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1. 发明授权

US5600883A Method of tip formation for spring probe with piloted and headed contact 失效
标题翻译：具有导向和头部接触的弹簧探头的尖端形成方法
公开(公告)号：US5600883A
公开(公告)日：1997-02-11
申请号：US461899
申请日：1995-06-05
申请人： Louis H. Faure , Terence W. Spoor
发明人： Louis H. Faure , Terence W. Spoor
IPC分类号： G01R1/067 , G01R1/073 , H01R43/00
CPC分类号： G01R1/06711 , G01R1/07314 , G01R1/06722 , Y10T29/49117 , Y10T29/49155
摘要： Testing probes in a testing apparatus are supported in a unitary structure to provide rigidity of the supports for the probes in testing. The spring probes have a contact head at the distal end from the probe tip with a set of antirotation tabs which lock in a cooperating antirotation slot in the probe guide. The contact head has a cone-shaped pilot at its tip which is engaged with a gold-plated contact spring. The inner diameter is integrally in contact with the pilot by mechanical engagement or bonding by soldering or laser welding or the like. A method of forming a probe tip on an array of test probes in a support member of a test apparatus includes inserting a plurality of probes into an array of probe cylinders in the member with the ends of the probes extending below the ends of the cylinders, the probes being retained by fixturing means at a predetermined position in the cylinders, the ends of the probes are planarized to provide a smooth surface of the member with the probes flush therewith, apply a layer of resist to the lower surface of the member covering the guide plate and the newly planarized lower ends of the probes, after the resist has been exposed to a pattern through a high precision mask, a set of rings at the base of the planarized probes is formed in the resist by etching the tips through the resist, and then remove the fixturing means.
摘要翻译：在测试设备中测试探头以单一结构支撑，以提供测试中探针支撑的刚性。弹簧探针在远端处具有与探针末端相接触的头部，并具有一组防旋转突片，锁定在探针引导件中的协作防旋转槽中。接触头在其尖端处具有锥形导向件，其与镀金接触弹簧接合。通过焊接或激光焊接等机械接合或接合，内径与飞行员一体地接触。在测试装置的支撑构件中在测试探针阵列上形成探针尖端的方法包括将多个探针插入到构件中的探针圆柱体的阵列中，其中探针的端部延伸到气缸的端部下方，探针被固定装置保持在气缸中的预定位置处，探针的端部被平坦化以提供构件的光滑表面，探针与其齐平，向覆盖构件的构件的下表面施加一层抗蚀剂引导板和探针的新平面化下端，在抗蚀剂通过高精度掩模暴露于图案之后，通过蚀刻尖端通过抗蚀剂在抗蚀剂中形成在平面化探针的基部的一组环，然后取下固定装置。

2. 发明授权

US5367254A Test probe assembly using buckling wire probes within tubes having opposed overlapping slots 失效
标题翻译：在具有相对重叠槽的管内使用弯曲线探针测试探头组件
公开(公告)号：US5367254A
公开(公告)日：1994-11-22
申请号：US11556
申请日：1993-02-01
申请人： Louis H. Faure , Terence W. Spoor
发明人： Louis H. Faure , Terence W. Spoor
IPC分类号： G01R1/073 , G01R31/02
CPC分类号： G01R1/07357
摘要： A test probe assembly is disclosed having bucking beam displacement test probe units which are easily replaceable. Each test probe unit includes a wire and a slotted tube containing the wire,one end of the wire being attached to one end of the tube and the other end of the wire protruding from the other end of the tube. The wire slidably engages an inner diameter of the tube. Each tube is slotted at a plurality of locations along the longitudinal axis thereof to provide spaces for the buckling beam displacement of the respective wire when the protruding end of the wire is brought to bear against a device point to be tested. The slots are staggered so that adjacent ones are disposed radially opposite to each other with some overlap along the longitudinal axis of the tube. The test probe units are inserted in predetermined respective holes of an apertured block of insulating material in accordance with a pattern of device points to be tested.
摘要翻译：公开了一种测试探针组件，其具有容易替换的屈曲梁位移测试探针单元。每个测试探针单元包括线和包含线的开槽管，线的一端附接到管的一端，并且线的另一端从管的另一端突出。线可滑动地接合管的内径。每个管沿着其纵向轴线在多个位置开槽，以在电线的突出端抵抗要测试的装置点时提供用于相应电线的屈曲梁位移的空间。狭槽交错，使得相邻的槽沿着管的纵向轴线以一定重叠的方式彼此径向相对设置。根据要测试的装置点的图案，将测试探针单元插入到具有多孔绝缘材料块的预定的相应孔中。

