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1. 发明申请

WO2005014108A1 CONNECTOR ASSEMBLY FOR CONNECTING A LEAD AND AN IMPLANTABLE MEDICAL DEVICE 审中-公开
标题翻译：用于连接导线和可植入医疗设备的连接器组件
公开(公告)号：WO2005014108A1
公开(公告)日：2005-02-17
申请号：PCT/US2004/020809
申请日：2004-06-28
申请人： MEDTRONIC, INC. , LAHTI, Jay , RIES, Andrew, J. , FORSYTHE, Scott
发明人： LAHTI, Jay , RIES, Andrew, J. , FORSYTHE, Scott
IPC分类号： A61N1/375
CPC分类号： H01R13/5224 , A61N1/3752 , H01R13/5208 , H01R2201/12
摘要： A connector assembly for detachably connecting a lead to an implantable medical device and an implantable medical device capable of being detachably connected to a lead that include one or more deflectable connector clip and a housing. The connector clip includes a first arm, a second arm, and a top portion extending between the first arm and the second arm, and is capable of being deflected from a first position, corresponding to a first relative position of the first arm and the second arm, to a second position corresponding to a second relative position of the first arm and the second arm. The housing includes a first member and a second member, the first member formed to be fixedly engaged with the second member to enclose the connector clip within the housing with the one or more connector clip being positioned within one of the first member and the second member.
摘要翻译：一种用于将引线可拆卸地连接到可植入医疗装置的连接器组件和能够可拆卸地连接到包括一个或多个可偏转连接器夹子和壳体的引线的可植入医疗装置。连接器夹包括第一臂，第二臂和在第一臂和第二臂之间延伸的顶部，并且能够从第一位置偏转，对应于第一臂和第二臂的第一相对位置臂到达对应于第一臂和第二臂的第二相对位置的第二位置。壳体包括第一构件和第二构件，第一构件形成为与第二构件固定地接合以将连接器夹子包围在壳体内，其中一个或多个连接器夹具定位在第一构件和第二构件之一内。

2. 发明公开

EP1957151A2 METHOD FOR FORMING A CONNECTOR ASSEMBLY FOR USE WITH AN IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：一种用于形成插塞装置FOR USE WITH可植入医疗装置
公开(公告)号：EP1957151A2
公开(公告)日：2008-08-20
申请号：EP06839652.2
申请日：2006-11-01
申请人： MEDTRONIC, INC.
发明人： RIES, Andrew, J. , LAHTI, Jay , PATRAS, George , LONGTIN, John, T. , ZART, Bryan, J.
IPC分类号： A61N1/00
CPC分类号： H01R13/504 , A61N1/3752 , H01R4/02 , H01R4/029 , H01R4/30 , H01R13/03 , H01R43/16 , H01R43/24 , Y10T29/49146
摘要： A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more sepsrately~formed sections which are mechanically joined together to form an integral assembly. Hie sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.

3. 发明公开

EP1651306A1 SMALL FORMAT CONNECTOR CLIP OF AN IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：小的空间PLUG支架的可植入医疗装置
公开(公告)号：EP1651306A1
公开(公告)日：2006-05-03
申请号：EP04756290.5
申请日：2004-06-28
申请人： MEDTRONIC, INC.
发明人： RIES, Andrew, J. , LAHTI, Jay
IPC分类号： A61N1/00
CPC分类号： A61N1/3752
摘要： A connector assembly for detachably connecting an electrical lead to an implantable medical device for emitting electrical pulses is provided. One or more deflectable connector clips are positioned inside or partially inside a compact housing that is designed to deflect the connector clips in a partially loaded state so that insertion of the terminal pin of an electrical lead causes a minor deflection of the spring clip, but results in high retention force. The positioning of the connector clip in the housing in a partially loaded state results in a relatively flat force deflection curve. The one or more connector clips are preferably electrically conducting metal and may be formed into a U-shape. The connector clips are generally positioned to provide multiple contact points with an inserted terminal pin of a lead.

