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1. 发明授权

US07409019B2 High Speed Multi-Mode Receiver with adaptive receiver equalization and controllable transmitter pre-distortion 有权
标题翻译：具有自适应接收机均衡和可控发射机预失真的高速多模式接收机
公开(公告)号：US07409019B2
公开(公告)日：2008-08-05
申请号：US10711713
申请日：2004-09-30
申请人： Louis C. Hsu , Brian L. Ji , James S. Mason , Karl D. Selander , Michael A. Sorna , Steven J. Zier
发明人： Louis C. Hsu , Brian L. Ji , James S. Mason , Karl D. Selander , Michael A. Sorna , Steven J. Zier
IPC分类号： H04L27/08
CPC分类号： H04L25/085 , H03F1/3241 , H04L25/0278 , H04L25/0292 , H04L25/03343 , H04L25/061 , H04L2025/0349 , H04L2025/03566 , H04L2025/03617 , H04L2025/03808
摘要： A data receiver is provided which is operable to receive a signal controllably pre-distorted and transmitted by a transmitter, to generate information for adjusting the pre-distortion applied to the signal transmitted by the transmitter, and to transmit the information to the transmitter. The receiver is further operable to perform adaptive equalization to receive the signal transmitted by the transmitter.
摘要翻译：提供了一种数据接收器，其可操作以接收由发射机可控地预失真和发送的信号，以产生用于调整应用于由发射机发送的信号的预失真的信息，并将该信息发送到发射机。接收机还可操作以执行自适应均衡以接收由发射机发送的信号。

2. 发明授权

US07660350B2 High-speed multi-mode receiver 失效
标题翻译：高速多模接收机
公开(公告)号：US07660350B2
公开(公告)日：2010-02-09
申请号：US12218272
申请日：2008-07-14
申请人： Louis C. Hsu , Brian L. Ji , James S. Mason , Karl D. Selander , Michael A. Soma , Steven J. Zier
发明人： Louis C. Hsu , Brian L. Ji , James S. Mason , Karl D. Selander , Michael A. Soma , Steven J. Zier
IPC分类号： H04B3/46
CPC分类号： H04L25/085 , H03F1/3241 , H04L25/0278 , H04L25/0292 , H04L25/03343 , H04L25/061 , H04L2025/0349 , H04L2025/03566 , H04L2025/03617 , H04L2025/03808
摘要： A data receiver is provided which is operable to receive a signal controllably pre-distorted and transmitted by a transmitter, to generate information for adjusting the pre-distortion applied to the signal transmitted by the transmitter, and to transmit the information to the transmitter. The receiver is further operable to perform adaptive equalization to receive the signal transmitted by the transmitter.
摘要翻译：提供了一种数据接收器，其可操作以接收由发射机可控地预失真和发送的信号，以产生用于调整应用于由发射机发送的信号的预失真的信息，并将该信息发送到发射机。接收机还可操作以执行自适应均衡以接收由发射机发送的信号。

3. 发明申请

US20080298520A1 High-speed multi-mode receiver 失效
标题翻译：高速多模接收机
公开(公告)号：US20080298520A1
公开(公告)日：2008-12-04
申请号：US12218272
申请日：2008-07-14
申请人： Louis C. Hsu , Brian L. Ji , James S. Mason , Karl D. Selander , Michael A. Soma , Steven J. Zier
发明人： Louis C. Hsu , Brian L. Ji , James S. Mason , Karl D. Selander , Michael A. Soma , Steven J. Zier
IPC分类号： H04L27/08
CPC分类号： H04L25/085 , H03F1/3241 , H04L25/0278 , H04L25/0292 , H04L25/03343 , H04L25/061 , H04L2025/0349 , H04L2025/03566 , H04L2025/03617 , H04L2025/03808
摘要： A data receiver is provided which is operable to receive a signal controllably pre-distorted and transmitted by a transmitter, to generate information for adjusting the pre-distortion applied to the signal transmitted by the transmitter, and to transmit the information to the transmitter. The receiver is further operable to perform adaptive equalization to receive the signal transmitted by the transmitter.
摘要翻译：提供了一种数据接收器，其可操作以接收由发射机可控地预失真和发送的信号，以产生用于调整应用于由发射机发送的信号的预失真的信息，并将该信息发送到发射机。接收机还可操作以执行自适应均衡以接收由发射机发送的信号。

