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    • 4. 发明专利
    • LIGHT SOURCE FOR PLANT GROWTH
    • JPH11196669A
    • 1999-07-27
    • JP214998
    • 1998-01-08
    • TOKYO RIKAKIKAI KKMITSUBISHI CHEM CORP
    • OSANAI ISATOTAKAHASHI MASAKATSUWATANABE HIROYUKI
    • A01G7/00
    • PROBLEM TO BE SOLVED: To provide a light source capable of irradiating an adjusted light having a necessary wave length selectively or changing the range of light irradiation, easy for repairing and easy to increase the light source by purchasing or exchange the same as necessary. SOLUTION: This light source for growth of a plant is obtained by installing plural light emitting diodes having the same wave length on a long and narrow printed base plate 4 in one row, mounting plural connector-receiving parts 11 equipped with plural connecting parts of connectors for connecting with the electric power source 6 to a frame body 2 capable of mounting and demounting plural rows of the light sources 3 equipped with connectors for connecting with the electric power source, also capable of controlling a illuminance for each of the connector-receiving parts 11, mounting light sources 3 having different wave lengths at the frame body 2 in a combination, and connecting each connector 6 for connecting with the electric power source and for the light source 3 having the same wave length to one connector receiving part 11.
    • 5. 发明专利
    • SPUTTERING SYSTEM
    • JPH09125239A
    • 1997-05-13
    • JP28355995
    • 1995-10-31
    • MITSUBISHI CHEM CORP
    • WATANABE HIROYUKI
    • C23C14/08C23C14/34
    • PROBLEM TO BE SOLVED: To improve the reproducibility in forming a compd. thin film by providing a cooler at the back of a target and controlling the target temp. in sputtering. SOLUTION: A liq.-circulated temp. control part 4 is provided at the rear of the backing plate 3 to mount a target 2 in a sputtering device 1. A liq. inlet pipe 5 and a liq. outlet pipe 6 are connected to the temp. control part 4 to control the temp. A circulating path capable of controlling the temp. of the liq., i.e., the target 2, is formed by the liq. outlet pipe 6, liq. cooler 7, heater 10, temp. measuring device 11, pump 20 and liq. inlet pipe 5. The liq. temp. is controlled by detecting the temp. of the liq. in the circulating path with the measuring device 11 and comparing the detected value with a set value, and the liq. temp. is controlled within ±2 deg., preferably ±1 deg., of the set temp. Further, since the film thickness is varied with the fluctuation of the flow rate of the liq., the flow rate is controlled within ±20%, preferably ±10%, of the set value.