nd output node 9 and the intermediate node 15 as an anode and a cathode respectively, and a means 21 which heighten the potential of the node 15 of a memory cell of a row or a column to be selected with the potential of the node 15 of a memory cell of a non- selection row or a non-selection column in a data writing period. In such a constitution, the cathode potential is usually set at the value slightly higher than a GND level and then heightened more in a data writing period. Thus the capacity can be added without reducing the voltage amplitudes of storage nodes 8 and 9 nor delaying the writing time. Then the resistance is improved to a soft error.
    • 6. 发明专利
    • MANUFACTURE OF MESFET
    • JPS63160382A
    • 1988-07-04
    • JP30981386
    • 1986-12-24
    • MITSUBISHI ELECTRIC CORP
    • MATSUE SHUICHITAKANO SATOSHIMAKINO HIROYUKI
    • H01L29/812H01L21/28H01L21/338H01L29/80
    • PURPOSE:To contrive high speed operations and high integration by forming a metal film on an N-type impurity layer of the gallium arsenic substrate surface and then by etching a resist film after forming it on the surface of the metal film, thereby forming a gate electrode on sidewalls below the resist film and also by forming source and drain electrode on both sides of the electrode with the vaporization to the surface of the N-type impurity layer. CONSTITUTION:An N-type impurity layer 2 is formed on the substrate surface 1 by ion- implanting silicon atoms into a gallium arsenic substrate 1. And a metal film having a high melting point is formed by spattering metals having a high melting point such as Ti/W over the N-type impurity layer surface 2 after annealing its N-type impurity layer 2. After that, a resist film 3 is formed at the prescribed part of its metal film surface having the high melting point. And then, a gate electrode 10 is formed by performing isotropic etching treatment of the metal film having the high melting point by using the resist film 3 as a mask. The lateral etching amount of the gate electrode 10 is adjusted by the intensity of etching. The utilization of resist film 3 as the mask allows AuGe/Ni/Au to be attached to the N-type impurity layer surface 2 by vaporization and the gate electrode to self-consistently form source and drain electrodes 7 and 8. Further, an AuGe/Ni/Au film 11 is formed even on the resist film surface 3. After that, the unnecessary film 11 and resist film 3 are removed and a sinter process is carried out for the gate electrode 10 as well as the source and drain electrodes 7 and 8.
    • 8. 发明专利
    • BUS DRIVER CIRCUIT
    • JPH113157A
    • 1999-01-06
    • JP15410197
    • 1997-06-11
    • MITSUBISHI ELECTRIC CORP
    • SUZUKI HIROAKIMAKINO HIROYUKI
    • G06F3/00G11C11/407H03K19/0175
    • PROBLEM TO BE SOLVED: To reduce power consumption by suppressing leakage current of a driver transistor without connecting leakage cut switches in series at a power supply side and an installation side with the driver transistor by constituting a bus driver circuit to omit a sleeve signal by matching the sleeve signal and an enable signal. SOLUTION: Each of the sleeve signals SL and SL is supplied to the bus driver circuit 21. Voltage VPP which is higher than power supply voltage VDD is generated by a high voltage generation circuit 13 and voltage VBB which is lower than ground voltage GND is generated by a low voltage generation circuit 14. Control signals S1, S2 are generated by a state control circuit 12 and the voltage VPP which is higher than the VDD as the sleeve signal SL and the voltage GND are selectively outputted according to the control signal S1 by a selection circuit 15. Or the voltage VDD as the sleeve signal SL and the voltage VBB which is lower than the GND are selectively outputted according to the control signal S2 by a selection circuit 16.