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1. 发明申请

WO2020046888A1 ELECTROCHEMICAL SENSOR INCLUDING MULTIPLE WORK ELECTRODES AND COMMON REFERENCE ELECTRODE 审中-公开
公开(公告)号：WO2020046888A1
公开(公告)日：2020-03-05
申请号：PCT/US2019/048274
申请日：2019-08-27
申请人： MEDTRONIC, INC.
发明人： HAHN, Daniel , ASKARINYA, Mohsen , CARNEY, James K. , KINZIE, Patrick W. , LORENZ MARCKMANN, Jennifer , SCHULHAUSER, Randal C. , VADDIRAJU, Santhisagar , SRINIVASAN, Akhil , PROBST, David , CHAVEZ GAXIOLA, Alejo
IPC分类号： G01N33/49 , A61B5/145 , G01N27/327
摘要： An electrochemical sensor may include a common reference electrode, at least one counter electrode, and a work electrode platform including a plurality of respective work electrodes. Each respective work electrode of the plurality of respective work electrodes may be electrically coupled to the common reference electrode and include a respective reagent substrate configured to react with a respective analyte to produce a signal indicative of a concentration of the respective analyte.

2. 发明申请

WO2013187992A1 WAFER LEVEL PACKAGES OF HIGH VOLTAGE UNITS FOR IMPLANTABLE MEDICAL DEVICES AND CORRESPONDING FABRICATION METHODS 审中-公开
标题翻译：用于可植入医疗器械的高压单元的水平包装和相应的制造方法
公开(公告)号：WO2013187992A1
公开(公告)日：2013-12-19
申请号：PCT/US2013/035056
申请日：2013-04-03
申请人： MEDTRONIC, INC.
发明人： BOONE, Mark R. , ASKARINYA, Mohsen , CRUTCHFIELD, Randolph E. , HERRMANN, Erik , RICOTTA, Mark S. , WANG, Lejun
IPC分类号： A61N1/39 , H01L25/00
CPC分类号： A61N1/3956 , F04C2270/041 , H01L23/49548 , H01L23/49575 , H01L25/16 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.
摘要翻译：用于可植入心脏除颤器的高电压单元的多芯片模块化晶片级封装包括在单个重构晶片的聚合物模具化合物中与其他组分封装的一个或多个高电压（HV）组件芯片，其中所有互连部分优选地位于晶片的单侧上。为了电耦合位于与晶片的互连侧相对的芯片侧的每个HV芯片的接触表面，重构的晶片可以包括导电的通过聚合物通孔; 交替地，在封装HV芯片之前，形成导线或者导电聚合物层以将上述接触表面耦合到相应的互连。在一些情况下，封装在包装的重构晶片中的一种或多种组分是重构芯片。

3. 发明申请

WO2013048620A1 RECONSTITUTED WAFER PACKAGE WITH HIGH VOLTAGE DISCRETE ACTIVE DICE AND INTEGRATED FIELD PLATE FOR HIGH TEMPERATURE LEAKAGE CURRENT STABILITY 审中-公开
标题翻译：具有高电压离散主动切屑和集成现场板的高温泄漏电流稳定性的重新配置的包装
公开(公告)号：WO2013048620A1
公开(公告)日：2013-04-04
申请号：PCT/US2012/049690
申请日：2012-08-06
申请人： MEDTRONIC, INC. , BOONE, Mark, A. , ASKARINYA, Mohsen , TYLER, Larry, E.
发明人： BOONE, Mark, A. , ASKARINYA, Mohsen , TYLER, Larry, E.
IPC分类号： H01L23/58 , H01L25/07 , H01L23/538 , H01L21/60
CPC分类号： H01L23/585 , H01L21/568 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L25/072 , H01L2224/04105 , H01L2224/12105 , H01L2924/01029 , H01L2924/1301 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00
摘要： A reconstituted wafer level package for a versatile high-voltage capable component is disclosed. The reconstituted wafer package includes a dice substantially encapsulated by a mold material except for a first face. A dielectric layer is disposed on the first face of the dice. The package further includes an array of ball bumps formed on an exterior facing portion of the dielectric layer. Further, a field plate is disposed within the dielectric material and interposed between the first face of the dice and the ball bump array. The field plate may be spaced from the dice by a predetermined distance to prevent dielectric breakdown of the material of the dielectric layer.
摘要翻译：公开了一种用于多功能高压部件的重构晶片级封装。重构的晶片封装包括基本上由除第一面之外的模具材料封装的芯片。介电层设置在骰子的第一面上。封装还包括形成在电介质层的外部面对部分上的球凸块阵列。此外，场板设置在电介质材料内并插入在骰子的第一面和球凸块阵列之间。场板可以与骰子隔开预定距离，以防止电介质层的材料的电介质击穿。

4. 发明申请

WO2020046883A1 ELECTROCHEMICAL SENSOR INCLUDING MULTIPLE WORK ELECTRODES AND COMMON REFERENCE ELECTRODE 审中-公开
公开(公告)号：WO2020046883A1
公开(公告)日：2020-03-05
申请号：PCT/US2019/048268
申请日：2019-08-27
申请人： MEDTRONIC, INC.
发明人： HAHN, Daniel , ASKARINYA, Mohsen , CARNEY, James K. , KINZIE, Patrick W. , LORENZ MARCKMANN, Jennifer , SCHULHAUSER, Randal C. , VADDIRAJU, Santhisagar , SRINIVASAN, Akhil , PROBST, David , CHAVEZ GAXIOLA, Alejo
IPC分类号： A61B5/145 , G01N27/327 , G01N33/49
摘要： A biocompatible medical device may include an electrochemical sensor including a common reference electrode; at least one counter electrode; and a work electrode platform comprising a plurality of respective work electrodes, each respective work electrode electrically coupled to the common reference electrode and comprising a respective reagent substrate configured to react with a respective analyte to produce a respective signal indicative of a concentration of the respective analyte; and processing circuitry operatively coupled to the electrochemical sensor, and configured to receive from the electrochemical sensor a plurality of signals from the plurality of respective work electrodes; identify the respective signal corresponding to a respective selected work electrode; and process the identified signal to determine the concentration of the respective analyte associated with the respective selected work electrode.

