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1. 发明授权

US08711097B2 Optical navigation device with image sensor and inner housing 失效
标题翻译：具有图像传感器和内壳的光学导航装置
公开(公告)号：US08711097B2
公开(公告)日：2014-04-29
申请号：US12623420
申请日：2009-11-22
申请人： Lothar Westerweck , Stephen C. Arnold , John D. Griffith , Heidi L. Hall , Srinivas T. Rao
发明人： Lothar Westerweck , Stephen C. Arnold , John D. Griffith , Heidi L. Hall , Srinivas T. Rao
IPC分类号： G06F3/033 , G09G5/00
CPC分类号： G06F3/03543 , G02B19/0028 , G02B19/0061 , G02B19/0085 , G02B19/009 , G02B27/0977 , G06F3/042 , H04N5/2253 , H04N5/2257
摘要： An optical navigation device that can sense the movement of an object, such as a user's finger, so that the movement can control a feature of a consumer digital device such as a cursor on a display screen. The device includes a substrate to which an LED, reflector, and image sensor are attached. Light from the LED is directed by the elliptical reflector toward and through a window that is transparent to the light from the LED and then is reflected off of the user's finger back through the window, through a lens, and onto the image sensor. The reflector is positioned to direct light toward the window at an oblique angle, in the range of 65 to 70 degrees from an angle normal to the window. Further, the reflector is curved to gather light across a large solid angle in the vicinity of the LED. The curved shape of the reflector may be a portion of an ellipsoid and the LED may be located at one of the foci of the ellipsoid, with the window located at the other foci of the ellipsoid.
摘要翻译：可以感测诸如用户手指的物体的移动的光学导航装置，使得移动可以控制消费者数字设备的特征，例如显示屏幕上的光标。该装置包括附接有LED，反射器和图像传感器的基板。来自LED的光由椭圆形反射器引导并穿过对于来自LED的光是透明的窗口，然后通过透镜通过窗口从用户的手指反射回到图像传感器上。反射器被定位成以与角度垂直的角度在65至70度的范围内以倾斜角向窗户引导光。此外，反射器弯曲以在LED附近聚集大的立体角的光。反射器的弯曲形状可以是椭圆体的一部分，并且LED可以位于椭圆体的焦点之一处，窗口位于椭圆体的另一个焦点处。

2. 发明申请

US20110122060A1 OPTICAL NAVIGATION DEVICE 失效
标题翻译：光学导航装置
公开(公告)号：US20110122060A1
公开(公告)日：2011-05-26
申请号：US12623420
申请日：2009-11-22
申请人： Lothar Westerweck , Stephen C. Arnold , John D. Griffith , Heidi L. Hall , Srinivas T. Rao
发明人： Lothar Westerweck , Stephen C. Arnold , John D. Griffith , Heidi L. Hall , Srinivas T. Rao
IPC分类号： G09G5/00
CPC分类号： G06F3/03543 , G02B19/0028 , G02B19/0061 , G02B19/0085 , G02B19/009 , G02B27/0977 , G06F3/042 , H04N5/2253 , H04N5/2257
摘要： An optical navigation device that can sense the movement of an object, such as a user's finger, so that the movement can control a feature of a consumer digital device such as a cursor on a display screen. The device includes a substrate to which an LED, reflector, and image sensor are attached. Light from the LED is directed by the elliptical reflector toward and through a window that is transparent to the light from the LED and then is reflected off of the user's finger back through the window, through a lens, and onto the image sensor. The reflector is positioned to direct light toward the window at an oblique angle, in the range of 65 to 70 degrees from an angle normal to the window. Further, the reflector is curved to gather light across a large solid angle in the vicinity of the LED. The curved shape of the reflector may be a portion of an ellipsoid and the LED may be located at one of the foci of the ellipsoid, with the window located at the other foci of the ellipsoid.
摘要翻译：可以感测诸如用户手指的物体的移动的光学导航装置，使得移动可以控制消费者数字设备的特征，例如显示屏幕上的光标。该装置包括附接有LED，反射器和图像传感器的基板。来自LED的光由椭圆形反射器引导并穿过对于来自LED的光是透明的窗口，然后通过透镜通过窗口从用户的手指反射回到图像传感器上。反射器被定位成以与角度垂直的角度在65至70度的范围内以倾斜角向窗户引导光。此外，反射器弯曲以在LED附近聚集大的立体角的光。反射器的弯曲形状可以是椭圆体的一部分，并且LED可以位于椭圆体的焦点之一处，窗口位于椭圆体的另一个焦点处。