4. 发明申请

WO2007059374A2 METHOD FOR FORMING A CONNECTOR ASSEMBLY FOR USE WITH AN IMPLANTABLE MEDICAL DEVICE 审中-公开
标题翻译：用于形成使用可植入医疗装置的连接器组件的方法
公开(公告)号：WO2007059374A2
公开(公告)日：2007-05-24
申请号：PCT/US2006/060420
申请日：2006-11-01
申请人： MEDTRONIC, INC. , RIES, Andrew, J. , LAHTI, Jay , PATRAS, George , LONGTIN, John, T. , ZART, Bryan, J.
发明人： RIES, Andrew, J. , LAHTI, Jay , PATRAS, George , LONGTIN, John, T. , ZART, Bryan, J.
CPC分类号： H01R13/504 , A61N1/3752 , H01R4/02 , H01R4/029 , H01R4/30 , H01R13/03 , H01R43/16 , H01R43/24 , Y10T29/49146
摘要： A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more sepsrately~formed sections which are mechanically joined together to form an integral assembly. Hie sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
摘要翻译：用于可植入医疗装置的连接器组件中的截面互连带由两个更多的生油器形成的部分形成，这些部分机械地连接在一起以形成整体组件。 Hie截面互连带以及至少一个连接元件嵌入连接器组件内。

5. 发明申请

WO2005014104A1 SMALL FORMAT CONNECTOR CLIP OF AN IMPLANTABLE MEDICAL DEVICE 审中-公开
标题翻译：可移植医疗设备的小型连接器夹
公开(公告)号：WO2005014104A1
公开(公告)日：2005-02-17
申请号：PCT/US2004/020775
申请日：2004-06-28
申请人： MEDTRONIC, INC. , RIES, Andrew, J. , LAHTI, Jay
发明人： RIES, Andrew, J. , LAHTI, Jay
IPC分类号： A61N1/00
CPC分类号： A61N1/3752
摘要： A connector assembly for detachably connecting an electrical lead to an implantable medical device for emitting electrical pulses is provided. One or more deflectable connector clips are positioned inside or partially inside a compact housing that is designed to deflect the connector clips in a partially loaded state so that insertion of the terminal pin of an electrical lead causes a minor deflection of the spring clip, but results in high retention force. The positioning of the connector clip in the housing in a partially loaded state results in a relatively flat force deflection curve. The one or more connector clips are preferably electrically conducting metal and may be formed into a U-shape. The connector clips are generally positioned to provide multiple contact points with an inserted terminal pin of a lead.
摘要翻译：提供了一种用于将电引线可拆卸地连接到用于发射电脉冲的可植入医疗装置的连接器组件。一个或多个可偏转的连接器夹子位于紧凑的壳体的内部或部分内部，其被设计成在部分加载的状态下使连接器夹子偏转，使得电引线的端子销的插入导致弹簧夹的小的偏转，但是结果在高保持力。在部分负载状态下，连接器夹在壳体中的定位导致相对平坦的力偏转曲线。一个或多个连接器夹优选是导电金属并且可以形成为U形。连接器夹通常被定位成为引线的插入的端子引脚提供多个接触点。

6. 发明授权

EP1295367B1 SYSTEM AND METHOD FOR TWO-SHOT MOLDING OF THERMOPLASTIC MATERIALS 有权
标题翻译：设备从热塑性材料和有关的两阶段施放
公开(公告)号：EP1295367B1
公开(公告)日：2005-05-11
申请号：EP01946544.2
申请日：2001-06-20
申请人： Medtronic, Inc.
发明人： ZART, Bryan, J. , BURWICK, Brian R. , RIES, Andrew, J. , NICHOLSON, John, E. , LAHTI, Jay
IPC分类号： H01R43/18 , H01R43/24 , A61N1/375
CPC分类号： B29C45/1671 , A61N1/3752 , B29C45/14639 , B29L2031/753 , H01R13/504 , H01R43/18
摘要： An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptables or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