5. 发明申请

WO2012161915A2 ELECTRICAL FEEDTHROUGH AND ELECTRODE STRUCTURE FOR IMPLANTABLE MEDICAL DEVICE 审中-公开
标题翻译：用于可植入医疗器械的电气产生和电极结构
公开(公告)号：WO2012161915A2
公开(公告)日：2012-11-29
申请号：PCT/US2012/035111
申请日：2012-04-26
申请人： MEDTRONIC, INC. , ASKARINYA, Mohsen , HERRMANN, Erik J.
发明人： ASKARINYA, Mohsen , HERRMANN, Erik J.
IPC分类号： A61N1/375
CPC分类号： A61N1/3756 , A61N1/3754
摘要： An implantable medical device (IMD) may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, circuitry disposed within the LCP outer housing, an electrical feedthrough extending through the LCP outer housing from a first end proximate the circuitry to a second end proximate to the outer surface, and an electrode structure disposed on the outer surface. The electrode structure may include a LCP substrate defining a first major surface and a second major surface substantially opposite the first major surface, a contact pad disposed on the first major surface, and an electrode disposed on the second major surface. The LCP substrate may be attached to the LCP outer housing and the contact pad may be electrically coupled to the electrical feedthrough.
摘要翻译：可植入医疗装置（IMD）可以包括限定IMD的外表面的液晶聚合物（LCP）外壳，设置在LCP外壳内的电路，从靠近电路的第一端延伸穿过LCP外壳的电馈通到靠近外表面的第二端，以及设置在外表面上的电极结构。电极结构可以包括限定第一主表面的LCP衬底和与第一主表面基本相对的第二主表面，设置在第一主表面上的接触焊盘和设置在第二主表面上的电极。 LCP衬底可以附接到LCP外壳，并且接触焊盘可以电耦合到电馈通。

6. 发明申请

WO2022020488A1 ELECTROCHEMICAL SENSOR WITH A DIFFUSION CONTROL LAYER 审中-公开
公开(公告)号：WO2022020488A1
公开(公告)日：2022-01-27
申请号：PCT/US2021/042600
申请日：2021-07-21
申请人： MEDTRONIC, INC.
发明人： LORENZ MARCKMANN, Jennifer , ASKARINYA, Mohsen , PROBST, David L. , BURNES, John E.
IPC分类号： A61B5/1486 , G01N33/49 , C12Q1/00 , A61B5/145 , G01N27/327
摘要： An electrochemical sensor may include a common reference electrode, at least one counter electrode, and a work electrode platform including a work electrode and at least one diffusion control layer. The work electrode may be electrically coupled to the common reference electrode. The electrode may include a reagent substrate configured to react with an analyte to produce a signal indicative of a concentration of the analyte. The at least one diffusion control layer may be configured to control the diffusion of the analyte to the work electrode.

9. 发明授权

EP2885051B1 WAFER LEVEL PACKAGES OF HIGH VOLTAGE UNITS FOR IMPLANTABLE MEDICAL DEVICES 有权
标题翻译：用于植入式医疗设备的高压单元晶圆级封装
公开(公告)号：EP2885051B1
公开(公告)日：2017-06-07
申请号：EP13719644.0
申请日：2013-04-03
申请人： Medtronic, Inc.
发明人： BOONE, Mark R. , ASKARINYA, Mohsen , CRUTCHFIELD, Randolph E. , HERRMANN, Erik , RICOTTA, Mark S. , WANG, Lejun
IPC分类号： A61N1/39 , H01L25/00
CPC分类号： A61N1/3956 , F04C2270/041 , H01L23/49548 , H01L23/49575 , H01L25/16 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00

10. 发明授权

EP2761653B1 RECONSTITUTED WAFER PACKAGE WITH A DISCRETE HIGH VOLTAGE DICE AND INTEGRATED FIELD PLATE FOR HIGH TEMPERATURE LEAKAGE CURRENT STABILITY 有权
标题翻译：在高温下进行泄漏电流的稳定性一种离散化的高压贴片及综合场板再生晶圆封装
公开(公告)号：EP2761653B1
公开(公告)日：2016-05-04
申请号：EP12759293.9
申请日：2012-08-06
申请人： Medtronic, Inc.
发明人： BOONE, Mark, A. , ASKARINYA, Mohsen , TYLER, Larry, E.
IPC分类号： H01L23/498 , H01L21/60 , H01L23/485 , H01L23/538 , H01L23/58 , H01L25/07
CPC分类号： H01L23/585 , H01L21/568 , H01L23/49816 , H01L23/49827 , H01L23/49894 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/96 , H01L25/072 , H01L2224/04105 , H01L2224/12105 , H01L2924/01029 , H01L2924/1301 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00

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