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1. 发明申请

US20090014204A1 FLEXIBLE PRINTED CIRCUIT BOARD 有权
标题翻译：柔性印刷电路板
公开(公告)号：US20090014204A1
公开(公告)日：2009-01-15
申请号：US12106513
申请日：2008-04-21
申请人： MING WANG , DONG-QING HE , XIAO-HONG ZHANG , CHENG-HSIEN LIN
发明人： MING WANG , DONG-QING HE , XIAO-HONG ZHANG , CHENG-HSIEN LIN
IPC分类号： H05K1/00
CPC分类号： H05K1/118 , H05K1/0281 , H05K3/281 , H05K2201/09145
摘要： A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.
摘要翻译：柔性印刷电路板包括基底和覆盖物。基部包括与主要部分连接的主要部分和远端部分。远侧部分具有第一部分和第二暴露部分。覆盖层形成在基部上并覆盖远端部分的主要部分和第一部分。远端部分的第二暴露部分被覆盖物覆盖。覆盖物包括用作远端部分的第一部分和第二部分之间的界面的弯曲边缘。

2. 发明申请

US20080148562A1 METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD 有权
标题翻译：制造多层柔性印刷电路板的方法
公开(公告)号：US20080148562A1
公开(公告)日：2008-06-26
申请号：US11877585
申请日：2007-10-23
申请人： CHIH-YI TU , CHENG-HSIEN LIN , MING WANG
发明人： CHIH-YI TU , CHENG-HSIEN LIN , MING WANG
IPC分类号： H05K3/10
CPC分类号： H05K3/4697 , H05K1/0393 , H05K3/4611 , H05K3/4635 , H05K2201/0909 , H05K2201/09127 , H05K2203/063 , Y10T29/49126 , Y10T29/49128 , Y10T29/49139 , Y10T29/49146 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.
摘要翻译：制造多层FPCB的方法包括以下步骤：提供第一覆铜层压板，第二覆铜层压板和粘合剂层; 在粘合剂层上限定开口; 在所述第一覆铜层压板上限定第一狭缝; 层压第一覆铜层压板，粘合剂层和第二覆铜层压板; 限定用于在所述第一覆铜层压板和所述第二覆铜层压板之间建立电连接的通孔; 切割第一覆铜层压板，粘合剂层和第二覆铜层压板，从而形成在不同区域中具有不同层数的多层柔性印刷电路板。

3. 发明申请

US20120009669A1 BIFUNCTIONAL COMPOUND WITH MONOSACCHARIDE AND N2S2 LIGAND, AND PREPARATION AND USE THEREOF 有权
标题翻译：具有单糖和N2S2配体的双功能化合物，其制备和使用
公开(公告)号：US20120009669A1
公开(公告)日：2012-01-12
申请号：US13087664
申请日：2011-04-15
申请人： SHOW-WEN LIU , CHENG-HSIEN LIN , YU CHANG , CHENG-FANG HSU , TSYH-LANG LIN
发明人： SHOW-WEN LIU , CHENG-HSIEN LIN , YU CHANG , CHENG-FANG HSU , TSYH-LANG LIN
IPC分类号： C07H15/04 , C12N5/071 , C07K14/00
CPC分类号： C07H15/04
摘要： A bifunctional compound with a monosaccharide and a N2S2 ligand, and more particularly, a bifunctional compound with a N2S2 ligand and aminohexylacetyl galactosamine (ah-GalNAc4) is provided. A method for preparing the bifunctional compound with a monosaccharide and a N2S2 ligand is also provided, including activating a carboxyl group in an organic ligand, reacting the activated carboxyl group with a galactopyranoside through amidation, and then hydrolyzing. The bifunctional compound of the present invention is widely useful in nuclear medicine for preparation of liver imaging agents for assisting in correct diagnosis of diseases.
摘要翻译：提供了具有单糖和N2S2配体的双官能化合物，更具体地，提供了具有N 2 S 2配体和氨基己基乙酰基半乳糖胺（ah-GalNAc 4）的双官能化合物。还提供了用单糖和N 2 S 2配体制备双功能化合物的方法，包括活化有机配体中的羧基，通过酰胺化使活化的羧基与吡喃半乳糖苷反应，然后水解。本发明的双功能化合物在制备用于辅助正确诊断疾病的肝成像剂的核医学中广泛有用。

