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    • 1. 发明申请
    • APPARATUS AND METHOD FOR REDUCED LOADING OF SIGNAL TRANSMISSION ELEMENTS
    • 用于减少信号传输元件负载的装置和方法
    • US20060274681A1
    • 2006-12-07
    • US10908959
    • 2005-06-02
    • Louis HsuKarl SelanderMichael SornaDaniel Storaska
    • Louis HsuKarl SelanderMichael SornaDaniel Storaska
    • H04B1/58
    • G06F13/4072
    • An apparatus is provided which includes a common signal node operable to conduct a first signal, a first circuit coupled to the common signal node to utilize the first signal and a signal-handling element coupled to the common signal node. The signal-handling element includes an isolating circuit coupled to the first conductor, a second conductor operable to conduct an output of the isolating circuit, and a signal-handling circuit coupled to the second conductor. The signal-handling circuit is operable to perform a signal-handling function in response to the output of the isolating circuit. By virtue of the isolating circuit, the signal-handling circuit and the first circuit are isolated from the second conductor and the signal-handling circuit. Preferably, the achieved isolation permits a communication signal included in the first signal to be conducted within a communication apparatus with less capacitance, and producing less return loss of that signal.
    • 提供一种装置,其包括可操作以传导第一信号的公共信号节点,耦合到公共信号节点以利用第一信号的第一电路和耦合到公共信号节点的信号处理元件。 信号处理元件包括耦合到第一导体的隔离电路,可操作以导通隔离电路的输出的第二导体和耦合到第二导体的信号处理电路。 信号处理电路可操作以响应于隔离电路的输出执行信号处理功能。 通过隔离电路,信号处理电路和第一电路与第二导体和信号处理电路隔离。 优选地,所实现的隔离允许包含在第一信号中的通信信号在具有较小电容的通信设备内传导,并且产生较小的该信号的回波损耗。
    • 4. 发明申请
    • FRONT END INTERFACE FOR DATA RECEIVER
    • 数据接收器的前端接口
    • US20060159200A1
    • 2006-07-20
    • US10905705
    • 2005-01-18
    • Louis HsuMatt Cordrey-GaleJames MasonPhillip MurfetKarl SelanderMichael SornaHuihao Xu
    • Louis HsuMatt Cordrey-GaleJames MasonPhillip MurfetKarl SelanderMichael SornaHuihao Xu
    • H04L27/22
    • H04L25/0274H04L25/0296
    • A data receiver is provided which includes a front end interface circuit having an alternating current (AC) transmission receiving mode and a direct current (DC) transmission receiving mode. The front end interface circuit includes an offset compensation circuit operable to compensate a DC voltage offset between a pair of differential signals input to the data receiver. The front end interface circuit further includes an AC/DC selection unit operable to switch between (a) the DC transmission receiving mode, and (b) the AC transmission receiving mode, such that the data receiver is operable in (i) the DC transmission mode in which the offset compensation circuit is disabled, (ii) the DC transmission mode in which the offset compensation circuit is enabled, (iii) the AC transmission mode in which the offset compensation circuit is disabled, and (iv) the AC transmission receiving mode in which the offset compensation circuit is enabled.
    • 提供一种数据接收器,其包括具有交流(AC)发送接收模式和直流(DC)发送接收模式的前端接口电路。 前端接口电路包括偏移补偿电路,其可操作以补偿输入到数据接收器的一对差分信号之间的直流电压偏移。 前端接口电路还包括可操作以在(a)直流发送接收模式和(b)交流发送接收模式之间切换的AC / DC选择单元,使得数据接收器可操作于(i)直流传输 偏移补偿电路被禁用的模式,(ii)使能偏移补偿电路的直流传输模式,(iii)偏移补偿电路被禁用的AC传输模式,以及(iv)AC传输接收 偏移补偿电路使能的模式。
    • 6. 发明申请
    • Reference current generation system
    • 参考电流发电系统
    • US20050179486A1
    • 2005-08-18
    • US11103314
    • 2005-04-11
    • Hibourahima CamaraLouis HsuKarl SelanderMichael Sorna
    • Hibourahima CamaraLouis HsuKarl SelanderMichael Sorna
    • G05F1/565H03K4/06
    • G05F1/565
    • Systems are provided for generating and distributing a plurality of reference currents on an integrated circuit. More particularly, an integrated circuit is provided which includes a reference current generating system. The reference current generating system includes a first reference current generator disposed at a first location of the integrated circuit which is operable to generate a plurality of first reference currents. A plurality of second reference current generators are disposed at a plurality of second locations of the integrated circuit. Each of the second reference current generators are operable to generate a second reference current from one of the plurality of first reference currents. In a particular example, the first location at which the first reference current generator is disposed is a central location and the second locations are disposed remote from the first location.
    • 提供了用于在集成电路上生成和分配多个参考电流的系统。 更具体地,提供了包括参考电流产生系统的集成电路。 参考电流产生系统包括设置在集成电路的第一位置处的第一参考电流发生器,其可操作以产生多个第一参考电流。 多个第二参考电流发生器设置在集成电路的多个第二位置处。 每个第二参考电流发生器可操作以从多个第一参考电流之一产生第二参考电流。 在特定示例中,设置第一参考电流发生器的第一位置是中心位置,并且第二位置远离第一位置设置。
    • 9. 发明申请
    • ON-CHIP ELECTROMIGRATION MONITORING SYSTEM
    • 片上电气监测系统
    • US20070164768A1
    • 2007-07-19
    • US11306985
    • 2006-01-18
    • Louis HsuHayden CranfordOleg GluschenkovJames MasonMichael SornaChih-Chao Yang
    • Louis HsuHayden CranfordOleg GluschenkovJames MasonMichael SornaChih-Chao Yang
    • G01R31/26
    • G01R31/2858G01R31/2884G01R31/318533
    • A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.
    • 提供一种封装的半导体芯片,其包括半导体芯片和封装元件。 半导体芯片包括多个半导体器件和设置在半导体芯片的外表面处的多个导电特征。 封装元件具有导电连接到半导体芯片的多个导电特征的多个外部特征。 半导体芯片包括被监视的元件,该元件包括将半导体芯片的第一节点与半导体芯片的第二节点导电互连的导电互连。 半导体芯片中的检测电路可操作以在封装的半导体芯片的寿命期间的多个不同时间,将所监视的元件上的可变电压降与芯片上的参考元件上的参考电压降进行比较,以便检测何时 被监测元件的电阻超过阈值。