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1. 发明授权

US5920037A Conductive bonding design for metal backed circuits 失效
标题翻译：金属背衬电路的导电接合设计
公开(公告)号：US5920037A
公开(公告)日：1999-07-06
申请号：US855812
申请日：1997-05-12
申请人： Lisa Jeanine Jimarez , David Noel Light , Andrew Michael Seman , David Brian Stone
发明人： Lisa Jeanine Jimarez , David Noel Light , Andrew Michael Seman , David Brian Stone
IPC分类号： H05K1/11 , H05K3/00 , H05K3/32 , H05K3/38
CPC分类号： H05K3/0061 , H05K3/321 , H05K3/382 , H05K1/111 , H05K2203/025 , H05K2203/0307 , H05K2203/0315 , H05K2203/1105 , Y10T29/49144 , Y10T29/49155
摘要： The present invention provides a new device and technique for enhancing the electrical properties of the thick metal backer/adhesive bond/ground plane interface. The enhanced electrical properties are obtained by micro-roughening a connection surface of the thick metal backer prior to forming the thick metal backer/adhesive bond/ground plane interface.
摘要翻译：本发明提供了一种用于增强厚金属衬底/粘合剂接合/接地平面界面的电性能的新型装置和技术。通过在形成厚金属衬垫/粘合剂接合/接地平面界面之前，通过对粗金属衬底的连接表面进行微粗化来获得增强的电性能。

2. 发明授权

US06178630B2 Conductive bonding design and method for aluminum backed circuits 失效
标题翻译：铝背衬电路的导电接合设计和方法
公开(公告)号：US06178630B2
公开(公告)日：2001-01-30
申请号：US09228832
申请日：1999-01-12
申请人： Lisa Jeanine Jimarez , David Noel Light , Andrew Michael Seman , David Brian Stone
发明人： Lisa Jeanine Jimarez , David Noel Light , Andrew Michael Seman , David Brian Stone
IPC分类号： H05K302
CPC分类号： H05K3/0061 , H05K1/111 , H05K3/321 , H05K3/382 , H05K2203/025 , H05K2203/0307 , H05K2203/0315 , H05K2203/1105 , Y10T29/49144 , Y10T29/49155
摘要： The present invention provides a new device and technique for enhancing the electrical properties of the thick metal backer/adhesive bond/ground plane interface. The enhanced electrical properties are obtained by micro-roughening a connection surface of the thick metal backer prior to forming the thick metal backer/adhesive bond/ground plane interface.
摘要翻译：本发明提供了一种用于增强厚金属衬底/粘合剂接合/接地平面界面的电性能的新型装置和技术。通过在形成厚金属衬垫/粘合剂接合/接地平面界面之前，通过对粗金属衬底的连接表面进行微粗化来获得增强的电性能。

3. 发明授权

US6066808A Multilayer circuit board having metallized patterns formed flush with a top surface thereof 失效
标题翻译：具有金属化图案的多层电路板与其顶表面齐平
公开(公告)号：US6066808A
公开(公告)日：2000-05-23
申请号：US058908
申请日：1998-04-10
申请人： John Steven Kresge , David Noel Light
发明人： John Steven Kresge , David Noel Light
IPC分类号： H05K3/34 , H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46 , H01R9/09
CPC分类号： H05K3/4015 , H05K1/113 , H05K2201/0376 , H05K2201/096 , H05K2201/1025 , H05K2203/0278 , H05K2203/1394 , H05K3/0094 , H05K3/4007 , H05K3/4614 , Y10T29/4913 , Y10T29/49144
摘要： Pads which are attached to a high density printed circuit board (PCB) having a plurality of through-holes opening on the top surface. A plurality of pads are formed on a carrier sheet so that each of the pads have a copper layer proximate to the carrier sheet and a joining metal layer formed on top of said copper layer. The plurality of pads are positioned on the carrier sheet so that they are aligned with the through-hole pattern on the top surface of the PCB, the pads bing laminated to the through-holes on the top surface using the joining metal, and the carrier sheet being separated from the plurality of pads that are joined to the through-holes so that the copper layer is exposed. The pads may possess a variety of shapes such as disk-shaped, elongated, or rectangular, and can cover one or multiple through-holes. An electrical component may be soldered to the pad. The pad and through-hole may be compressed so that the top surface of the pad is even (flush) with the top surface of an external dielectric surface.
摘要翻译：连接到具有在顶表面上开口的多个通孔的高密度印刷电路板（PCB）的垫。多个焊盘形成在载体片上，使得每个焊盘具有靠近载体片的铜层和形成在所述铜层顶部上的接合金属层。多个焊盘定位在载体片上，使得它们与PCB的顶表面上的通孔图案对准，使用接合金属将衬垫层压到顶表面上的通孔，并且载体片与从连接到通孔的多个焊盘分开，以使铜层露出。垫可以具有各种形状，例如盘形，细长或矩形，并且可以覆盖一个或多个通孔。电气部件可以焊接到焊盘。垫和通孔可以被压缩，使得垫的顶表面与外部电介质表面的顶表面均匀（齐平）。

