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1. 发明申请

WO2003090862A1 ELECTRICALLY INSULATED COMPONENT SUB-ASSEMBLIES OF IMPLANTABLE MEDICAL DEVICES 审中-公开
标题翻译：可植入医疗器械的电气绝缘部件组件
公开(公告)号：WO2003090862A1
公开(公告)日：2003-11-06
申请号：PCT/US2003/012987
申请日：2003-04-24
申请人： MEDTRONIC, INC.
发明人： RIES, Andrew, J. , NORTON, John, D. , MAY, Steven, J. , BREYEN, Mark, D. , MILTICH, Thomas, P. , RODGERS, Angela
IPC分类号： A61N1/375
CPC分类号： A61N1/375 , A61N1/3758 , B33Y80/00
摘要： Implantable medical devices (IMDs) and their various components, particularly methods and apparatus for electrically isolating and supporting components of an IMD IPG, e.g., capacitors of a capacitor sub-assembly, thereof in volumetrically efficient ways. A capacitor sub-assembly comprising two or more capacitors stacked side-by-side such that the facing capacitor case major sides are separated by a reliable and simple to apply insulation layer of minimal thickness is disclosed for assembly with other components of an ICD IPG into an IPG housing. A shape conforming insulating spacer is formed of an insulating polymer to conform to the shape of a first capacitor case major side and the perimeter of that major side. The shape conforming insulating spacer is simply applied or adhered by adhesive layers, bands or patterns to one or both of the facing capacitor case major sides.
摘要翻译：可植入医疗器械（IMD）及其各种部件，特别是用于以体积有效的方式电气隔离和支撑IMD IPG的部件（例如电容器子组件的电容器）的方法和装置。电容器子组件包括并排堆叠的两个或更多个电容器，使得面对的电容器壳体主侧面被可靠且简单地施加最小厚度的绝缘层分开，用于与ICD IPG的其它部件组装成 IPG住房。形状一致的绝缘隔离物由绝缘聚合物形成以符合第一电容器壳体主侧和该主要侧面的周边的形状。形状一致的绝缘间隔物通过粘合剂层，带或图案简单地施加或粘附到面向电容器壳体主侧中的一个或两个。

2. 发明申请

WO2004033035A2 COMPLEX CONNECTOR IN COMPONENT FOOTPRINT OF IMPLANTABLE MEDICAL DEVICE 审中-公开
标题翻译：复杂连接器在可植入医疗设备的组件支架中
公开(公告)号：WO2004033035A2
公开(公告)日：2004-04-22
申请号：PCT/US2003/031765
申请日：2003-10-07
申请人： MEDTRONIC, INC.
发明人： RODGERS, Angela , CASBY, Kurt, J. , BREYEN, Mark, D. , ROSS, Brian, J. , APPLESETH, Wayne, L. , KEHN, Jeffrey, L. , RIES, Andrew, J. , NORTON, John, D. , ERKOUTS, Dan, D. , BOMSTAD, Timothy, T. , CLARKE, Michael, E. , ROBINSON, Scott, J.
IPC分类号： A61N1/375
CPC分类号： A61N1/05 , A61N1/375 , H01G9/008 , H01G9/08 , H01R2201/12
摘要： A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.
摘要翻译：复杂连接器和部件在可植入医疗设备内，其中复杂连接器位于部件的间隔足迹内以优化设备内的封装。

3. 发明授权

EP1558337B1 COMPLEX CONNECTOR FOR CAPACITORS IN IMPLANTABLE MEDICAL DEVICES 有权
标题翻译： COMPLEX拟合于可植入医疗设备电容器
公开(公告)号：EP1558337B1
公开(公告)日：2014-09-10
申请号：EP03773192.4
申请日：2003-10-07
申请人： Medtronic, Inc.
发明人： RODGERS, Angela , CASBY, Kurt, J. , BREYEN, Mark, D. , ROSS, Brian, J. , APPLESETH, Wayne, L. , KEHN, Jeffrey, L. , RIES, Andrew, J. , NORTON, John, D. , ERKOUTS, Dan, D. , BOMSTAD, Timothy, T. , CLARKE, Michael E. , ROBINSON, Scott, J.
IPC分类号： A61N1/375 , H01G9/08 , H01G9/00
CPC分类号： A61N1/05 , A61N1/375 , H01G9/008 , H01G9/08 , H01R2201/12

