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1. 发明授权

US08729591B2 Opto-electronic device package with a semiconductor-based sub-mount having SMD metal contacts 有权
标题翻译：具有半导体基座的光电器件封装，具有SMD金属触点
公开(公告)号：US08729591B2
公开(公告)日：2014-05-20
申请号：US12426796
申请日：2009-04-20
申请人： Jochen Kuhmann , Lior Shiv
发明人： Jochen Kuhmann , Lior Shiv
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Non-planar via designs for sub-mounts on which to mount a LED or other optoelectronic device include a continuous layer of metal to conduct the current from the front-side (e.g., LED side) to the backside (e.g., SMD side) through the via and to provide a sufficiently stable and reliable under bump metallization for SMD soldering. Each UBM can be structured so that it does not fully cover the sidewall surfaces of the via that forms the front-to-backside interconnect. In some implementations, each via structure for the feedthrough metallization extends to a respective side-edge of the sub-mount.
摘要翻译：用于安装LED或其他光电子器件的子安装座的非平面通孔设计包括连续的金属层，以将电流从前侧（例如，LED侧）传导到背面（例如，SMD侧）通孔，并为SMD焊接提供足够稳定和可靠的凸块下金属化。每个UBM可以被构造成使得其不完全覆盖形成前后互连的通孔的侧壁表面。在一些实施方案中，用于馈通金属化的每个通孔结构延伸到子安装座的相应侧边缘。

2. 发明申请

US20070120041A1 Sealed Package With Glass Window for Optoelectronic Components, and Assemblies Incorporating the Same 审中-公开
标题翻译：用于光电元件玻璃窗的密封封装及其组合
公开(公告)号：US20070120041A1
公开(公告)日：2007-05-31
申请号：US11558175
申请日：2006-11-09
申请人： Lior Shiv , Jochen Kuhmann
发明人： Lior Shiv , Jochen Kuhmann
IPC分类号： C12Q1/68 , H01L23/02
CPC分类号： H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L33/44 , H01L33/483 , H01L2924/16235
摘要： A package includes one or more optoelectronic components and a cap with an embedded glass window attached to a substrate. The optoelectronic component(s) is supported by the substrate and is capable of detecting or emitting light through the glass window. The glass window may serve as an optical filter. Techniques are disclosed for fabricating a relatively thin package with an embedded glass window in the cap.
摘要翻译：包装包括一个或多个光电子部件和具有附接到基板的嵌入式玻璃窗的盖。光电子部件由衬底支撑并且能够通过玻璃窗检测或发射光。玻璃窗可以用作滤光器。公开了用于制造具有在盖中的嵌入式玻璃窗的相对薄的包装的技术。

3. 发明授权

US07732234B2 Fabrication process for package with light emitting device on a sub-mount 有权
标题翻译：带有发光器件的封装在子座上的制造工艺
公开(公告)号：US07732234B2
公开(公告)日：2010-06-08
申请号：US11675179
申请日：2007-02-15
申请人： Christoffer Graae Greisen , Matthias Heschel , Lior Shiv , Steen Weichel
发明人： Christoffer Graae Greisen , Matthias Heschel , Lior Shiv , Steen Weichel
IPC分类号： H01L21/00 , H01L21/50 , H01L21/48 , H01L21/44
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48235 , H01L2224/73265 , H01L2924/10253 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A method of fabricating a package with a light emitting device includes depositing a first metallization to form a conductive pad on which the light emitting device is to be mounted and to form one or more feed-through interconnections extending through a semiconductor material that supports the conductive pad. Subsequently, a second metallization is deposited to form a reflective surface for reflecting light, emitted by the light emitting device, through a lid of the package. Deposition of the second metallization is de-coupled from deposition of the first metallization.
摘要翻译：制造具有发光器件的封装的方法包括沉积第一金属化以形成其上将要安装发光器件的导电焊盘，并且形成延伸穿过支撑导电的半导体材料的一个或多个馈通互连垫。随后，沉积第二金属化以形成用于通过封装的盖反射由发光器件发射的光的反射表面。第二金属化的沉积与第一金属化的沉积脱耦合。

4. 发明授权

US07531445B2 Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane 有权
标题翻译：使用薄介电膜形成贯通晶片电互连和其他结构
公开(公告)号：US07531445B2
公开(公告)日：2009-05-12
申请号：US11669664
申请日：2007-01-31
申请人： Lior Shiv
发明人： Lior Shiv
IPC分类号： H01L21/4763
CPC分类号： H01L23/04 , H01L21/486 , H01L21/76898 , H01L23/10 , H01L23/481 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： Providing through-wafer interconnections in a semiconductor wafer includes forming a sacrificial membrane in a pre-existing semiconductor wafer, depositing metallization over one side of the wafer so as to cover exposed portions of the sacrificial membrane facing the one side of the wafer, removing exposed portions of the sacrificial membrane facing the other side of the wafer, and depositing metallization over the other side of the wafer so as to contact the previously deposited metallization. Techniques also are disclosed for providing capacitive and other structures using thin metal membranes.
摘要翻译：在半导体晶片中提供跨晶片互连包括在预先存在的半导体晶片中形成牺牲膜，在晶片的一侧上沉积金属化，以便覆盖面向晶片一侧的牺牲膜的暴露部分，牺牲膜的部分面向晶片的另一侧，并且在晶片的另一侧上沉积金属化以便接触先前沉积的金属化。公开了用于使用薄金属膜提供电容和其它结构的技术。

