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    • 8. 发明申请
    • CHARACTERIZATION AND VALIDATION OF PROCESSOR LINKS
    • 处理器链接的特征和验证
    • US20130103927A1
    • 2013-04-25
    • US13281081
    • 2011-10-25
    • Robert W. Berry, JR.Anand HaridassPrasanna Jayaraman
    • Robert W. Berry, JR.Anand HaridassPrasanna Jayaraman
    • G06F15/00G06F9/30
    • G06F11/3089G01R31/31926G06F9/30G06F9/30007G06F11/22G06F11/221G06F11/3409G06F11/3414G06F11/349G06F15/00
    • A processor link that couples a first processor and a second processor is selected for validation and a plurality of communication parameter settings associated with the first and the second processors is identified. The first and the second processors are successively configured with each of the communication parameter settings. One or more test data pattern(s) are provided from the first processor to the second processor in accordance with the communication parameter setting. Performance measurements associated with the selected processor link and with the communication parameter setting are determined based, at least in part, on the test data pattern as received at the second processor. One of the communication parameter settings that is associated with the highest performance measurements is selected. The selected communication parameter setting is applied to the first and the second processors for subsequent communication between the first and the second processors via the processor link.
    • 选择耦合第一处理器和第二处理器的处理器链接用于验证,并且识别与第一处理器和第二处理器相关联的多个通信参数设置。 第一和第二处理器依次配置有每个通信参数设置。 根据通信参数设置,从第一处理器向第二处理器提供一个或多个测试数据模式。 至少部分地基于在第二处理器处接收到的测试数据模式来确定与所选择的处理器链路和通信参数设置相关联的性能测量。 选择与最高性能测量值相关联的通信参数设置之一。 所选择的通信参数设置被应用于第一和第二处理器,用于经由处理器链路在第一和第二处理器之间进行后续通信。
    • 10. 发明授权
    • Design method and system for minimizing blind via current loops
    • 通过电流回路最小化设计方法和系统
    • US07765504B2
    • 2010-07-27
    • US11829179
    • 2007-07-27
    • Daniel DourietAnand HaridassAndreas HuberRoger D. Weekly
    • Daniel DourietAnand HaridassAndreas HuberRoger D. Weekly
    • G06F17/50
    • G06F17/5081H05K1/0216H05K1/115H05K3/0005H05K2201/09636
    • A design method and system for minimizing blind via current loops provides for improvement of electrical interconnect structure design without requiring extensive electromagnetic analysis. Other vias in the vicinity of a blind via carrying a critical signal are checked for suitability to conduct return current corresponding to the critical signal that is disrupted by the transition from a layer between two metal planes to another layer. The distance to the return current via(s) is checked and the design is adjusted to reduce the distance if the distance is greater than a specified threshold. If the blind via transition is to an external layer, suitable vias connect the reference plane at the internal end of the blind via to an external terminal. If the transition is between internal layers, suitable vias are vias that connect the two reference planes surrounding the reference plane traversed by the blind via.
    • 用于最小化盲通过电流回路的设计方法和系统提供了电互连结构设计的改进,而不需要广泛的电磁分析。 检查通过携带关键信号的盲目附近的其他通孔是否​​适合于进行对应于由两个金属平面之间的层到另一层之间的过渡而被破坏的关键信号的返回电流。 检查通过(s)的返回电流的距离,并且如果距离大于指定的阈值,则设计被调整以减小距离。 如果盲目通过转换到外部层,合适的通孔将盲通孔内部的参考平面连接到外部端子。 如果过渡在内层之间,合适的通孔是连接围绕由盲孔通过的参考平面的两个参考平面的通孔。