4. 发明公开

EP1558337A2 COMPLEX CONNECTOR FOR CAPACITORS IN IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：复为拟合电容器植入医疗设备
公开(公告)号：EP1558337A2
公开(公告)日：2005-08-03
申请号：EP03773192.4
申请日：2003-10-07
申请人： Medtronic, Inc.
发明人： RODGERS, Angela , CASBY, Kurt, J. , BREYEN, Mark, D. , ROSS, Brian, J. , APPLESETH, Wayne, L. , KEHN, Jeffrey, L. , RIES, Andrew, J. , NORTON, John, D. , ERKOUTS, Dan, D. , BOMSTAD, Timothy, T. , CLARKE, Michael E. , ROBINSON, Scott, J.
IPC分类号： A61N1/375 , H01G9/08 , H01G9/00
CPC分类号： A61N1/05 , A61N1/375 , H01G9/008 , H01G9/08 , H01R2201/12
摘要： A complex connector and component within an implantable medical device in which the complex connector is positioned within the spacing footprint of the component to optimize packaging within the device.

5. 发明授权

EP1499387B1 ELECTRICALLY INSULATED COMPONENT SUB-ASSEMBLIES OF IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：电气元件用绝缘植入性医疗器械的亚基
公开(公告)号：EP1499387B1
公开(公告)日：2008-08-06
申请号：EP03736494.0
申请日：2003-04-24
申请人： MEDTRONIC, INC.
发明人： RIES, Andrew, J. , NORTON, John, D. , MAY, Steven, J. , BREYEN, Mark, D. , MILTICH, Thomas, P. , RODGERS, Angela
IPC分类号： A61N1/375
CPC分类号： A61N1/375 , A61N1/3758 , B33Y80/00
摘要： Implantable medical devices (IMDs) and their various components, particularly methods and apparatus for electrically isolating and supporting components of an IMD IPG, e.g., capacitors of a capacitor sub-assembly, thereof in volumetrically efficient ways. A capacitor sub-assembly comprising two or more capacitors stacked side-by-side such that the facing capacitor case major sides are separated by a reliable and simple to apply insulation layer of minimal thickness is disclosed for assembly with other components of an ICD IPG into an IPG housing. A shape conforming insulating spacer is formed of an insulating polymer to conform to the shape of a first capacitor case major side and the perimeter of that major side. The shape conforming insulating spacer is simply applied or adhered by adhesive layers, bands or patterns to one or both of the facing capacitor case major sides.
摘要翻译：可植入医疗设备（IMD）和它们的各种部件，尤其是方法和用于电隔离装置和IMD IPG，E. G.的支撑部件，一个电容器子组件的电容器，在容积效率的方式它们。一种电容器子组件，其包括堆叠的两个或更多个电容器并排侧搜索，DASS模具面对电容器壳体主侧面是由一个可靠和简单的分离，以使用最小厚度的绝缘层光盘游离缺失用于与ICD IPG的其它组件集成到组件在IPG住房。形状相符绝缘衬垫上形成绝缘聚合物的以符合第一电容器壳体主侧面的形状和主侧面的周边一样。的形状相一致绝缘衬垫被简单地应用于或通过粘接层，带或图案粘附到一个或两个面对电容器壳体主侧面的。

6. 发明公开

EP1499387A1 ELECTRICALLY INSULATED COMPONENT SUB-ASSEMBLIES OF IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：电气元件用绝缘植入性医疗器械的亚基
公开(公告)号：EP1499387A1
公开(公告)日：2005-01-26
申请号：EP03736494.0
申请日：2003-04-24
申请人： Medtronic, Inc.
发明人： RIES, Andrew, J. , NORTON, John, D. , MAY, Steven, J. , BREYEN, Mark, D. , MILTICH, Thomas, P. , RODGERS, Angela
IPC分类号： A61N1/375
CPC分类号： A61N1/375 , A61N1/3758 , B33Y80/00
摘要： Implantable medical devices (IMDs) and their various components, particularly methods and apparatus for electrically isolating and supporting components of an IMD IPG, e.g., capacitors of a capacitor sub-assembly, thereof in volumetrically efficient ways. A capacitor sub-assembly comprising two or more capacitors stacked side-by-side such that the facing capacitor case major sides are separated by a reliable and simple to apply insulation layer of minimal thickness is disclosed for assembly with other components of an ICD IPG into an IPG housing. A shape conforming insulating spacer is formed of an insulating polymer to conform to the shape of a first capacitor case major side and the perimeter of that major side. The shape conforming insulating spacer is simply applied or adhered by adhesive layers, bands or patterns to one or both of the facing capacitor case major sides.

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