3. 发明授权

US5521519A Spring probe with piloted and headed contact and method of tip formation 失效
标题翻译：弹簧探头具有先导和头部接触以及尖端形成方法
公开(公告)号：US5521519A
公开(公告)日：1996-05-28
申请号：US175336
申请日：1993-12-29
申请人： Louis H. Faure , Terence W. Spoor
发明人： Louis H. Faure , Terence W. Spoor
IPC分类号： G01R1/067 , G01R1/073 , G01R1/02
CPC分类号： G01R1/06711 , G01R1/07314 , G01R1/06722 , Y10T29/49117 , Y10T29/49155
摘要： Testing probes in a testing apparatus are supported in a unitary structure to provide rigidity of the supports for the probes in testing. The spring probes have a contact head at the distal end from the probe tip with a set of antirotation tabs which lock in a cooperating antirotation slot in the probe guide. The contact head has a cone-shaped pilot at its tip which is engaged with a gold-plated contact spring. The inner diameter is integrally in contact with the pilot by mechanical engagement or bonding by soldering or laser welding or the like. A method of forming a probe tip on an array of test probes in a support member of a test apparatus includes inserting a plurality of probes into an array of probe cylinders in the member with the ends of the probes extending below the ends of the cylinders, the probes being retained by fixturing means at a predetermined position in the cylinders, the ends of the probes are planarized to provide a smooth surface of the member with the probes flush therewith, apply a layer of resist to the lower surface of the member covering the guide plate and the newly planarized lower ends of the probes, after the resist has been exposed to a pattern through a high precision mask, a set of rings at the base of the planarized probes is formed in the resist by etching the tips through the resist, and then remove the fixturing means.
摘要翻译：在测试设备中测试探头以单一结构支撑，以提供测试中探针支撑的刚性。弹簧探针在远端处具有与探针末端相接触的头部，并具有一组防旋转突片，锁定在探针引导件中的协作防旋转槽中。接触头在其尖端处具有锥形导向件，其与镀金接触弹簧接合。通过焊接或激光焊接等机械接合或接合，内径与飞行员一体地接触。在测试装置的支撑构件中在测试探针阵列上形成探针尖端的方法包括将多个探针插入到构件中的探针圆柱体的阵列中，其中探针的端部延伸到气缸的端部下方，探针被固定装置保持在气缸中的预定位置处，探针的端部被平坦化以提供构件的光滑表面，探针与其齐平，向覆盖构件的构件的下表面施加一层抗蚀剂引导板和探针的新平面化下端，在抗蚀剂通过高精度掩模暴露于图案之后，通过蚀刻尖端通过抗蚀剂在抗蚀剂中形成在平面化探针的基部的一组环，然后取下固定装置。

4. 发明授权

US4554506A Modular test probe 失效
公开(公告)号：US4554506A
公开(公告)日：1985-11-19
申请号：US680232
申请日：1984-12-10
申请人： Louis H. Faure , Dana R. Townsend , Thomas J. Walsh
发明人： Louis H. Faure , Dana R. Townsend , Thomas J. Walsh
IPC分类号： G01R1/073 , G01R1/06
CPC分类号： G01R1/07357 , Y10S439/912
摘要： A test probe employing a buckling beam array for testing integrated circuits. A pair of identical sets of guides are positioned on either side of a centerpost to align the buckling beams. In one embodiment the holes in one set of guides is offset by a key to induce prebow in the beams. In another embodiment prebow is induced by a floating asymmetric separator positioned on the centerpost between the guide sets. When a force is applied to the probe, the beams deflect in the direction but to different extents so that a uniform force is applied to the surface of the IC irrespective of variations in height.

5. 发明授权

US4227149A Sensing probe for determining location of conductive features 失效
标题翻译：用于确定导电特征位置的感应探头
公开(公告)号：US4227149A
公开(公告)日：1980-10-07
申请号：US910253
申请日：1978-05-30
申请人： Louis H. Faure , Philo B. Hodge
发明人： Louis H. Faure , Philo B. Hodge
IPC分类号： H01L21/68 , G01R1/073 , G01R31/28 , H01L21/66 , G01R31/02
CPC分类号： G01R31/2886 , G01R1/073
摘要： A sensing apparatus for determining the precise location of a conductive feature on an insulating substrate which has a base, a plurality of flexible flat elongated contact blade elements having end portions for contacting and establishing electrical contact to a conductive surface feature, insulating means between the blade elements, and a base member for supporting the blade elements in a bowed condition with the end portions arranged in a plane parallel to the plane of the top surface of the insulating substrate.
摘要翻译：一种感测装置，用于确定绝缘基底上的导电特征的精确位置，所述绝缘基底具有基底，多个柔性扁平细长接触叶片元件，具有用于接触和建立与导电表面特征的电接触的端部，所述叶片元件和用于以弓形状支撑刀片元件的基座构件，其端部布置在平行于绝缘基板的顶表面的平面的平面中。