4. 发明授权

US07519130B2 Front end interface for data receiver 失效
标题翻译：数据接收机的前端接口
公开(公告)号：US07519130B2
公开(公告)日：2009-04-14
申请号：US10905705
申请日：2005-01-18
申请人： Louis L. Hsu , Matt R. Cordrey-Gale , James S. Mason , Philip J. Murfet , Karl D. Selander , Michael A. Sorna , Huihao Xu
发明人： Louis L. Hsu , Matt R. Cordrey-Gale , James S. Mason , Philip J. Murfet , Karl D. Selander , Michael A. Sorna , Huihao Xu
IPC分类号： H04L25/34
CPC分类号： H04L25/0274 , H04L25/0296
摘要： A data receiver is provided which includes a front end interface circuit having an alternating current (AC) transmission receiving mode and a direct current (DC) transmission receiving mode. The front end interface circuit includes an offset compensation circuit operable to compensate a DC voltage offset between a pair of differential signals input to the data receiver. The front end interface circuit further includes an AC/DC selection unit operable to switch between (a) the DC transmission receiving mode, and (b) the AC transmission receiving mode, such that the data receiver is operable in (i) the DC transmission mode in which the offset compensation circuit is disabled, (ii) the DC transmission mode in which the offset compensation circuit is enabled, (iii) the AC transmission mode in which the offset compensation circuit is disabled, and (iv) the AC transmission receiving mode in which the offset compensation circuit is enabled.
摘要翻译：提供一种数据接收器，其包括具有交流（AC）发送接收模式和直流（DC）发送接收模式的前端接口电路。前端接口电路包括偏移补偿电路，其可操作以补偿输入到数据接收器的一对差分信号之间的直流电压偏移。前端接口电路还包括可操作以在（a）直流发送接收模式和（b）交流发送接收模式之间切换的AC / DC选择单元，使得数据接收器可操作于（i）直流传输偏移补偿电路被禁用的模式，（ii）使能偏移补偿电路的直流传输模式，（iii）偏移补偿电路被禁用的AC传输模式，以及（iv）AC传输接收偏移补偿电路使能的模式。

5. 发明授权

US07840916B2 Structure for on-chip electromigration monitoring system 有权
标题翻译：片上电迁移监控系统结构
公开(公告)号：US07840916B2
公开(公告)日：2010-11-23
申请号：US11985966
申请日：2007-11-19
申请人： Louis L. Hsu , Hayden C. Cranford, Jr. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
发明人： Louis L. Hsu , Hayden C. Cranford, Jr. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
IPC分类号： G06F17/50
CPC分类号： G06F17/5036 , G01R31/2858
摘要： A design structure embodied in a machine readable medium used in a design process can include apparatus of a semiconductor chip operable to detect an increase in resistance of a monitored element of the semiconductor chip. The design structure can include, for example, a resistive voltage divider circuit operable to output a plurality of reference voltages having different values. A plurality of comparators in the semiconductor chip may be coupled to receive the reference voltages and a monitored voltage representative of a resistance of the monitored element. Each of the comparators may produce an output indicating whether the monitored voltage exceeds the reference voltages, so that the resistance value of the monitored element may be precisely determined.
摘要翻译：体现在设计过程中使用的机器可读介质中的设计结构可以包括半导体芯片的装置，其可操作以检测半导体芯片的被监测元件的电阻的增加。该设计结构可以包括例如可操作以输出具有不同值的多个参考电压的电阻分压器电路。可以将半导体芯片中的多个比较器耦合以接收参考电压和表示所监视元件的电阻的监视电压。每个比较器可以产生指示监视的电压是否超过参考电压的输出，使得可以精确地确定被监视元件的电阻值。

