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1. 发明申请

WO2008094783A1 CONNECTOR ASSEMBLY FOR AN IMPLANTABLE MEDICAL DEVICE AND PROCESS FOR MAKING 审中-公开
标题翻译：用于可植入医疗设备的连接器组件及其制造方法
公开(公告)号：WO2008094783A1
公开(公告)日：2008-08-07
申请号：PCT/US2008/051609
申请日：2008-01-22
申请人： MEDTRONIC, INC. , ZART, Bryan J. , RIES, Andrew J. , LAHTI, Jay, K. , BURWICK, Brian R. , NICHOLSON, John E. , THEIS, Greg A.
发明人： ZART, Bryan J. , RIES, Andrew J. , LAHTI, Jay, K. , BURWICK, Brian R. , NICHOLSON, John E. , THEIS, Greg A.
IPC分类号： A61N1/372
CPC分类号： H01R13/405 , A61N1/05 , A61N1/37229 , A61N1/3752 , H01R43/24 , Y10S439/909
摘要： A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.
摘要翻译：用于联接到可植入医疗装置的连接器组件包括由第一热塑性材料形成的芯元件，该第一热塑性材料成形为接收用于接收引线的连接器构件。连接器组件还包括邻近核心元件定位的电路元件。电路构件包括沿芯体延伸到连接器构件的部分和在芯体元件外表面的一部分上延伸的天线结构。

2. 发明授权

EP1295367B1 SYSTEM AND METHOD FOR TWO-SHOT MOLDING OF THERMOPLASTIC MATERIALS 有权
标题翻译：设备从热塑性材料和有关的两阶段施放
公开(公告)号：EP1295367B1
公开(公告)日：2005-05-11
申请号：EP01946544.2
申请日：2001-06-20
申请人： Medtronic, Inc.
发明人： ZART, Bryan, J. , BURWICK, Brian R. , RIES, Andrew, J. , NICHOLSON, John, E. , LAHTI, Jay
IPC分类号： H01R43/18 , H01R43/24 , A61N1/375
CPC分类号： B29C45/1671 , A61N1/3752 , B29C45/14639 , B29L2031/753 , H01R13/504 , H01R43/18
摘要： An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptables or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

3. 发明公开

EP1295367A2 SYSTEM AND METHOD FOR TWO-SHOT MOLDING OF THERMOPLASTIC MATERIALS 有权
标题翻译：设备从热塑性材料和有关的两阶段施放
公开(公告)号：EP1295367A2
公开(公告)日：2003-03-26
申请号：EP01946544.2
申请日：2001-06-20
申请人： Medtronic, Inc.
发明人： ZART, Bryan, J. , BURWICK, Brian R. , RIES, Andrew, J. , NICHOLSON, John, E. , LAHTI, Jay
IPC分类号： H01R43/18 , H01R43/24 , A61N1/375
CPC分类号： B29C45/1671 , A61N1/3752 , B29C45/14639 , B29L2031/753 , H01R13/504 , H01R43/18
摘要： An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptables or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

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