4. 发明申请

US20110313183A1 METHOD FOR PREPARATION OF N-METHYL-3-(2-TRIBUTYLSTANNYLPHENOXY)-3-PHENYLPROPANAMINE, AND USE THEROF 有权
标题翻译： N-甲基-3-（2-三氟甲基苯氧基）-3-苯基丙胺的制备方法及其用途
公开(公告)号：US20110313183A1
公开(公告)日：2011-12-22
申请号：US13087862
申请日：2011-04-15
申请人： SHOW-WEN LIU , CHENG-HSIEN LIN , TSYH-LANG LIN , CHENG-FANG HSU , YU CHANG
发明人： SHOW-WEN LIU , CHENG-HSIEN LIN , TSYH-LANG LIN , CHENG-FANG HSU , YU CHANG
IPC分类号： C07F7/22 , C07C213/10
CPC分类号： C07F7/2208
摘要： A method for preparation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine is provided, which includes formation of N-methyl-3-(2-tributylstannylphenoxy)-3-phenylpropanamine, useful as a precursor of a norepinephrine transporter (NET) contrast label [123Iodine](R)—N-methyl-3-(2-iodophenoxy)-3-phenylpropanamine ([123I]MIPP) with a leaving group Bu3Sn.
摘要翻译：提供了制备N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺的方法，包括形成N-甲基-3-（2-三丁基甲锡烷基苯氧基）-3-苯基丙胺，可用作去甲肾上腺素的前体转运蛋白（NET）对比标记物[123碘]（R）-N-甲基-3-（2-碘苯氧基）-3-苯基丙胺（[123 I] MIPP）与离去基团Bu 3 Sn。

5. 发明申请

US20090050354A1 PRINTED CIRCUIT BOARD SUBSTRATE AND PRINTED CIRCUIT BOARD HAVING THE SAME 有权
标题翻译：印刷电路板基板和具有该印刷电路板的印刷电路板
公开(公告)号：US20090050354A1
公开(公告)日：2009-02-26
申请号：US12057654
申请日：2008-03-28
申请人： WEN-CHIN LEE , CHENG-HSIEN LIN
发明人： WEN-CHIN LEE , CHENG-HSIEN LIN
IPC分类号： H05K1/03
CPC分类号： H05K1/056 , H05K1/0393 , H05K2201/0355 , H05K2201/0382
摘要： A printed circuit board substrate includes an insulation matrix and a waterproof layer. The insulation matrix includes a first surface and a second surface at an opposite side thereof to the first surface. The waterproof layer is formed in the insulation matrix and is arranged between the first surface and the second surface for blocking water from passing therethrough in a thicknesswise direction of the insulation matrix.
摘要翻译：印刷电路板基板包括绝缘基体和防水层。绝缘矩阵包括与第一表面相对的第一表面和第二表面。防水层形成在绝缘基体中，并且布置在第一表面和第二表面之间，用于阻挡水在绝缘基体的厚度方向上穿过其中。

6. 发明申请

US20090013526A1 INNER SUBSTRATE FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS AND METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARDS USING THE SAME 有权
标题翻译：用于制造多层印刷电路板的内部基板和使用其制造多层印刷电路板的方法
公开(公告)号：US20090013526A1
公开(公告)日：2009-01-15
申请号：US11959212
申请日：2007-12-18
申请人： CHIH-KANG YANG , CHENG-HSIEN LIN
发明人： CHIH-KANG YANG , CHENG-HSIEN LIN
IPC分类号： H05K3/36 , H05K3/42
CPC分类号： H05K3/0097 , H05K1/0393 , H05K3/06 , H05K3/242 , H05K3/4611 , H05K3/4635 , H05K3/4652 , H05K3/4691 , H05K2201/055 , H05K2201/09036 , H05K2201/09063 , H05K2201/1028 , H05K2203/1536 , H05K2203/1545 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49165 , Y10T428/15
摘要： An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.
摘要翻译：提供了用于制造多层印刷电路板的示例性内基板。内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。每个基板单元被构造成用于形成一体的印刷电路板。每个折叠部分在相邻的基板单元之间互连。每个折叠部分限定垂直于内部基板的纵向方向的至少一条线弱点，以便于相邻的基板单元相互折叠和展开。还提供了使用内部基板制造多层印刷电路板的示例性方法。该方法可以提高制造多层印刷电路板的效率。

7. 发明申请

US20080264675A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20080264675A1
公开(公告)日：2008-10-30
申请号：US11847297
申请日：2007-08-29
申请人： WEN-CHIN LEE , CHENG-HSIEN LIN
发明人： WEN-CHIN LEE , CHENG-HSIEN LIN
IPC分类号： H05K1/00 , B23K26/38
CPC分类号： H05K3/281 , B23K1/0016 , B23K26/361 , H05K3/0035 , H05K3/28 , H05K3/3452
摘要： An exemplary method for manufacturing a printed circuit board is provided. In the method, firstly, a circuit substrate having a substrate and a number of soldering pads is provided. Secondly, a protective layer is formed onto the circuit substrate in a manner such that the soldering pads are entirely covered by the protective layer. Fourthly, a laser beam is applied onto portions of the protective layer spatially corresponding to the soldering pads in a manner such that the portions of the protective layer is removed, thereby exposing the soldering pads to an exterior. A printed circuit board having a protective layer with high precision of resolution is also provided.
摘要翻译：提供了制造印刷电路板的示例性方法。在该方法中，首先，提供具有基板和多个焊盘的电路基板。其次，以使得焊盘完全被保护层覆盖的方式在电路基板上形成保护层。第四，以保护层的部分被去除的方式将激光束施加到空间对应于焊盘的保护层的部分上，从而将焊盘暴露于外部。还提供了具有高精度分辨率的保护层的印刷电路板。