6. 发明申请

US20080123771A1 Systems and Arrangements for Controlling an Impedance on a Transmission Path 审中-公开
标题翻译：用于控制传输路径阻抗的系统和布置
公开(公告)号：US20080123771A1
公开(公告)日：2008-05-29
申请号：US11557676
申请日：2006-11-08
申请人： Hayden C. Cranford , Daniel J. Friedman , James S. Mason , Martin L. Schmatz , Michael A. Sorna , Thomas H. Toifl
发明人： Hayden C. Cranford , Daniel J. Friedman , James S. Mason , Martin L. Schmatz , Michael A. Sorna , Thomas H. Toifl
IPC分类号： H04B15/00 , H03H7/40
CPC分类号： H04L25/0278
摘要： Systems for making impedance adjustments that will auto-tune a communication path is disclosed. The method can utilize time domain reflectometry (TDR) to acquire data about impedance mismatches and can adjust the termination impedances based on the acquired data. A system is also disclosed that has an isolator to decouple a first adjustable resistor from a transmission path in a first mode and couple the first adjustable resistor to the path in a second mode. The system can have a test transmitter to create a first current on the path in the first mode and to create a second current having twice the current in a second mode, wherein a detector can detect a first voltage during the first mode and a second voltage in the second mode as the first adjustable resistive load is adjusted in the second mode until it reaches a value matching the first voltage detected in the first mode.
摘要翻译：公开了用于进行自动调谐通信路径的阻抗调整的系统。该方法可以利用时域反射（TDR）获取有关阻抗不匹配的数据，并可以根据获取的数据调整终端阻抗。还公开了一种具有隔离器的系统，用于在第一模式中将第一可调电阻器与传输路径去耦，并将第一可调电阻器以第二模式耦合到路径。该系统可以具有测试发射器，以在第一模式中在路径上产生第一电流，并且在第二模式中产生具有两倍电流的第二电流，其中检测器可以在第一模式期间检测第一电压，而第二电压在第二模式中，第一可调电阻负载在第二模式中被调节，直到达到与在第一模式中检测到的第一电压匹配的值。

7. 发明授权

US07719302B2 On-chip electromigration monitoring 有权
标题翻译：片上电迁移监测
公开(公告)号：US07719302B2
公开(公告)日：2010-05-18
申请号：US12215732
申请日：2008-06-30
申请人： Louis L. Hsu , Hayden C. Cranford, Jr. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
发明人： Louis L. Hsu , Hayden C. Cranford, Jr. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
IPC分类号： G01R31/02
CPC分类号： G01R31/2858 , G01R31/2884 , G01R31/318533
摘要： A method is provided for monitoring interconnect resistance within a semiconductor chip assembly, A semiconductor chip assembly can include a semiconductor chip having contacts exposed at a surface of the semiconductor chip and a substrate having exposed terminals in conductive communication with the contacts. A plurality of monitored elements of the semiconductor chip can include conductive interconnects, each interconnecting a respective pair of nodes of the semiconductor chip through wiring within the semiconductor chip. In an example of such method, a voltage drop across each monitored element is compared with a reference voltage drop across a respective reference element on the semiconductor chip at a plurality of different times during a lifetime of the semiconductor chip assembly. In that way, it can be detected when a resistance of such monitored element is over threshold. Based on a result of such comparison, a decision can be made whether to indicate an action condition.
摘要翻译：提供了一种用于监测半导体芯片组件内的互连电阻的方法。半导体芯片组件可以包括具有在半导体芯片的表面处露出的触点的半导体芯片和具有与触点导电连通的露出端子的基板。半导体芯片的多个受监测元件可以包括导电互连，每个导体互连通过半导体芯片内的布线互连半导体芯片的相应的一对节点。在这种方法的示例中，在半导体芯片组件的寿命期间，跨越每个被监测元件的电压降与在半导体芯片上的相应参考元件上的参考电压降在多个不同时间进行比较。以这种方式，当这种被监视的元件的电阻超过阈值时，可以检测它。基于这种比较的结果，可以做出是否指示动作条件的决定。

8. 发明申请

US20090132985A1 Design structure for on-chip electromigration monitoring system 有权
标题翻译：片上电迁移监控系统的设计结构
公开(公告)号：US20090132985A1
公开(公告)日：2009-05-21
申请号：US11985966
申请日：2007-11-19
申请人： Louis L. Hsu , Hayden C. Cranford, JR. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
发明人： Louis L. Hsu , Hayden C. Cranford, JR. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
IPC分类号： G06F17/50
CPC分类号： G06F17/5036 , G01R31/2858
摘要： A design structure embodied in a machine readable medium used in a design process can include apparatus of a semiconductor chip operable to detect an increase in resistance of a monitored element of the semiconductor chip. The design structure can include, for example, a resistive voltage divider circuit operable to output a plurality of reference voltages having different values. A plurality of comparators in the semiconductor chip may be coupled to receive the reference voltages and a monitored voltage representative of a resistance of the monitored element. Each of the comparators may produce an output indicating whether the monitored voltage exceeds the reference voltages, so that the resistance value of the monitored element may be precisely determined.
摘要翻译：体现在设计过程中使用的机器可读介质中的设计结构可以包括半导体芯片的装置，其可操作以检测半导体芯片的被监测元件的电阻的增加。该设计结构可以包括例如可操作以输出具有不同值的多个参考电压的电阻分压器电路。可以将半导体芯片中的多个比较器耦合以接收参考电压和表示所监视元件的电阻的监视电压。每个比较器可以产生指示监视的电压是否超过参考电压的输出，使得可以精确地确定被监视元件的电阻值。

