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    • 2. 发明申请
    • APPARATUSES INCLUDING MEMORY CELLS AND METHODS OF OPERATION OF SAME
    • 包括存储单元的设备和操作方法
    • WO2018080615A1
    • 2018-05-03
    • PCT/US2017/046585
    • 2017-08-11
    • MICRON TECHNOLOGY, INC.
    • PIROVANO, AgostinoTORTORELLI, InnocenzoREDAELLI, AndreaPELLIZZER, Fabio
    • G11C5/02G11C11/00
    • Disclosed herein is a memory cell including a memory element and a selector device. The memory cell may be programmed with a programming pulse having a first polarity and read with a read pulse having a second polarity. The memory cell may be programmed with a programming pulse having first and second portions. The first and second portions may have different magnitudes and polarities. The memory cell may exhibit reduced voltage drift and/or threshold voltage distribution. Described herein is a memory cell that acts as both a memory element and a selector device. The memory cell may be programmed with a programming pulse having first and second portions. The first and second portions may have different magnitudes and polarities.
    • 这里公开了一种包括存储器元件和选择器装置的存储器单元。 存储器单元可以用具有第一极性的编程脉冲编程并且用具有第二极性的读取脉冲读取。 存储器单元可以用具有第一和第二部分的编程脉冲编程。 第一和第二部分可以具有不同的大小和极性。 存储器单元可以表现出降低的电压漂移和/或阈值电压分布。 这里描述的是充当存储器元件和选择器器件的存储器单元。 存储器单元可以用具有第一和第二部分的编程脉冲编程。 第一和第二部分可以具有不同的大小和极性。
    • 8. 发明申请
    • CROSS-POINT MEMORY AND METHODS FOR FABRICATION OF SAME
    • 跨点存储器及其制造方法
    • WO2015130455A1
    • 2015-09-03
    • PCT/US2015/015023
    • 2015-02-09
    • MICRON TECHNOLOGY, INC.
    • RAVASIO, MarcelloSCIARRILLO, SamuelePELLIZZER, FabioTORTORELLI, InnocenzoSOMASCHINI, RobertoCASELLATO, CristinaMOTTADELLI, Riccardo
    • H01L45/00H01L43/02H01L49/00H01L27/115
    • H01L27/2463H01L27/2427H01L45/06H01L45/12H01L45/1233H01L45/144H01L45/1675
    • The disclosed technology relates generally to integrated circuit devices, and in particular to cross-point memory arrays and methods for fabricating the same, in one aspect, a method of fabricating cross-point memory arrays comprises forming a memory cell material stack which includes a first active material and a second active material over the first active material, wherein one of the first and second active materials comprises a storage material and the other of the first and second active materials comprises a selector material. The method of fabricating cross-point arrays further comprises patterning the memory cell material stack, which includes etching through at least one of the first and second active materials of the memory cell material stack, forming protective liners on sidewalls of the at least one of the first and second active materials after etching through the one of the first and second active materials, and further etching the memory cell material stack after forming the protective liners on the sidewalls of the one of the first and second active materials.
    • 所公开的技术通常涉及集成电路器件,特别是涉及交叉点存储器阵列及其制造方法,一方面,制造交叉点存储器阵列的方法包括形成存储单元材料堆叠,其包括第一 活性材料和第一活性材料上的第二活性材料,其中所述第一和第二活性材料中的一种包含储存材料,所述第一和第二活性材料中的另一种包括选择材料。 制造交叉点阵列的方法还包括对存储单元材料堆叠进行图案化,其包括通过存储单元材料堆叠的第一和第二活性材料中的至少一个的蚀刻,在至少一个的至少一个的侧壁上形成保护衬垫 在蚀刻通过第一和第二活性材料之一之后蚀刻第一和第二活性材料,并且在第一和第二活性材料之一的侧壁上形成保护衬垫之后进一步蚀刻存储单元材料堆叠。