7. 发明公开

EP1295367A2 SYSTEM AND METHOD FOR TWO-SHOT MOLDING OF THERMOPLASTIC MATERIALS 有权
标题翻译：设备从热塑性材料和有关的两阶段施放
公开(公告)号：EP1295367A2
公开(公告)日：2003-03-26
申请号：EP01946544.2
申请日：2001-06-20
申请人： Medtronic, Inc.
发明人： ZART, Bryan, J. , BURWICK, Brian R. , RIES, Andrew, J. , NICHOLSON, John, E. , LAHTI, Jay
IPC分类号： H01R43/18 , H01R43/24 , A61N1/375
CPC分类号： B29C45/1671 , A61N1/3752 , B29C45/14639 , B29L2031/753 , H01R13/504 , H01R43/18
摘要： An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptables or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

8. 发明授权

EP1957151B1 METHOD OF FORMING A CONNECTOR ASSEMBLY TO BE USED WITH AN IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：一种用于形成插塞装置FOR USE WITH可植入医疗装置
公开(公告)号：EP1957151B1
公开(公告)日：2010-12-22
申请号：EP06839652.2
申请日：2006-11-01
申请人： Medtronic, Inc.
发明人： RIES, Andrew, J. , LAHTI, Jay , PATRAS, George , LONGTIN, John, T. , ZART, Bryan, J.
IPC分类号： A61N1/375
CPC分类号： H01R13/504 , A61N1/3752 , H01R4/02 , H01R4/029 , H01R4/30 , H01R13/03 , H01R43/16 , H01R43/24 , Y10T29/49146

9. 发明授权

EP1651306B1 SMALL FORMAT CONNECTOR CLIP OF AN IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：小的空间PLUG支架的可植入医疗装置
公开(公告)号：EP1651306B1
公开(公告)日：2009-04-15
申请号：EP04756290.5
申请日：2004-06-28
申请人： MEDTRONIC, INC.
发明人： RIES, Andrew, J. , LAHTI, Jay
IPC分类号： A61N1/00
CPC分类号： A61N1/3752
摘要： A connector assembly for detachably connecting an electrical lead to an implantable medical device for emitting electrical pulses is provided. One or more deflectable connector clips are positioned inside or partially inside a compact housing that is designed to deflect the connector clips in a partially loaded state so that insertion of the terminal pin of an electrical lead causes a minor deflection of the spring clip, but results in high retention force. The positioning of the connector clip in the housing in a partially loaded state results in a relatively flat force deflection curve. The one or more connector clips are preferably electrically conducting metal and may be formed into a U-shape. The connector clips are generally positioned to provide multiple contact points with an inserted terminal pin of a lead.

10. 发明授权

EP1651312B1 CONNECTOR ASSEMBLY FOR CONNECTING A LEAD AND AN IMPLANTABLE MEDICAL DEVICE 有权
标题翻译：接头用于连接LINE与可植入医疗装置
公开(公告)号：EP1651312B1
公开(公告)日：2007-10-17
申请号：EP04756320.0
申请日：2004-06-28
申请人： MEDTRONIC, INC.
发明人： LAHTI, Jay , RIES, Andrew, J. , FORSYTHE, Scott
IPC分类号： A61N1/375 , H01R13/52
CPC分类号： H01R13/5224 , A61N1/3752 , H01R13/5208 , H01R2201/12
摘要： A connector assembly for detachably connecting a lead to an implantable medical device and an implantable medical device capable of being detachably connected to a lead that include one or more deflectable connector clip and a housing. The connector clip includes a first arm, a second arm, and a top portion extending between the first arm and the second arm, and is capable of being deflected from a first position, corresponding to a first relative position of the first arm and the second arm, to a second position corresponding to a second relative position of the first arm and the second arm. The housing includes a first member and a second member, the first member formed to be fixedly engaged with the second member to enclose the connector clip within the housing with the one or more connector clip being positioned within one of the first member and the second member.

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