9. 发明申请

US20080265931A1 On-chip electromigration monitoring 有权
标题翻译：片上电迁移监测
公开(公告)号：US20080265931A1
公开(公告)日：2008-10-30
申请号：US12215732
申请日：2008-06-30
申请人： Louis L. Hsu , Hayden C. Cranford , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
发明人： Louis L. Hsu , Hayden C. Cranford , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
IPC分类号： G01R31/26
CPC分类号： G01R31/2858 , G01R31/2884 , G01R31/318533
摘要： A method is provided for monitoring interconnect resistance within a semiconductor chip assembly. A semiconductor chip assembly can include a semiconductor chip having contacts exposed at a surface of the semiconductor chip and a substrate having exposed terminals in conductive communication with the contacts. A plurality of monitored elements of the semiconductor chip can include conductive interconnects, each interconnecting a respective pair of nodes of the semiconductor chip through wiring within the semiconductor chip. In an example of such method, a voltage drop across each monitored element is compared with a reference voltage drop across a respective reference element on the semiconductor chip at a plurality of different times during a lifetime of the semiconductor chip assembly. In that way, it can be detected when a resistance of such monitored element is over threshold. Based on a result of such comparison, a decision can be made whether to indicate an action condition.
摘要翻译：提供了一种用于监测半导体芯片组件内的互连电阻的方法。半导体芯片组件可以包括具有暴露在半导体芯片的表面处的触点的半导体芯片和具有与触点导电连通的暴露端子的基板。半导体芯片的多个受监测元件可以包括导电互连，每个导体互连通过半导体芯片内的布线互连半导体芯片的相应的一对节点。在这种方法的示例中，在半导体芯片组件的寿命期间，跨越每个被监测元件的电压降与在半导体芯片上的相应参考元件上的参考电压降在多个不同时间进行比较。以这种方式，当这种被监视的元件的电阻超过阈值时，可以检测它。基于这种比较的结果，可以做出是否指示动作条件的决定。

10. 发明授权

US07394273B2 On-chip electromigration monitoring system 有权
标题翻译：片上电迁移监控系统
公开(公告)号：US07394273B2
公开(公告)日：2008-07-01
申请号：US11306985
申请日：2006-01-18
申请人： Louis L. Hsu , Hayden C. Cranford, Jr. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
发明人： Louis L. Hsu , Hayden C. Cranford, Jr. , Oleg Gluschenkov , James S. Mason , Michael A. Sorna , Chih-Chao Yang
IPC分类号： G01R31/02
CPC分类号： G01R31/2858 , G01R31/2884 , G01R31/318533
摘要： A packaged semiconductor chip is provided which includes a semiconductor chip and a package element. The semiconductor chip includes a plurality of semiconductor devices and a plurality of conductive features disposed at an exterior face of the semiconductor chip. The package element has a plurality of external features conductively connected to the plurality of conductive features of the semiconductor chip. The semiconductor chip includes a monitored element including a conductive interconnect that conductively interconnects a first node of the semiconductor chip to a second node of the semiconductor chip. A detection circuit in the semiconductor chip is operable to compare a variable voltage drop across the monitored element with a reference voltage drop across a reference element on the chip at a plurality of different times during a lifetime of the packaged semiconductor chip so as to detect when the resistance of the monitored element is over threshold.
摘要翻译：提供一种封装的半导体芯片，其包括半导体芯片和封装元件。半导体芯片包括多个半导体器件和设置在半导体芯片的外表面处的多个导电特征。封装元件具有导电连接到半导体芯片的多个导电特征的多个外部特征。半导体芯片包括被监视的元件，该元件包括将半导体芯片的第一节点与半导体芯片的第二节点导电互连的导电互连。半导体芯片中的检测电路可操作以在封装的半导体芯片的寿命期间的多个不同时间将所监视的元件上的可变电压降与芯片上的参考元件上的参考电压降进行比较，以便检测何时被监测元件的电阻超过阈值。

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