3. 发明授权

US4551212A Bath and process for the electrodeposition of micromachinable copper and additive for said bath 失效
标题翻译：用于所述浴的可微加工铜和添加剂的电沉积的浴和工艺
公开(公告)号：US4551212A
公开(公告)日：1985-11-05
申请号：US710290
申请日：1985-03-11
申请人： Srinivas T. Rao , Louis Trager
发明人： Srinivas T. Rao , Louis Trager
IPC分类号： C25D3/38
CPC分类号： C25D3/38 , Y10S534/01
摘要： It has been found that an additive comprising a mixture of phenazine dyestuffs in the combination from about 30 to 40 percent by weight of (a) a Janus Green B type dyestuff or a mixture thereof and (b) from about 70 to 60 percent by weight of Safranine T, when added to an aqueous acidic copper sulfate bath in the amount of about 0.03 to about 0.10 gram per liter of the bath, deposits copper consistently with the required properties for micromachining.
摘要翻译：已经发现，添加剂包含以下组合的吩嗪染料的混合物：约30至40重量％的（a）Janus Green B型染料或其混合物和（b）约70至60重量％的Safranine T，当加入到每升浴中约0.03至约0.10克的量的酸性硫酸铜水溶液中时，将铜一致地存在于微加工所需的性能上。

4. 发明授权

US4824481A Sputtering targets for magneto-optic films and a method for making 失效
标题翻译：磁光膜的溅射靶和制造方法
公开(公告)号：US4824481A
公开(公告)日：1989-04-25
申请号：US142363
申请日：1988-01-11
申请人： Dilip K. Chatterjee , Srinivas T. Rao
发明人： Dilip K. Chatterjee , Srinivas T. Rao
IPC分类号： B22F3/14 , C22C1/04 , C23C14/34 , H01F41/18 , B22F1/00
CPC分类号： C23C14/3414 , B22F3/14 , C22C1/0441 , H01F41/183
摘要： Sputtering targets are made by melting at least one rare earth and at least one transition metal to produce an amorphous alloy melt, forming a powder of the alloy in an oxygen free atmosphere, introducing the powdered alloy into a reducing mold, adding a layer of powdered oxygen-getter on top of the powdered alloy, and hot pressing the alloy.
摘要翻译：通过熔化至少一种稀土和至少一种过渡金属来制造溅射靶，以产生无定形合金熔体，在无氧气氛中形成合金粉末，将粉末状合金引入还原模具中，加入一层粉末状粉末合金顶部的吸氧剂，热压合金。

5. 发明授权

US4877690A Magnetooptical recording element 失效
标题翻译：磁光记录元件
公开(公告)号：US4877690A
公开(公告)日：1989-10-31
申请号：US317401
申请日：1989-03-01
申请人： David A. Glocker , Tukaram K. Hatwar , Gregory Lynn McIntire , Srinivas T. Rao , Douglas G. Stinson
发明人： David A. Glocker , Tukaram K. Hatwar , Gregory Lynn McIntire , Srinivas T. Rao , Douglas G. Stinson
IPC分类号： G11B11/105
CPC分类号： G11B11/10586 , Y10S428/928 , Y10T428/12576 , Y10T428/12611 , Y10T428/12812 , Y10T428/12931
摘要： A magnetic optical recording element including a rare earth-transition metal recording layer, a barrier layer and a self-passivating active metal layer.
摘要翻译：一种磁光记录元件，包括稀土过渡金属记录层，阻挡层和自钝化活性金属层。

6. 发明授权

US4514265A Bonding pads for semiconductor devices 失效
标题翻译：用于半导体器件的接合焊盘
公开(公告)号：US4514265A
公开(公告)日：1985-04-30
申请号：US627921
申请日：1984-07-05
申请人： Srinivas T. Rao , Frank Z. Hawrylo
发明人： Srinivas T. Rao , Frank Z. Hawrylo
IPC分类号： H01L21/288 , H01L21/60 , C25D5/02
CPC分类号： H01L24/11 , H01L21/2885 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , Y10S204/09
摘要： An improved process for electroplating bonding pads, such as of gold, onto semiconductor devices is disclosed. Upon electrically connecting a masked semiconductor body and a suitable anode to the negative and positive terminals respectively of a power supply and submerging the wafer and anode into a suitable electrolyte, a modulated, rather than direct, current is applied to the electrolyte. A low stress, fine grain bonding pad layer is provided and, unexpectedly, non-planarities in the semiconductor body surface having a depth of about 1-3 microns can be substantially planarized when the thickness of the layer deposited is about 6-8 microns or more.
摘要翻译：公开了一种用于将键合焊盘（例如金）电镀到半导体器件上的改进方法。将掩模的半导体本体和合适的阳极电连接到电源的负极和正极端子，并将晶片和阳极浸没在合适的电解液中之后，向电解质施加调制而不是直流电流。提供了低应力的细晶粒焊盘层，并且意想不到的是，当沉积的层的厚度为约6-8微米时，半导体主体表面中具有约1-3微米深度的非平面度可以基本平坦化，更多。