5. 发明授权

US07470622B2 Fabrication and use of polished silicon micro-mirrors 有权
标题翻译：抛光硅微镜的制造和使用
公开(公告)号：US07470622B2
公开(公告)日：2008-12-30
申请号：US11156170
申请日：2005-06-17
申请人： Lior Shiv
发明人： Lior Shiv
IPC分类号： H01L21/302
CPC分类号： G02B5/0808 , G02B26/0833
摘要： A method of fabricating silicon micro-mirrors includes etching from opposite sides of a silicon wafer with a polished surface on at least one of the opposite sides, to form silicon bars each having a parallelogram-shaped cross-section and including a portion of the polished surface. At least one of the silicon bars is mounted on a mounting surface. The polished surface of the silicon bar may be used to reflect optical signals.
摘要翻译：制造硅微反射镜的方法包括在至少一个相对侧上具有抛光表面的硅晶片的相对侧进行蚀刻，以形成每个具有平行四边形形状的横截面并且包括抛光的部分的硅棒表面。至少一个硅棒安装在安装表面上。硅棒的抛光表面可以用于反射光信号。

6. 发明授权

US07211929B2 Multilayer piezoelectric motor 有权
标题翻译：多层压电电机
公开(公告)号：US07211929B2
公开(公告)日：2007-05-01
申请号：US11397371
申请日：2006-04-04
申请人： Ze'ev Ganor , Izhak Rafaeli , Lior Shiv , Nir Karasikov
发明人： Ze'ev Ganor , Izhak Rafaeli , Lior Shiv , Nir Karasikov
IPC分类号： H01L41/08
CPC分类号： H01L41/0913 , H01L41/083 , H02N2/004 , H02N2/0075
摘要： A method for accelerating or decelerating a moveable body which body is moved by urging a piezoelectric micromotor to the body in a first direction so that a contact region of the piezoelectric motor is pressed to the body and exciting vibrations in the piezoelectric micromotor at the contact region in the first direction and in a second direction along a direction of motion of the body, said vibrations having a first amplitude in the first direction and a second amplitude in the second direction, the method comprising: a) for acceleration, gradually changing a ratio between the second amplitude relative to the first amplitude from substantially zero to a desired non-zero value; or b) for deceleration, gradually changing the ratio between the second amplitude relative to the first amplitude from a non-zero value to substantially zero.
摘要翻译：一种用于通过在第一方向上将压电微型马达推向主体而使身体移动的方法，使得压电马达的接触区域被压向身体并且在接触区域中激发压电微型马达的振动沿着主体的运动方向在第一方向和第二方向上，所述振动在第一方向上具有第一幅度，在第二方向上具有第二幅度，该方法包括：a）为了加速，逐渐改变比例在相对于第一幅度的第二幅度从基本上为零到期望的非零值之间; 或b）用于减速，逐渐地将相对于第一幅度的第二幅度之间的比例从非零值变化到基本为零。

7. 发明申请

US20100015734A1 Formation of Through-Wafer Electrical Interconnections and Other Structures Using a Thin Dielectric Membrane 有权
标题翻译：通过薄膜电介质膜形成穿透电子互连和其他结构
公开(公告)号：US20100015734A1
公开(公告)日：2010-01-21
申请号：US12566136
申请日：2009-09-24
申请人： Lior Shiv
发明人： Lior Shiv
IPC分类号： H01L21/66
CPC分类号： H01L23/04 , H01L21/486 , H01L21/76898 , H01L23/10 , H01L23/481 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： Providing through-wafer interconnections in a semiconductor wafer includes forming a sacrificial membrane in a preexisting semiconductor wafer, depositing metallization over one side of the wafer so as to cover exposed portions of the sacrificial membrane facing the one side of the wafer, removing exposed portions of the sacrificial membrane facing the other side of the wafer, and depositing metallization over the other side of the wafer so as to contact the previously deposited metallization. Techniques also are disclosed for providing capacitive and other structures using thin metal membranes.
摘要翻译：在半导体晶片中提供贯穿晶片的互连包括在预先存在的半导体晶片中形成牺牲膜，在晶片的一侧上沉积金属化，以覆盖面向晶片一侧的牺牲膜的暴露部分，牺牲膜面向晶片的另一侧，并且在晶片的另一侧上沉积金属化，以便接触先前沉积的金属化。公开了用于使用薄金属膜提供电容和其它结构的技术。

