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1. 发明申请

US20070111699A1 Method and apparatus for implementing enhanced hand shake protocol in microelectronic comunication systems 失效
标题翻译：在微电子通信系统中实现增强的手抖动协议的方法和装置
公开(公告)号：US20070111699A1
公开(公告)日：2007-05-17
申请号：US11282090
申请日：2005-11-17
申请人： Louis Hsu , Jack Mandelman , James Mason
发明人： Louis Hsu , Jack Mandelman , James Mason
IPC分类号： H04B1/16
CPC分类号： H04B1/38
摘要： A method and apparatus are provided for implementing an enhanced hand shake protocol for microelectronic communication systems. A transmitter and a receiver is coupled together by a transmission link. The transmitter receives an idle input. The idle input is activated when the transmitter is not transmitting data and the transmitter applies a first common mode level to the receiving unit. The idle input is deactivated when the transmitter is ready to transmit data and the transmitter raises the common mode level to the receiving unit. Responsive to the receiver detecting the common mode level up-movement, then the receiver receives the transmitted data signals. After the desired data has been sent, the transmitter terminates communications, drops the common mode level with the idle input being activated.
摘要翻译：提供了一种用于实现用于微电子通信系统的增强的手抖动协议的方法和装置。发射机和接收机通过传输链路耦合在一起。发射机接收空闲输入。当发射机不发送数据并且发射机向接收单元应用第一共模电平时，空闲输入被激活。当发射机准备好传输数据并且发射机将共模电平提升到接收单元时，空闲输入被去激活。响应于接收机检测共模水平上移，接收器接收发送的数据信号。在所需数据被发送之后，发射机终止通信，在空闲输入被激活时降低共模电平。

2. 发明申请

US20070235833A1 Semiconductor device structures with self-aligned doped regions and methods for forming such semiconductor device structures 失效
标题翻译：具有自对准掺杂区域的半导体器件结构和用于形成这种半导体器件结构的方法
公开(公告)号：US20070235833A1
公开(公告)日：2007-10-11
申请号：US11393142
申请日：2006-03-30
申请人： Kangguo Cheng , Louis Hsu , Jack Mandelman
发明人： Kangguo Cheng , Louis Hsu , Jack Mandelman
IPC分类号： H01L29/00
CPC分类号： H01L27/10841 , H01L27/10864
摘要： Semiconductor device structures with self-aligned doped regions and methods for forming such semiconductor device structures. The semiconductor structure comprises first and second doped regions of a first conductivity type defined in the semiconductor material of a substrate bordering a sidewall of a trench. An intervening region of the semiconductor material separates the first and second doped regions. A third doped region is defined in the semiconductor material bordering the sidewall of the trench and disposed between the first and second doped regions. The third doped region is doped to have a second conductivity type opposite to the first conductivity type. Methods for forming the doped regions involve depositing either a layer of a material doped with both dopants or different layers each doped with one of the dopants in the trench and, then, diffusing the dopants from the layer or layers into the semiconductor material bordering the trench sidewall.
摘要翻译：具有自对准掺杂区域的半导体器件结构和用于形成这种半导体器件结构的方法。半导体结构包括限定在与沟槽的侧壁相邻的衬底的半导体材料中的第一导电类型的第一和第二掺杂区域。半导体材料的中间区域分离第一和第二掺杂区域。第三掺杂区域限定在与沟槽的侧壁接壤并且设置在第一和第二掺杂区域之间的半导体材料中。第三掺杂区被掺杂以具有与第一导电类型相反的第二导电类型。用于形成掺杂区域的方法包括沉积掺杂有掺杂剂或不同层的材料的层，每个掺杂剂或不同的层在沟槽中掺杂有一种掺杂剂，然后将掺杂剂从层或层扩散到与沟槽接壤的半导体材料侧壁。