7. 发明授权

US4875969A Method of making a fiber optic array 失效
标题翻译：制作光纤阵列的方法
公开(公告)号：US4875969A
公开(公告)日：1989-10-24
申请号：US254756
申请日：1988-10-07
申请人： Kevin Hsu , Srinivas T. Rao , Joseph Y. Kaukeinen
发明人： Kevin Hsu , Srinivas T. Rao , Joseph Y. Kaukeinen
IPC分类号： B41J2/46 , B41J2/44 , B41J2/45 , B41J2/455 , G02B6/00 , G02B6/04 , G02B6/34 , G02B6/36 , G02B6/38
CPC分类号： G02B26/103 , G02B6/245 , G02B6/3636 , G02B6/368 , G02B6/3652 , G02B6/3692
摘要： A method is disclosed for making a fiber optic array for use in an optical scanning device. The array includes a substrate and a plurality of optical fibers arranged on the substrate to form a linear array of the fibers. Each of the fibers is received in grooves in the substrate to precisely space the fibers relative to each other. Each of the fibers is adapted to receive light from a source such as a laser diode. In order to increase the packing density of the fibers in the array, the fibers are mounted in sets of parallel grooves which are spaced to draw the fibers closer together at an output end. Further, the ends of the fibers are etched to decrease the cladding diameter and thereby permit the fiber ends to be more closely spaced relative to each other.
摘要翻译：公开了一种用于制造用于光学扫描装置的光纤阵列的方法。阵列包括基板和布置在基板上的多条光纤，以形成光纤的线性阵列。每个纤维被接收在衬底中的凹槽中以相对于彼此精确地间隔纤维。每个光纤适于接收来自诸如激光二极管的光的光。为了增加阵列中的纤维的包装密度，纤维被安装成一组平行的凹槽，这些平行的凹槽被间隔开以将纤维在输出端处靠近在一起。此外，纤维的端部被蚀刻以减小包层直径，从而允许纤维端部相对于彼此更紧密地间隔开。

8. 发明授权

US4445978A Method for fabricating via connectors through semiconductor wafers 失效
标题翻译：通过半导体晶片制造通孔连接器的方法
公开(公告)号：US4445978A
公开(公告)日：1984-05-01
申请号：US473551
申请日：1983-03-09
申请人： James C. Whartenby , Richard Brown , Srinivas T. Rao , Raymond J. Menna
发明人： James C. Whartenby , Richard Brown , Srinivas T. Rao , Raymond J. Menna
IPC分类号： C25D5/02 , H01L21/768 , H05K3/42 , C25D7/04
CPC分类号： C25D5/02 , H01L21/76898 , H05K3/423
摘要： A method is provided for fabricating a via connector from a first surface of a semiconductor wafer to an opposite second surface of the wafer. The first step consists of forming an adherent metal layer on the first surface on the semiconductor wafer. If the first surface of the semiconductor wafer has electronic components formed thereon, the metal layer is applied over the electronic components and preferably a protective layer of material is formed over the metal layer. Via holes are then laser drilled at predetermined locations through the metal layer and then through the semiconductor wafer. Thereafter a photoresist layer is applied over the first surface and exposed and developed to provide passage holes in the photoresist which are in alignment with the laser drilled apertures. The metal layer is then connected in the cathode position of the electroforming apparatus and via connectors are thereafter electroformed in the via holes.
摘要翻译：提供一种用于从半导体晶片的第一表面到晶片的相对的第二表面制造通孔连接器的方法。第一步包括在半导体晶片的第一表面上形成粘附金属层。如果半导体晶片的第一表面具有形成在其上的电子部件，则将金属层施加在电子部件上，并且优选在金属层上形成材料保护层。然后在预定位置通过金属层激光钻孔，然后穿过半导体晶片。此后，将光致抗蚀剂层施加在第一表面上并暴露并显影以在光致抗蚀剂中提供与激光钻孔相对准的通孔。然后将金属层连接在电铸装置的阴极位置，然后通孔连接器在通孔中电铸。

9. 发明授权

US4424527A Bonding pad metallization for semiconductor devices 失效
标题翻译：用于半导体器件的接合焊盘金属化
公开(公告)号：US4424527A
公开(公告)日：1984-01-03
申请号：US288857
申请日：1981-07-31
申请人： Srinivas T. Rao , Jeoffrey Mott
发明人： Srinivas T. Rao , Jeoffrey Mott
IPC分类号： H01L23/492 , H01S5/02 , H01L29/46 , H01L23/48
CPC分类号： H01L23/4924 , H01L2924/0002 , H01S2301/173 , H01S5/02236 , H01S5/02272 , H01S5/0425 , H01S5/2231
摘要： The invention is directed to a bonding pad metallization for stress sensitive semiconductor devices such as semiconductor lasers or the like. An attendant advantage is a diffusion barrier layer which inhibits the migration of conventional bonding materials such as indium solder.
摘要翻译：本发明涉及用于诸如半导体激光器等的应力敏感半导体器件的焊盘金属化。伴随的优点是阻止诸如铟焊料的常规接合材料的迁移的扩散阻挡层。

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