8. 发明申请

US20080076195A1 FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER STRUCTURES USING A THIN DIELECTRIC MEMBRANE 有权
标题翻译：通过电介质薄膜形成通孔电气互连和其他结构
公开(公告)号：US20080076195A1
公开(公告)日：2008-03-27
申请号：US11669664
申请日：2007-01-31
申请人： Lior Shiv
发明人： Lior Shiv
IPC分类号： H01L21/4763 , H01L21/66
CPC分类号： H01L23/04 , H01L21/486 , H01L21/76898 , H01L23/10 , H01L23/481 , H01L23/49827 , H01L2924/0002 , H01L2924/00
摘要： Providing through-wafer interconnections in a semiconductor wafer includes forming a sacrificial membrane in a pre-existing semiconductor wafer, depositing metallization over one side of the wafer so as to cover exposed portions of the sacrificial membrane facing the one side of the wafer, removing exposed portions of the sacrificial membrane facing the other side of the wafer, and depositing metallization over the other side of the wafer so as to contact the previously deposited metallization. Techniques also are disclosed for providing capacitive and other structures using thin metal membranes.
摘要翻译：在半导体晶片中提供跨晶片互连包括在预先存在的半导体晶片中形成牺牲膜，在晶片的一侧上沉积金属化，以便覆盖面向晶片一侧的牺牲膜的暴露部分，牺牲膜的部分面向晶片的另一侧，并且在晶片的另一侧上沉积金属化以便接触先前沉积的金属化。公开了用于使用薄金属膜提供电容和其它结构的技术。

9. 发明授权

US07199507B2 Piezoelectric motors and motor driving configurations 失效
标题翻译：压电电机和电机驱动配置
公开(公告)号：US07199507B2
公开(公告)日：2007-04-03
申请号：US11223430
申请日：2005-09-08
申请人： Ze'ev Ganor , Lior Shiv , Nir Karasikov , Alon Avital
发明人： Ze'ev Ganor , Lior Shiv , Nir Karasikov , Alon Avital
IPC分类号： H02N2/00
CPC分类号： B26B19/28 , H01L41/0913 , H02N2/003 , H02N2/004 , H02N2/006 , H02N2/026 , H02N2/103
摘要： A piezoelectric motor comprising: a piezoelectric vibrator having an axis of symmetry and a first vibration mode, which when excited generates oscillatory motion of mass points in the vibrator parallel to the axis of symmetry; and at least one friction nub having a center of mass displaced from the axis of symmetry, as a result of which displacement, when the vibration mode is excited, torque is generated on the vibrator that excites a second vibration mode of the vibrator.
摘要翻译：一种压电电动机，包括：具有对称轴和第一振动模式的压电振动器，其当被激励时产生平行于对称轴的振动器中的质点的振荡运动; 以及至少一个具有从对称轴线偏移的质心的摩擦块，其结果是当振动模式被激发时，在振动器上产生激励振动器的第二振动模式的转矩。

10. 发明授权

US07183690B2 Resonance shifting 失效
标题翻译：共振转换
公开(公告)号：US07183690B2
公开(公告)日：2007-02-27
申请号：US11103353
申请日：2005-04-11
申请人： Lior Shiv , Izhak Rafaeli , Ze′ev Ganor , Nir Karasikov , Hanna Dodiuk-Kenig
发明人： Lior Shiv , Izhak Rafaeli , Ze′ev Ganor , Nir Karasikov , Hanna Dodiuk-Kenig
IPC分类号： H01L41/08
CPC分类号： H01L41/253 , H01L41/0913
摘要： A piezoelectric vibrator comprising: a thin rectangular piezoelectric plate formed of a material having a Young's modulus having two short edge surfaces and two long edge surfaces and two large planar face surfaces which plate has transverse resonant vibration modes parallel to its short edges and longitudinal resonant vibration modes parallel to its long edges and is formed with at least one cavity; and at least one electrode on each of the planar surfaces that is electrifiable to excite at least one vibration mode of the plate, wherein the at least one cavity is not filled with a material having a Young's modulus substantially equal to the Young's modulus of the material from which the plate is formed, such that the presence of the at least one cavity shifts a resonant frequency of at least one vibration mode of the plate with respect to the resonant frequency that characterizes the at least one vibration mode in the absence of the at least one cavity.
摘要翻译：一种压电振动器，包括：由具有两个短边缘表面和两个长边缘表面的杨氏模量的材料形成的薄矩形压电板，以及两个大的平面表面，其具有平行于其短边缘的横向共振振动模式和纵向谐振振动与其长边平行的模具，并形成有至少一个空腔; 以及每个所述平坦表面上的至少一个电极，所述至少一个电极可充电以激发所述板的至少一个振动模式，其中所述至少一个腔未填充具有基本上等于所述材料的杨氏模量的杨氏模量的材料由此形成板，使得至少一个空腔的存在使得板的至少一个振动模式的谐振频率相对于在没有at的情况下表征至少一个振动模式的谐振频率至少一个腔。

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