6. 发明授权

US4161817A Method and apparatus for making a semiconductor device mounting element embodying an embedded fan-out wire arrangement 失效
标题翻译：用于制造体现嵌入式扇出线布置的半导体器件安装元件的方法和装置
公开(公告)号：US4161817A
公开(公告)日：1979-07-24
申请号：US892048
申请日：1978-03-31
申请人： Edward T. Bernardo , Louis H. Faure , Alfred H. Johnson , Donald G. Pittwood
发明人： Edward T. Bernardo , Louis H. Faure , Alfred H. Johnson , Donald G. Pittwood
IPC分类号： H01L23/50 , H01L21/48 , H01L23/14 , H01L23/538 , H01R9/00
CPC分类号： H01L23/5384 , H01L21/486 , H01L23/145 , H01L2924/0002 , H01L2924/3011 , Y10T29/49123 , Y10T29/4916 , Y10T29/5187 , Y10T29/5193 , Y10T29/53243 , Y10T29/53261
摘要： A method of fabricating a semiconductor device mounting element embodying a wire fan-out wherein the ends of a plurality of insulated wires are supported in a spatial parallel arrangement of columns and rows between two spaced apertured die elements, the spacing of the wires is reduced at a first location between the die elements while maintaining the spatial arrangement of columns and rows, forming an enclosure about the wire portions positioned adjacent one of the die elements and the location where the spacing of the wires is reduced, injecting an organic hardenable resin material into the enclosure thereby encapsulating the wires positioned within, severing the wires, and removing the die.An apparatus for fabricating a semiconductor device mounting element embodying a fan-out arrangement of embedded wires, the apparatus having a pair of die elements each die element provided with a plurality of apertures arranged in columns and rows and adapted in an operation to receive and position insulated wires, the apertures in the dies being in axial alignment, a first set of parallel spaced wires, a second set of spaced parallel wires position in transverse relation to the first set of wires, a means to support the first and second set of spaced wires in a first widely spaced relationship and in a second closely spaced relationship, and a means to support the die elements in the first closed position and in the second open position, a means to load a plurality of insulated wires through the apertures in the pairs of die elements, a means to support the pair of dies in the first closed position and move the dies to a second open position, a means to move the first and second sets of parallel space wires to the second closely spaced relationship to compress the wires, a retractable mold that surrounds portions of the insulated wires positioned between one of the die elements and the location where the wires are compressed, and a means to introduce a hardenable resin material into the enclosure to thereby encapsulate the enclosed wires.
摘要翻译：一种制造半导体器件安装元件的方法，其实现了线扇形，其中多个绝缘线的端部在两个间隔开的有孔模具元件之间的柱和列的空间平行布置中被支撑，线的间隔减小模具元件之间的第一位置，同时保持列和列的空间布置，围绕围绕模具元件之一定位的线部分形成围绕，并且电线间隔减小的位置，将有机可硬化树脂材料注入所述外壳由此封装位于所述电线内的电线，并且去除所述管芯。

7. 发明授权

US4066312A High density cable connector 失效
标题翻译：高密度电缆连接器
公开(公告)号：US4066312A
公开(公告)日：1978-01-03
申请号：US700275
申请日：1976-06-28
申请人： Louis H. Faure
发明人： Louis H. Faure
IPC分类号： H01R13/22 , H01R13/42 , H01R13/512 , H01R13/639 , H01R15/22
CPC分类号： H01R13/22 , H01R13/42 , H01R13/512
摘要： A connector for forming a plurality of electrical wiring connections having a first mateable coupling member with a flat surface and a plurality of openings arranged in a predetermined configuration, a plurality of headed elements disposed in the openings, a second mateable coupling member provided with a flat surface, a set of elongated axially flexible metal buckling beam elements supported on the mateable coupling member and arranged in a predetermined configuration, corresponding to the headed elements on the first member, a means for supporting the buckling beam elements in a position generally perpendicular to the flat surface on the second member, with the ends of the buckling beam elements protruding slightly beyond the flat surface, a means for aligning the first and second members in mateable relation with the respective flat surfaces in opposed relation, and means for securing and maintaining the first and second members in mateable relation with the ends of the beam elements in a flexed position and in contact with the headed elements.

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