3. 发明申请

US20070210890A1 Electronic fuse with conformal fuse element formed over a freestanding dielectric spacer 失效
标题翻译：具有保形熔丝元件的电子保险丝，形成在独立电介质垫片上
公开(公告)号：US20070210890A1
公开(公告)日：2007-09-13
申请号：US11372387
申请日：2006-03-09
申请人： Louis Hsu , Jack Mandelman , William Tonti , Chih-Chao Yang
发明人： Louis Hsu , Jack Mandelman , William Tonti , Chih-Chao Yang
IPC分类号： H01H85/04
CPC分类号： H01L23/5256 , H01L2924/0002 , Y10T29/49107 , H01L2924/00
摘要： An electronic fuse for an integrated circuit and a method of fabrication thereof are presented. The electronic fuse has a first terminal portion and a second terminal portion interconnected by a fuse element. The fuse element has a convex upper surface and a lower surface with a radius of curvature at a smallest surface area of curvature less than or equal to 100 nanometers. Fabricating the electronic fuse includes forming an at least partially freestanding dielectric spacer above a supporting structure, and then conformably forming the fuse element of the fuse over at least a portion of the freestanding dielectric spacer, with the fuse element characterized as noted above. The dielectric spacer may remain in place as a thermally insulating layer underneath the fuse element, or may be removed to form a void underneath the fuse element.
摘要翻译：本发明提供一种用于集成电路的电子熔断器及其制造方法。电子熔断器具有由熔丝元件互连的第一端子部分和第二端子部分。保险丝元件具有凸起的上表面和具有小于或等于100纳米的曲率的最小表面积的曲率半径的下表面。制造电子熔断器包括在支撑结构之上形成至少部分独立的介电隔离物，然后在独立电介质隔离物的至少一部分上顺应地形成熔丝的熔丝元件，其中熔丝元件的特征如上所述。电介质间隔物可以保留在熔丝元件下面的绝热层的适当位置，或者可以被去除以在熔丝元件下面形成空隙。

4. 发明申请

US20060284251A1 Coplanar silicon-on-insulator (SOI) regions of different crystal orientations and methods of making the same 有权
公开(公告)号：US20060284251A1
公开(公告)日：2006-12-21
申请号：US11155030
申请日：2005-06-16
申请人： Louis Hsu , Jack Mandelman
发明人： Louis Hsu , Jack Mandelman
IPC分类号： H01L27/12
CPC分类号： H01L29/045 , H01L21/76283 , H01L21/823807 , H01L21/823878 , H01L21/84 , H01L27/0922 , H01L27/1203 , H01L27/1207
摘要： In a first aspect, a first method is provided for semiconductor device manufacturing. The first method includes the steps of (1) providing a substrate; and (2) forming a first silicon-on-insulator (SOI) region having a first crystal orientation, a second SOI region having a second crystal orientation and a third SOI region having a third crystal orientation on the substrate. The first, second and third SOI regions are coplanar. Numerous other aspects are provided.

5. 发明申请

US20060284250A1 Hybrid oriented substrates and crystal imprinting methods for forming such hybrid oriented substrates 失效
公开(公告)号：US20060284250A1
公开(公告)日：2006-12-21
申请号：US11154906
申请日：2005-06-16
申请人： Louis Hsu , Jack Mandelman , William Tonti
发明人： Louis Hsu , Jack Mandelman , William Tonti
IPC分类号： H01L27/01
CPC分类号： H01L27/1203 , H01L21/84 , H01L29/045
摘要： A semiconductor structure with an insulating layer on a silicon substrate, a plurality of electrically-isolated silicon-on-insulator (SOI) regions separated from the substrate by the insulating layer, and a plurality of electrically-isolated silicon bulk regions extending through the insulating layer to the substrate. Each of one number of the SOI regions is oriented with a first crystal orientation and each of another number of the SOI regions is oriented with a second crystal orientation that differs from the first crystal orientation. The bulk silicon regions are each oriented with a third crystal orientation. Damascene or imprinting methods of forming the SOI regions and bulk silicon regions are also provided.

