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1. 发明申请

US20110291910A1 ASSEMBLY OF CHIP ANTENNA AND CIRCUIT BOARD 有权
标题翻译：芯片天线和电路板组装
公开(公告)号：US20110291910A1
公开(公告)日：2011-12-01
申请号：US13077014
申请日：2011-03-31
申请人： MENG HSUEH TSAI , CHIH MING SU , LEE TING HSIEH
发明人： MENG HSUEH TSAI , CHIH MING SU , LEE TING HSIEH
IPC分类号： H01Q1/48
CPC分类号： H01Q1/2283 , H01Q1/38
摘要： An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.
摘要翻译：芯片天线和电路板的组件包括芯片天线和电路板。电路板包括接地层。接地层包括与接地层的周边相邻形成的中空区域。接地层的中空区域可用于配置电路板的输入阻抗。芯片天线设置在接地层的中空区域中，电连接到接地层。芯片天线包括输入阻抗。芯片天线的输入阻抗是可调节的，以实现芯片天线和电路板之间的共轭阻抗匹配，使得电路板和芯片天线可以同时辐射电磁能。

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