会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明专利
    • Molding material
    • 模具材料
    • JPS6119630A
    • 1986-01-28
    • JP14113784
    • 1984-07-07
    • Mitsubishi Chem Ind Ltd
    • HASUO MASAYOSHIMUKAI SEIICHIURABE HIROSHIYOSHIDA SEIJINUKII MASAHIRO
    • C08G63/00C08G64/00
    • PURPOSE: A molding material having excellent transparency and small optical strain, comprising an aromatic polycarbonate to which a specified proportion of polymer chains comprising styrene alone or major proportion of a styrene compound are added.
      CONSTITUTION: A molding material comprising a modified polycarbonate which is an aromatic polycarbonate to which polymer chains comprising styrene alone or a major proportion of a styrene compound are chemically bonded and contains 5W40wt% said styrene-derived polymer chains. When the total content of the styrene resin portion in said modified polycarbonate is below 5wt%, such a modified polycarbonate can not be used for the molding material of small optical strain, while when this content is above 40wt%, such a modified polycarbonate is not suitable for the molding material because of a marked decrease in mechanical properties, especially impact resistance. As the modified polycarbonate which can be applied, that having an average MW of 12,000W30,000 is desirable.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:具有优异的透明性和小的光学应变的成型材料,其包含芳香族聚碳酸酯,其中加入特定比例的包含苯乙烯或大部分苯乙烯化合物的聚合物链。 构成:包含改性聚碳酸酯的成型材料,其是芳族聚碳酸酯,聚合物链包含苯乙烯单独或主要部分的苯乙烯化合物,其中含有5-40重量%的所述苯乙烯衍生的聚合物链。 当所述改性聚碳酸酯中的苯乙烯树脂部分的总含量低于5重量%时,这种改性聚碳酸酯不能用于小光学应变的成型材料,而当该含量高于40重量%时,这种改性聚碳酸酯不是 由于机械性能明显降低,特别是耐冲击性,因此适用于成型材料。 作为可以应用的改性聚碳酸酯,平均MW为12,000〜30,000是理想的。