6. 发明申请

US20080079172A1 METHOD FOR FABRICATING AND BEOL INTERCONNECT STRUCTURES WITH SIMULTANEOUS FORMATION OF HIGH-K AND LOW-K DIELECTRIC REGIONS 有权
标题翻译：同时形成高K和低K介电区域的制造和波形互连结构的方法
公开(公告)号：US20080079172A1
公开(公告)日：2008-04-03
申请号：US11939671
申请日：2007-11-14
申请人： Louis Hsu , Jack Mandelman , William Tonti , Chih-Chao Yang
发明人： Louis Hsu , Jack Mandelman , William Tonti , Chih-Chao Yang
IPC分类号： H01L23/52
CPC分类号： H01L23/5329 , H01L21/7682 , H01L21/76849 , H01L23/5222 , H01L23/53295 , H01L2924/0002 , Y10S438/942 , H01L2924/00
摘要： A method for fabricating and back-end-of-line (BEOL) metalization structures includes simultaneous high-k and low-k dielectric regions. An interconnect structure includes a first inter-level dielectric (ILD) layer and a second ILD layer with the first ILD layer underlying the second ILD layer. A plurality of columnar air gaps is formed in the first ILD. The columnar air gap structure is created using a two-phase photoresist material for providing different etching selectivity during subsequent processing.
摘要翻译：一种用于制造和后端（BEOL）金属化结构的方法包括同时存在的高k和低k电介质区域。互连结构包括第一层间电介质（ILD）层和具有位于第二ILD层下面的第一ILD层的第二ILD层。在第一ILD中形成多个柱状气隙。使用两相光致抗蚀剂材料制造柱状气隙结构，用于在随后的处理期间提供不同的蚀刻选择性。

7. 发明申请

US20080067608A1 Storage Elements with Disguised Configurations and Methods of Using the Same 审中-公开
标题翻译：具有伪装配置的存储元件及其使用方法
公开(公告)号：US20080067608A1
公开(公告)日：2008-03-20
申请号：US11928663
申请日：2007-10-30
申请人： Louis Hsu , Jack Mandelman , William Tonti , Chih-Chao Yang
发明人： Louis Hsu , Jack Mandelman , William Tonti , Chih-Chao Yang
IPC分类号： H01L27/06
CPC分类号： H01L23/585 , H01L23/5256 , H01L27/101 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： In a first aspect, a first apparatus is provided. The first apparatus is an element of an integrated circuit (IC) having (1) a metal-oxide-semiconductor field-effect transistor (MOSFET) having source/drain diffusion regions; (2) an electrical fuse (eFuse) coupled to the MOSFET such that a portion of the eFuse serves as a gate region of the MOSFET; and (3) an implanted region coupled to the source/drain diffusion regions of the MOSFET such that a path between the source/drain diffusion regions functions as a short circuit or an open circuit. In another aspect, a design structure embodied in a machine readable medium for designing manufacturing, or testing a design is provided. Numerous other aspects are provided.
摘要翻译：在第一方面中，提供了一种第一装置。第一装置是具有（1）具有源极/漏极扩散区域的金属氧化物半导体场效应晶体管（MOSFET）的集成电路（IC）的元件; （2）耦合到所述MOSFET的电熔丝（eFuse），使得所述eFuse的一部分用作所述MOSFET的栅极区域; 和（3）耦合到MOSFET的源极/漏极扩散区域的注入区域，使得源极/漏极扩散区域之间的路径用作短路或开路。在另一方面，提供了体现在用于设计制造的机器可读介质或测试设计中的设计结构。提供了许多其他方面。

8. 发明申请

US20080054349A1 REDUCED-RESISTANCE FINFETS BY SIDEWALL SILICIDATION AND METHODS OF MANUFACTURING THE SAME 审中-公开
标题翻译：通过小型硅胶制造的耐磨损金属及其制造方法
公开(公告)号：US20080054349A1
公开(公告)日：2008-03-06
申请号：US11933392
申请日：2007-10-31
申请人： Kangguo Cheng , Louis Hsu , Jack Mandelman , Haining Yang
发明人： Kangguo Cheng , Louis Hsu , Jack Mandelman , Haining Yang
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/785 , H01L21/823418 , H01L21/823437 , H01L29/41791 , H01L29/665 , H01L29/6653 , H01L29/66795 , H01L29/78618 , H01L2029/7858 , Y10S438/96
摘要： In a first aspect, a first method of manufacturing a finFET is provided. The first method includes the steps of (1) providing a substrate; and (2) forming at least one source/drain diffusion region of the finFET on the substrate. Each source/drain diffusion region includes (a) an interior region of unsilicided silicon; and (b) silicide formed on a top surface and sidewalls of the region of unsilicided silicon. Numerous other aspects are provided.
摘要翻译：在第一方面，提供了制造finFET的第一种方法。第一种方法包括以下步骤：（1）提供衬底; 和（2）在所述衬底上形成所述finFET的至少一个源极/漏极扩散区域。每个源极/漏极扩散区域包括（a）非硅化硅的内部区域; 和（b）硅化物形成在非硅化硅区域的顶表面和侧壁上。提供了许多其他方面。