4. 发明申请

US20180358770A1 Electrical Connector with Electrical Contacts Protected by a Layer of Compressible Material and Method of Making It 审中-公开
公开(公告)号：US20180358770A1
公开(公告)日：2018-12-13
申请号：US15619441
申请日：2017-06-10
申请人： David Noel Light , Hung-Ming (NMI) Wang , David Rodney Baker , Peter Tho Nguyen , Dexter Shih-Wei Pao
发明人： David Noel Light , Hung-Ming (NMI) Wang , David Rodney Baker , Peter Tho Nguyen , Dexter Shih-Wei Pao
IPC分类号： H01R43/20 , H01R43/18 , H01R12/71 , H01R13/24
CPC分类号： H01R43/205 , H01R12/714 , H01R13/2442 , H01R43/18
摘要： Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

5. 发明申请

US20140273641A1 Electrical Connector with Electrical Contacts Protected by a Layer of Compressible Material and Method of Making It 审中-公开
标题翻译：具有由可压缩材料层保护的电触点的电连接器及其制造方法
公开(公告)号：US20140273641A1
公开(公告)日：2014-09-18
申请号：US13843274
申请日：2013-03-15
申请人： David Noel Light , Hung-Ming Wang , David Rodney Baker , Peter Tho Nguyen , Dexter Shih-Wei Pao
发明人： David Noel Light , Hung-Ming Wang , David Rodney Baker , Peter Tho Nguyen , Dexter Shih-Wei Pao
IPC分类号： H01R13/46 , H01R43/16
CPC分类号： H01R43/16 , H01R12/7082 , H01R12/714 , H01R12/73 , H01R13/2407 , H01R13/2442 , H05K3/281 , H05K3/285 , H05K3/4015 , H05K2201/0116 , H05K2201/0133 , H05K2201/0145 , H05K2201/015 , H05K2201/0162 , H05K2201/10189 , H05K2201/10265 , H05K2201/2036 , Y10T29/49208
摘要： Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.
摘要翻译：公开了一种电连接器，其具有基板和可移动的电触头，其安装到基板并且从基板延伸距离D。一层可压缩材料（例如泡沫或弹性体材料）被定位在邻近至少一些电触头的衬底上，并且理想地具有稍微大于距离D的未压缩厚度以提供对电触点的保护。当诸如电连接器或其他电路构件的匹配电气装置与其电触头及其可压缩材料层配合到电连接器时，可压缩材料层被压缩至小于距离D的厚度，允许触点以便与匹配的电气设备形成适当的电互连。可选择可压缩材料，其具有力至压缩图，其包括至少一个拐点，在拐点的一侧上限定第一区域，其中给定的力增量提供更大的压缩增量，并且第二区域拐点的另一侧，同样的压缩力增量提供了显着更小的压缩增量。可压缩材料可以起到防止可移动电触头损坏连接器的处理，包装，运输，组装，测试，连接和/或配合的作用。

6. 发明授权

US08641428B2 Electrical connector and method of making it 有权
标题翻译：电连接器及其制作方法
公开(公告)号：US08641428B2
公开(公告)日：2014-02-04
申请号：US13310647
申请日：2011-12-02
申请人： David Noel Light , Dinesh Sundararajan Kalakkad , Peter Tho Nguyen
发明人： David Noel Light , Dinesh Sundararajan Kalakkad , Peter Tho Nguyen
IPC分类号： H01R12/00
CPC分类号： H01R35/02 , H01R13/5219 , H05K1/0206 , H05K1/115 , H05K3/4069 , H05K3/4092 , H05K2201/068
摘要： The present invention is an electrical connector in which a substrate (such as a printed circuit board or PCB) includes a plurality of apertures (or vias) and some of those apertures are filled with two materials to improve the characteristics of the electrical interconnection. The preferred process of crating the filled vias includes the steps of plating the vias with an electrically-conductive material to create an electrically-conductive path between portions of the substrate and components associated with the substrate and partially filling the apertures, then filling at least a portion of the apertures or vias with a second or different filling material to seal at least apart of the electrically conductive path through the plating. The second filling material may be chosen to provide thermal compensation for the connection.
摘要翻译：本发明是一种电连接器，其中基板（例如印刷电路板或PCB）包括多个孔（或通孔），并且这些孔中的一些填充有两种材料以改善电互连的特性。填充通孔的优选方法包括以下步骤：用导电材料电镀通孔，以在衬底的部分和与衬底相关联的部件之间形成导电路径，并部分地填充孔，然后填充至少一个具有第二或不同填充材料的孔或通孔的一部分，以密封通过电镀的导电路径的至少一部分。可以选择第二填充材料来为连接提供热补偿。