8. 发明申请

US20100059910A1 APPARATUS FOR RECYCLING METAL FROM METAL IONS CONTAINING WASTE SOLUTION 有权
标题翻译：用于从含有废物溶液的金属离子中回收金属的装置
公开(公告)号：US20100059910A1
公开(公告)日：2010-03-11
申请号：US12535909
申请日：2009-08-05
申请人： WEN-TSUN CHEN , SHIN-CHIH LIAW , TAO-MING LIAO , CHIA-HUNG SHEN , CHENG-HSIEN LIN
发明人： WEN-TSUN CHEN , SHIN-CHIH LIAW , TAO-MING LIAO , CHIA-HUNG SHEN , CHENG-HSIEN LIN
IPC分类号： C22B3/02
CPC分类号： C22B7/006 , C02F2101/20 , C02F2103/346 , C22B3/02 , C22B3/46 , C22B15/0091 , Y02P10/234 , Y02P10/236
摘要： An apparatus for recycling metals from metal ions containing waste solution includes a conveying device, a reducing agent supplier and a solution supplier. The conveying device includes a first ferromagnetic conveyor belt, a first roller, and a second roller. The first and second rollers are substantially horizontally arranged, and the second roller is arranged at a lower position relative to the first roller and spaced from the first roller. The ferromagnetic conveyor belt is wrapped around the first and second rollers. The reducing agent supplier is used for supplying a reducing agent onto the first conveyor belt, the ferromagnetic conveyor belt is capable of conveying the reducing agent from the second roller to the first roller. The solution supplier is configured for supplying the waste solution onto the first conveyor belt.
摘要翻译：用于从含金属离子的废液中回收金属的设备包括输送装置，还原剂供应商和溶液供应商。输送装置包括第一铁磁输送带，第一辊和第二辊。第一和第二辊基本上是水平布置的，并且第二辊布置在相对于第一辊子的下部位置并与第一辊子间隔开。铁磁输送带缠绕在第一和第二辊子周围。还原剂供应器用于将还原剂供应到第一传送带上，铁磁传送带能够将还原剂从第二辊输送到第一辊。解决方案供应商被配置为将废溶液供应到第一传送带上。

9. 发明申请

US20090286006A1 INK AND METHOD OF FORMING ELECTRICAL TRACES USING THE SAME 审中-公开
标题翻译：使用其形成电子痕迹的油墨和方法
公开(公告)号：US20090286006A1
公开(公告)日：2009-11-19
申请号：US12327621
申请日：2008-12-03
申请人： CHENG-HSIEN LIN , QIU-YUE ZHANG , YAO-WEN BAI
发明人： CHENG-HSIEN LIN , QIU-YUE ZHANG , YAO-WEN BAI
IPC分类号： C09D11/00 , B05D3/06
CPC分类号： H05K3/182 , C09D11/38 , C09D11/52 , C23C18/14 , C23C18/1608 , C23C18/161 , C23C18/1651 , C23C18/405 , C23C18/44 , H05K3/105 , H05K2203/013 , H05K2203/1157
摘要： An exemplary ink for forming electrical traces includes an aqueous carrier medium, a palladium salt and a reducing agent. The palladium salt is capable of being dissolved in the aqueous carrier medium. The reducing agent is configured for reducing the palladium ions into palladium particles under an irradiation ray.
摘要翻译：用于形成电迹线的示例性油墨包括水性载体介质，钯盐和还原剂。钯盐能够溶解在载体介质中。还原剂被配置为在照射光线下将钯离子还原成钯颗粒。

10. 发明申请

US20090050677A1 METHOD OF WELDING ELECTRONIC COMPONENTS ON PCBS 审中-公开
标题翻译：在PCBS上焊接电子元件的方法
公开(公告)号：US20090050677A1
公开(公告)日：2009-02-26
申请号：US12102613
申请日：2008-04-14
申请人： JIAN-YI HAO , I-HSIEN CHIANG , CHENG-HSIEN LIN
发明人： JIAN-YI HAO , I-HSIEN CHIANG , CHENG-HSIEN LIN
IPC分类号： B23K31/02
CPC分类号： H05K3/3494 , B23K1/0016 , B23K2101/40 , B23K2101/42 , H05K2203/0165 , H05K2203/1581
摘要： An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are mounted on the welding pads. Fourthly, PCBs are placed on the metal tray in a manner that each printed circuit board is placed in a corresponding supporting area and the welding pads being above the through hole. Finally, the solder pastes are heated to weld the electronic components on the printed circuit board. By doing so, the heat can pass through the through holes in each supporting area directly and fully melt the solder paste. As a result, welding defects can be reduced.
摘要翻译：公开了一种在PCB上焊接电子部件的示例性方法。首先，提供包括多个支撑区域的金属托盘。在每个支撑区域中形成至少一个通孔。其次，将焊膏施加到PCB的焊盘上。第三，将电子部件安装在焊盘上。第四，将印刷电路板放置在金属托盘上，使每个印刷电路板放置在相应的支撑区域中，焊盘位于通孔上方。最后，焊膏被加热以焊接印刷电路板上的电子部件。通过这样做，热能够直接通过每个支撑区域中的通孔并使焊膏完全熔化。结果，可以减少焊接缺陷。

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