9. 发明申请

US20080048268A1 SEMICONDUCTOR FINFET STRUCTURES WITH ENCAPSULATED GATE ELECTRODES AND METHODS FOR FORMING SUCH SEMICONDUCTOR FINFET STRUCTURES 有权
标题翻译：具有封装栅极电极的半导体FINFET结构及其形成这种半导体FINFET结构的方法
公开(公告)号：US20080048268A1
公开(公告)日：2008-02-28
申请号：US11923717
申请日：2007-10-25
申请人： Louis Hsu , Jack Mandelman
发明人： Louis Hsu , Jack Mandelman
IPC分类号： H01L29/76
CPC分类号： H01L29/785 , H01L29/66795
摘要： Semiconductor structures in which the gate electrode of a FinFET is masked from the process introducing dopant into the fin body of the FinFET to form source/drain regions and methods of fabricating such semiconductor structures. The gate doping, and hence the work function of the gate electrode, is advantageously isolated from the process that dopes the fin body to form the source/drain regions. The sidewalls of the gate electrode are covered by sidewall spacers that are formed on the gate electrode but not on the sidewall of the fin body.
摘要翻译：其中FinFET的栅极被从引入掺杂剂的工艺掩模到FinFET的鳍状体中以形成源极/漏极区域的半导体结构以及制造这种半导体结构的方法。栅极掺杂以及因此栅电极的功函数有利地与掺杂鳍体以形成源极/漏极区的过程隔离。栅电极的侧壁由形成在栅电极上但不在鳍体的侧壁上的侧壁间隔物覆盖。

10. 发明申请

US20080044959A1 BODY-CONTACTED SEMICONDUCTOR STRUCTURES AND METHODS OF FABRICATING SUCH BODY-CONTACTED SEMICONDUCTOR STRUCTURES 失效
标题翻译：人体接触半导体结构和制造这种接触式半导体结构的方法
公开(公告)号：US20080044959A1
公开(公告)日：2008-02-21
申请号：US11925352
申请日：2007-10-26
申请人： Kangguo Cheng , Louis Hsu , Jack Mandelman
发明人： Kangguo Cheng , Louis Hsu , Jack Mandelman
IPC分类号： H01L21/86
CPC分类号： H01L21/84 , H01L27/0218 , H01L27/10841 , H01L27/1203 , H01L29/66545
摘要： A semiconductor structure for a dynamic random access memory (DRAM) cell array that includes a plurality of vertical memory cells built on a semiconductor-on-insulator (SOI) wafer and a body contact in the buried dielectric layer of the SOI wafer. The body contact electrically couples a semiconductor body with a channel region of the access device of one vertical memory cell and a semiconductor substrate of the SOI wafer. The body contact provides a current leakage path that reduces the impact of floating body effects upon the vertical memory cell. The body contact may be formed by an ion implantation process that modifies the stoichiometry of a region of the buried dielectric layer so that the modified region becomes electrically conductive with a relatively high resistance.
摘要翻译：一种用于动态随机存取存储器（DRAM）单元阵列的半导体结构，其包括建立在绝缘体上半导体（SOI）晶片上的多个垂直存储单元和SOI晶片的埋入介质层中的体接触。体接触将半导体本体与一个垂直存储单元的存取器件的沟道区和SOI晶片的半导体衬底电耦合。身体接触提供了一种电流泄漏路径，可减少浮体对垂直记忆体的影响。体接触可以通过离子注入工艺形成，该方法改变掩埋介电层的区域的化学计量，使得改性区域以相对较高的电阻变为导电性。

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