7. 发明授权

US5736679A Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board 失效
标题翻译：用于将内部平面连接到多层电路板中的通孔的可变形互连结构
公开(公告)号：US5736679A
公开(公告)日：1998-04-07
申请号：US579618
申请日：1995-12-26
申请人： John Steven Kresge , David Noel Light , James Robert Wilcox
发明人： John Steven Kresge , David Noel Light , James Robert Wilcox
IPC分类号： H05K1/02 , H05K1/11 , H05K3/42 , H05K3/46 , H05K1/00
CPC分类号： H05K1/0271 , H05K1/116 , H05K3/4623 , H05K2201/0382 , H05K2201/09309 , H05K2201/09454 , H05K2201/0969 , H05K3/429 , Y10T29/49126
摘要： A novel through-hole interconnect for connecting a power plane conductor to a through-hole includes a central pad connected to the through-hole and a deformable hinge that connects the central pad with the power plane conductor in a multilayer circuit board. The central pad and hinge are defined by a non-continuous area removed from the plane conductor. Preferably this area has a C-shape. During the compression process to join the core assemblies, deformation of the hinge advantageously absorbs the shear forces and allows the power plane beyond the hinge to remain substantially planar. The resulting multilayer laminated circuit board includes a plurality of cores laminated together in a stacked configuration and a plurality of plated through-holes defined in said multilayer laminated circuit board each of which is connected to a plane conductor by a hinge deformed so that the interconnect area is aligned outside of a plane defined by the plane conductor. The hinged interconnect avoids shearing problems and thereby improves the reliability of the connection between the through-hole and the power plane, increasing the manufacturing yield and reducing costs. Furthermore, the hinged interconnect minimizes or eliminates internal plane distortion over the signal lines because the reference plane deformation is localized and the signal lines lie substantially outside the area of localized deformation and therefore the impedance seen by the signal lines is substantially unaffected by the compression-induced deformation.
摘要翻译：用于将电源平面导体连接到通孔的新型通孔互连件包括连接到通孔的中心焊盘和将多个电路板中的中心焊盘与电源平面导体连接的可变形铰链。中心垫和铰链由从平面导体去除的非连续区域限定。优选地，该区域具有C形。在连接芯组件的压缩过程期间，铰链的变形有利地吸收剪切力并允许超过铰链的动力平面保持基本上平面。所得到的多层叠层电路板包括层叠在一起的多个芯体和限定在所述多层叠层电路板中的多个电镀通孔，所述多个层叠电路板通过铰链变形而连接到平面导体，使得互连面积在由平面导体限定的平面外对齐。铰链互连避免了剪切问题，从而提高了通孔和动力平面之间的连接的可靠性，提高了制造成品率并降低了成本。此外，由于参考平面变形是局部化的并且信号线基本上位于局部变形区域之外，所以铰链式互连最小化或消除了信号线上的内部平面失真，因此信号线看到的阻抗基本上不受压缩 - 诱发变形。

8. 发明授权

US09680273B2 Electrical connector with electrical contacts protected by a layer of compressible material and method of making it 有权
公开(公告)号：US09680273B2
公开(公告)日：2017-06-13
申请号：US13843274
申请日：2013-03-15
申请人： David Noel Light , Hung-Ming Wang , David Rodney Baker , Peter Tho Nguyen , Dexter Shih-Wei Pao
发明人： David Noel Light , Hung-Ming Wang , David Rodney Baker , Peter Tho Nguyen , Dexter Shih-Wei Pao
IPC分类号： H01R43/16 , H01R12/70 , H01R12/73 , H01R12/71 , H01R13/24 , H05K3/28 , H05K3/40
CPC分类号： H01R43/16 , H01R12/7082 , H01R12/714 , H01R12/73 , H01R13/2407 , H01R13/2442 , H05K3/281 , H05K3/285 , H05K3/4015 , H05K2201/0116 , H05K2201/0133 , H05K2201/0145 , H05K2201/015 , H05K2201/0162 , H05K2201/10189 , H05K2201/10265 , H05K2201/2036 , Y10T29/49208
摘要： Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

