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    • 1. 发明申请
    • FABRICATION METHODS AND STRUCTURES FOR MICRO-RESERVOIR DEVICES
    • 微型储存装置的制造方法和结构
    • WO2006055593A3
    • 2007-04-19
    • PCT/US2005041453
    • 2005-11-15
    • MICROCHIPS INCMALONEY JOHN MSBIAA ZOUHAIRSANTINI JOHN T JRSHEPPARD NORMAN F JRUHLAND SCOTT A
    • MALONEY JOHN MSBIAA ZOUHAIRSANTINI JOHN T JRSHEPPARD NORMAN F JRUHLAND SCOTT A
    • B01L3/00
    • B01L3/50853A61K9/0024A61K9/0097B01L2200/12B01L2300/0819B01L2400/0677
    • Methods are provided for making a multi-reservoir device comprising (i) patterning one or more photoresist layers on a substrate; (ii) depositing onto the substrate at least one metal layer by a sputtering process to form a plurality of reservoir caps and conductive traces; (iii) removing the photoresist layers using a liftoff process; (iv) forming a plurality of reservoirs in the substrate; (v) loading each reservoir with reservoir contents (such as a drug or sensor); and (vi) sealing each reservoir. Optionally, the reservoir cap comprises a first conductive metal layer coated with one or more protective noble metal films. To enhance the resistance of the substrate (e.g., a silicon substrate) to etching in vivo, the interior sidewalls of the reservoirs optionally can include a protective coating (e.g., gold, platinum, carbon, silicon carbide, silicon dioxide, and platinum silicide), or sidewalls comprising silicon can be doped with boron or another impurity.
    • 提供了用于制造多贮存器器件的方法,包括(i)在衬底上图案化一个或多个光致抗蚀剂层; (ii)通过溅射工艺在衬底上沉积至少一个金属层,以形成多个储存器盖和导电迹线; (iii)使用剥离工艺除去光致抗蚀剂层; (iv)在所述基板中形成多个储存器; (v)向每个储存器装载储存器内容物(例如药物或传感器); 和(vi)密封每个储存器。 可选地,储存器盖包括涂覆有一个或多个保护性贵金属膜的第一导电金属层。 为了增强衬底(例如,硅衬底)在体内蚀刻的电阻,存储器的内侧壁任选地可以包括保护涂层(例如金,铂,碳,碳化硅,二氧化硅和硅化铂) ,或者包含硅的侧壁可以掺杂硼或另一种杂质。