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1. 发明申请

WO2013019646A2 ELECTRICAL LEADS FOR A FEEDTHROUGH 审中-公开
标题翻译：电子导线用于馈送
公开(公告)号：WO2013019646A2
公开(公告)日：2013-02-07
申请号：PCT/US2012048618
申请日：2012-07-27
申请人： MEDTRONIC INC , MILTICH THOMAS , YAMAMOTO JOYCE , THOM ANDREW , REITERER MARKUS , MUNNS GORDON , BREYEN MARK
发明人： MILTICH THOMAS , YAMAMOTO JOYCE , THOM ANDREW , REITERER MARKUS , MUNNS GORDON , BREYEN MARK
IPC分类号： A61N1/375 , H01R13/52
CPC分类号： H01R43/0221 , A61N1/3754 , H01R4/029 , H01R2201/12 , Y10T29/49117
摘要： A lead frame for attaching leads to a hermetic feedthrough includes a cross-member and a plurality of leads. Each of the leads has an elongate body extending from the cross-member in a direction substantially parallel with one another, and each lead includes at least one of a notch on an end thereof opposite to the cross-member or a hole proximate to the end.
摘要翻译：用于连接的引线框架通向密封馈通件包括横向构件和多个引线。每个引线具有细长主体，该细长主体沿着基本彼此平行的方向从横向构件延伸，并且每个引线包括在与横向构件相对的端部上的凹口或靠近端部的孔中的至少一个。

2. 发明申请

WO2013019867A3 HERMETIC FEEDTHROUGH 审中-公开
标题翻译：密封的食物
公开(公告)号：WO2013019867A3
公开(公告)日：2013-07-11
申请号：PCT/US2012049172
申请日：2012-08-01
申请人： MEDTRONIC INC , KYOCERA CORP , MORIOKA KENGO , KNUDSEN ARNE , SATOU SHINGO , OTOMARU HIDEKAZU , THOM ANDREW , MAKINO HIROSHI , REITERER MARKUS , MUNNS GORDON , MILTICH THOMAS , YAMAMOTO JOYCE , HIRATA TAKAHITO
发明人： MORIOKA KENGO , KNUDSEN ARNE , SATOU SHINGO , OTOMARU HIDEKAZU , THOM ANDREW , MAKINO HIROSHI , REITERER MARKUS , MUNNS GORDON , MILTICH THOMAS , YAMAMOTO JOYCE , HIRATA TAKAHITO
IPC分类号： B22F5/10 , A61N1/375 , B22F7/06
CPC分类号： A61N1/3754 , C22C32/0021
摘要： According to one embodiment, a feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole. According to another embodiment, a hermetic feedthrough for an implantable medical device includes a sheet having a hole, where the sheet includes a ceramic comprising alumina. The feedthrough also includes a second material substantially filling the hole, where the second material includes a platinum powder mixture and an alumina additive. The platinum powder mixture includes a first platinum powder having a median particle size of between approximately 3 and 10 micrometers and a second platinum powder that is coarser than the first platinum powder and has a median particle size of between approximately 5 and 20 micrometers. The platinum powder mixture includes between approximately 50 and 80 percent by weight of the first platinum powder and between approximately 20 and 50 percent by weight of the second platinum powder. The first and second materials have a co-fired bond therebetween that hermetically seals the hole.
摘要翻译：根据一个实施例，馈通件包括具有孔的片，其中片包括第一材料，该第一材料是包含氧化铝的陶瓷。馈通还包括基本上填充孔的第二材料。第二材料不同于第一材料并且包括铂和包括氧化铝的添加剂。第一材料和第二材料之间具有共烧结结合，其气密地密封孔。根据另一个实施例，一种用于可植入医疗装置的气密馈通件包括具有孔的片材，其中所述片材包括包含氧化铝的陶瓷。馈通还包括基本上填充孔的第二材料，其中第二材料包括铂粉混合物和氧化铝添加剂。铂粉混合物包括中值粒度在约3和10微米之间的第一铂粉和比第一铂粉更粗且中值粒度在约5和20微米之间的第二铂粉。铂粉混合物包含约50-80重量％的第一铂粉和约20-50重量％的第二铂粉。第一材料和第二材料之间具有共烧结结合，其气密地密封孔。

3. 发明专利

AT488845T 未知
公开(公告)号：AT488845T
公开(公告)日：2010-12-15
申请号：AT01948587
申请日：2001-06-21
申请人： MEDTRONIC INC
发明人： NIELSEN CHRISTIAN , BOMSTAD TIMOTHY , BREYEN MARK , MILTICH THOMAS , CLARKE MICHAEL , RORVICK ANTHONY
IPC分类号： H01G9/008 , A61N1/375 , A61N1/378 , A61N1/39 , A61N1/40 , G06F19/00 , H01G2/10 , H01G2/20 , H01G4/228 , H01G9/00 , H01G9/048 , H01G9/06 , H01G9/08 , H01G9/10
摘要： Implantable medical devices (IMDs) and their various components, including flat electrolytic capacitors for same, and methods of making and using same, particularly a simplified, miniature capacitor connector block and wiring harness utilizing an epoxy droplet and method of making same are disclosed. An electrode stack assembly and electrolyte are located within the interior case chamber of a hermetically sealed capacitor case. The electrode stack includes a plurality of capacitor layers stacked in registration upon one another, each capacitor layer including a cathode layer having a cathode tab, an anode sub-assembly comprising at least one anode layer having an anode tab, and a separator layer located between adjacent anode and cathode layers, whereby all adjacent cathode layers and anode layers of the stack are electrically insulated from one another by a separator layer. Anode terminal means extend through the capacitor case side wall for electrically connecting a plurality of the anode tabs to one another and providing an anode connection terminal at the exterior of the case. Cathode terminal means extend through or to an encapsulation area of the capacitor case side wall for electrically connecting a plurality of the cathode tabs to one another and providing a cathode connection terminal at the exterior of the case. A connector assembly is electrically attached to the anode connection terminal for making electrical connection with the anode tabs and to the cathode connection terminal for making electrical connection with the cathode tabs. A connector block is formed of an epoxy droplet adhered to the encapsulation area of the capacitor side wall surrounding and encapsulating the anode and cathode connection terminals and the electrical connections with the connector assembly. The connector block is formed on an encapsulation area of the case side wall of epoxy that is cured for a period of time under elevated temperature conditions while rotating the capacitor assembly.

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