9. 发明申请

US20130143420A1 Electrical Connector and Method of Making It 有权
标题翻译：电连接器及其制作方法
公开(公告)号：US20130143420A1
公开(公告)日：2013-06-06
申请号：US13310647
申请日：2011-12-02
申请人： David Noel Light , Dinesh Sundararajan Kalakkad , Peter Tho Nguyen
发明人： David Noel Light , Dinesh Sundararajan Kalakkad , Peter Tho Nguyen
IPC分类号： H01R12/00 , H01R43/16
CPC分类号： H01R35/02 , H01R13/5219 , H05K1/0206 , H05K1/115 , H05K3/4069 , H05K3/4092 , H05K2201/068
摘要： The present invention is an electrical connector in which a substrate (such as a printed circuit board or PCB) includes a plurality of apertures (or vias) and some of those apertures are filled with two materials to improve the characteristics of the electrical interconnection. The preferred process of crating the filled vias includes the steps of plating the vias with an electrically-conductive material to create an electrically-conductive path between portions of the substrate and components associated with the substrate and partially filling the apertures, then filling at least a portion of the apertures or vias with a second or different filling material to seal at least apart of the electrically conductive path through the plating. The second filling material may be chosen to provide thermal compensation for the connection.
摘要翻译：本发明是一种电连接器，其中基板（例如印刷电路板或PCB）包括多个孔（或通孔），并且这些孔中的一些填充有两种材料以改善电互连的特性。填充通孔的优选方法包括以下步骤：用导电材料电镀通孔，以在衬底的部分和与衬底相关联的部件之间形成导电路径，并部分地填充孔，然后填充至少一个具有第二或不同填充材料的孔或通孔的一部分，以密封通过电镀的导电路径的至少一部分。可以选择第二填充材料来为连接提供热补偿。

10. 发明授权

US5829124A Method for forming metallized patterns on the top surface of a printed circuit board 失效
标题翻译：在印刷电路板的顶表面上形成金属化图案的方法
公开(公告)号：US5829124A
公开(公告)日：1998-11-03
申请号：US580678
申请日：1995-12-29
申请人： John Steven Kresge , David Noel Light
发明人： John Steven Kresge , David Noel Light
IPC分类号： H05K3/34 , H05K1/11 , H05K3/00 , H05K3/40 , H05K3/46
CPC分类号： H05K3/4015 , H05K1/113 , H05K2201/0376 , H05K2201/096 , H05K2201/1025 , H05K2203/0278 , H05K2203/1394 , H05K3/0094 , H05K3/4007 , H05K3/4614 , Y10T29/4913 , Y10T29/49144
摘要： A method for attaching pads to a high density printed circuit board (PCB) having a plurality of through-holes opening on the top surface. The method includes forming a plurality of pads on a carrier sheet so that each of said pads have a copper layer proximate to said carrier sheet and a joining metal layer formed on top of said copper layer, positioning the plurality of pads on the carrier sheet so that they are aligned with the through-hole pattern on the top surface of the PCB, laminating the pads to the through-holes on the top surface using the joining metal, and separating the carrier sheet from the plurality of pads that are joined to the through-holes so that the copper layer is exposed. The pads may comprise a variety of shapes such as disk-shaped, elongated, or rectangular, and can cover one or multiple through-holes. An electrical component may be soldered to the pad. The method advantageously prevents wicking of the solderball volume into the through-hole, thereby increasing yield and part reliability. In one embodiment, the pad and through-hole may be compressed so that the top surface of the pad is even (flush) with the top surface of the external dielectric surface.
摘要翻译：一种用于将焊盘附接到具有在顶表面上开口的多个通孔的高密度印刷电路板（PCB）的方法。该方法包括在载体片上形成多个焊盘，使得每个焊盘具有靠近所述载体片的铜层和形成在所述铜层顶部的接合金属层，将多个焊盘定位在载体片上它们与PCB的顶表面上的通孔图案对准，使用接合金属将焊盘层压到顶表面上的通孔，并将载体片从与多个焊盘接合的多个焊盘分离通孔使铜层露出。垫可以包括各种形状，例如盘形，细长或矩形，并且可以覆盖一个或多个通孔。电气部件可以焊接到焊盘。该方法有利地防止了焊球体积进入通孔，从而提高了产量和部件的可靠性。在一个实施例中，垫和通孔可以被压缩，使得垫的顶表面与外部电介质表面的顶表面均匀（齐平）。

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