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    • 10. 发明申请
    • Mold-casting structure and improvement method for grounding of the same
    • 铸造结构及其接地改良方法
    • US20060254042A1
    • 2006-11-16
    • US11194542
    • 2005-08-02
    • Wen ChouLan Yang
    • Wen ChouLan Yang
    • B21B1/46B22D27/00
    • B22D17/22Y10T29/4998Y10T29/49995
    • A mold-casting structure comprises at least one dishing and a plurality of micro-protrusions. The dishing(s) formed on the surface of a mold-casting body, the plurality of micro-protrusions sticking out of the surface of the dishing, and the tops of the micro-protrusions constitute on a plane, so that the grounding issue of the circuitry embedded in the mold-casting structure caused by the dishing can be resolved. The dishing can be verified by daubing paint and scrapping thereafter, the location of remaining paint is deemed the dishing. Moreover, a three-dimensional measurement instrument can be employed for more precise measurement. The micro-protrusions can be formed on the dishing by mechanical processing or electric discharge machining (EDM). Alternatively, a mold with a structure matching the micro-protrusions can be formed first, and consequently the micro-protrusions are formed directly by mold-filling, which is more suitable for mass production.
    • 模铸结构包括至少一个凹陷和多个微突起。 在铸模体的表面上形成的凹陷,从凹部表面突出的多个微突起和微突起的顶部构成在平面上,使得接地问题 可以解决由凹陷引起的嵌入铸模结构中的电路。 可以通过涂抹油漆和报废来验证凹坑,剩余油漆的位置被认为是凹陷。 此外,可以采用三维测量仪器进行更精确的测量。 微型突起可以通过机械加工或放电加工(EDM)在凹陷上形成。 或者,可以首先形成具有与微突起匹配的结构的模具,因此微型突起直接通过更适合批量生产的模具填充形成。